JPH01135769U - - Google Patents
Info
- Publication number
- JPH01135769U JPH01135769U JP3107588U JP3107588U JPH01135769U JP H01135769 U JPH01135769 U JP H01135769U JP 3107588 U JP3107588 U JP 3107588U JP 3107588 U JP3107588 U JP 3107588U JP H01135769 U JPH01135769 U JP H01135769U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- bonding material
- pressure bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3107588U JPH01135769U (enExample) | 1988-03-08 | 1988-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3107588U JPH01135769U (enExample) | 1988-03-08 | 1988-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135769U true JPH01135769U (enExample) | 1989-09-18 |
Family
ID=31256677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3107588U Pending JPH01135769U (enExample) | 1988-03-08 | 1988-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135769U (enExample) |
-
1988
- 1988-03-08 JP JP3107588U patent/JPH01135769U/ja active Pending