JPH01135750U - - Google Patents
Info
- Publication number
- JPH01135750U JPH01135750U JP1988030420U JP3042088U JPH01135750U JP H01135750 U JPH01135750 U JP H01135750U JP 1988030420 U JP1988030420 U JP 1988030420U JP 3042088 U JP3042088 U JP 3042088U JP H01135750 U JPH01135750 U JP H01135750U
- Authority
- JP
- Japan
- Prior art keywords
- reflecting mirror
- lead
- light
- bank
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030420U JPH01135750U (OSRAM) | 1988-03-09 | 1988-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030420U JPH01135750U (OSRAM) | 1988-03-09 | 1988-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01135750U true JPH01135750U (OSRAM) | 1989-09-18 |
Family
ID=31255471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988030420U Pending JPH01135750U (OSRAM) | 1988-03-09 | 1988-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01135750U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594603A (zh) * | 2013-10-30 | 2014-02-19 | 王定锋 | 一种新型的smd-led支架、贴片型led及其制造方法 |
-
1988
- 1988-03-09 JP JP1988030420U patent/JPH01135750U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594603A (zh) * | 2013-10-30 | 2014-02-19 | 王定锋 | 一种新型的smd-led支架、贴片型led及其制造方法 |