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Filing date
Publication date
Application filedfiledCritical
Priority to JP1988032236UpriorityCriticalpatent/JPH01135744U/ja
Publication of JPH01135744UpublicationCriticalpatent/JPH01135744U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
H01L2224/732—Location after the connecting process
H01L2224/73251—Location after the connecting process on different surfaces
H01L2224/73253—Bump and layer connectors
Landscapes
Cooling Or The Like Of Electrical Apparatus
(AREA)