JPH01133762U - - Google Patents
Info
- Publication number
- JPH01133762U JPH01133762U JP3009288U JP3009288U JPH01133762U JP H01133762 U JPH01133762 U JP H01133762U JP 3009288 U JP3009288 U JP 3009288U JP 3009288 U JP3009288 U JP 3009288U JP H01133762 U JPH01133762 U JP H01133762U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- copper foil
- pair
- foil patterns
- elongated hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3009288U JPH01133762U (fr) | 1988-03-07 | 1988-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3009288U JPH01133762U (fr) | 1988-03-07 | 1988-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133762U true JPH01133762U (fr) | 1989-09-12 |
Family
ID=31254848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3009288U Pending JPH01133762U (fr) | 1988-03-07 | 1988-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133762U (fr) |
-
1988
- 1988-03-07 JP JP3009288U patent/JPH01133762U/ja active Pending