JPH01133744U - - Google Patents
Info
- Publication number
- JPH01133744U JPH01133744U JP17009987U JP17009987U JPH01133744U JP H01133744 U JPH01133744 U JP H01133744U JP 17009987 U JP17009987 U JP 17009987U JP 17009987 U JP17009987 U JP 17009987U JP H01133744 U JPH01133744 U JP H01133744U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bending die
- receiving piece
- cutting
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 8
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17009987U JPH01133744U (nl) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17009987U JPH01133744U (nl) | 1987-11-09 | 1987-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01133744U true JPH01133744U (nl) | 1989-09-12 |
Family
ID=31460740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17009987U Pending JPH01133744U (nl) | 1987-11-09 | 1987-11-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01133744U (nl) |
-
1987
- 1987-11-09 JP JP17009987U patent/JPH01133744U/ja active Pending