JPH01131570U - - Google Patents
Info
- Publication number
- JPH01131570U JPH01131570U JP2902688U JP2902688U JPH01131570U JP H01131570 U JPH01131570 U JP H01131570U JP 2902688 U JP2902688 U JP 2902688U JP 2902688 U JP2902688 U JP 2902688U JP H01131570 U JPH01131570 U JP H01131570U
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- base material
- oversheet
- card base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案のＩＣカード要部断面図であり
、第２図は本考案の他の実施例のＩＣカード要部
断面図であり、第３図は一般的なＩＣカードの外
観の斜視図であり、第４図は従来のＩＣカードの
要部断面図である。
１……ＩＣカード、２……ＩＣモジユール、４
……カード基材、５……センターコアシート、６
，７……オーバーシート、３，９，９′……補強
シート。
Fig. 1 is a sectional view of the main parts of an IC card of the present invention, Fig. 2 is a sectional view of the main parts of an IC card of another embodiment of the invention, and Fig. 3 is a perspective view of the external appearance of a general IC card. FIG. 4 is a sectional view of a main part of a conventional IC card. 1...IC card, 2...IC module, 4
... Card base material, 5 ... Center core sheet, 6
, 7... Over sheet, 3, 9, 9'... Reinforcement sheet.
Claims (1)
ーバーシートからなるカード基材にＩＣモジユー
ルが埋設されてなるＩＣカードにおいて、前記Ｉ
Ｃモジユールとオーバーシートの間に少なくとも
ＩＣモジユール及びその周縁部を含み、カード基
材と同一の樹脂からなる繊維強化された補強シー
トを介在せしめたことを特徴とするＩＣカード。 In an IC card in which an IC module is embedded in a card base material consisting of a center core sheet and an oversheet laminated on both sides thereof, the I
An IC card characterized in that a fiber-reinforced reinforcing sheet, which includes at least an IC module and its periphery and is made of the same resin as the card base material, is interposed between the C module and the oversheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2902688U JPH01131570U (en) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2902688U JPH01131570U (en) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01131570U true JPH01131570U (en) | 1989-09-06 |
Family
ID=31252871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2902688U Pending JPH01131570U (en) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01131570U (en) |
-
1988
- 1988-03-04 JP JP2902688U patent/JPH01131570U/ja active Pending
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