JPH01131438A - Inspection instrument for terminal nonsoldering - Google Patents
Inspection instrument for terminal nonsolderingInfo
- Publication number
- JPH01131438A JPH01131438A JP28992287A JP28992287A JPH01131438A JP H01131438 A JPH01131438 A JP H01131438A JP 28992287 A JP28992287 A JP 28992287A JP 28992287 A JP28992287 A JP 28992287A JP H01131438 A JPH01131438 A JP H01131438A
- Authority
- JP
- Japan
- Prior art keywords
- reflecting mirror
- light
- nonsoldering
- optical sensor
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 2
- 230000001902 propagating effect Effects 0.000 abstract 1
- 206010048669 Terminal state Diseases 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、多ビンＬＳＩの端子の半田付けの良否を試験
する装置に関し、特に未半田に関する検出装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for testing the quality of soldering of terminals of a multi-bin LSI, and particularly to a device for detecting unsoldered terminals.
従来、多ビンＬＳＩの未半田の有無については人間の目
視による方式がほとんどであった。また端子が面で分布
している形状でかつスルーホールを用いないで基板の上
面に押し当てて実装する方式の場合、内部の端子の未半
田の有無は不可能であった。Conventionally, the presence or absence of unsoldered parts in multi-bin LSIs has mostly been determined by human visual inspection. Furthermore, in the case of a method in which the terminals are distributed over a surface and are mounted by pressing them against the top surface of the board without using through holes, it is impossible to check whether or not there are unsoldered internal terminals.
上述した従来の方式は、目視によりその有無を確認する
為、その正確さに欠け、また、内部の端子状態が直接見
ることは出来ないという欠点がある。The above-mentioned conventional method lacks accuracy because the presence or absence is visually confirmed, and also has the disadvantage that the internal terminal state cannot be directly observed.
本発明の端子未半田検出装置は、安定で位相の揃ってい
る光源としてのレーザー発振器と被試験物に直接取り付
けられた全反射鏡と、レーザー光を被試験物に導く同時
にその反射光を光センサに導く為の光学系としての全反
射鏡と、半反射鏡と光の強弱を電気信号に変換する光セ
ンサと、光センサにより得られた信号の増幅する為の増
幅器と、増幅器より得られた信号の波形を分析する波形
分析装置と、分析により得られた情報を蓄積する記憶装
置と被試験素子に衝撃を得えるハンマを有している。The unsoldered terminal detection device of the present invention consists of a laser oscillator as a stable and phase-aligned light source, a total reflection mirror directly attached to the test object, and a laser beam guided to the test object while simultaneously directing the reflected light to the test object. A total reflection mirror as an optical system to guide the light to the sensor, a semi-reflection mirror, an optical sensor that converts the intensity of light into an electrical signal, an amplifier to amplify the signal obtained by the optical sensor, and a signal obtained from the amplifier. It has a waveform analyzer that analyzes the waveform of a signal, a storage device that stores information obtained from the analysis, and a hammer that can apply an impact to the device under test.
未半田の端子は、一端を固定した棒であるから、外部か
ら衝撃的な外力により振動を励起すると、固有振動数の
周期を有する減衰振動を生じる。この振動は被試験物に
取り付けられた全反射鏡に伝搬され、この振動がレーザ
ー光を変調することになり、この強弱の変化により、未
半田の有無が検出可能となる。Since the unsoldered terminal is a rod with one end fixed, when vibration is excited by an external impact force, damped vibration having a period of the natural frequency is generated. This vibration is propagated to a total reflection mirror attached to the test object, and this vibration modulates the laser beam, and the presence or absence of unsoldered material can be detected by this change in intensity.
第１図は本発明の一実施例である。レーザー発振器１は
安定で位相の揃った光源として単色光を供給する。レー
ザー発振器１を出た光は半反射鏡３に達して２つの光路
に分波され、一方は全反射鏡２を経由して再び半反射鏡
３を通過して光センサ９に達する。さらに一方は半反射
鏡３をそのまま通過して全反射鏡４を経由し、被試験素
子６に直接取り付けられた全反射鏡５に達する。この光
は全反射鏡５により反射され全反射鏡４を経由して半反
射鏡３により反射されて光センサ９に達する。従って、
光路の異なる２つの光が光センサ９に印加されることに
なるがハンマ７により励起された被試験素子６の振動が
一方の光を変調する為光センサ９の部分で２つの光の干
渉により強弱となって観測される。光センサ９で得られ
た信号は増幅器１０により増幅され、波形分析装置１１
に印加され、振動の情報が分析される。その結果は記憶
装置１２に蓄積される。外部よりこの情報を読むことに
より、未半田の有無の検出が可能とな。FIG. 1 shows an embodiment of the present invention. The laser oscillator 1 supplies monochromatic light as a stable and phase-aligned light source. The light emitted from the laser oscillator 1 reaches the semi-reflecting mirror 3 and is split into two optical paths, one of which passes through the total reflecting mirror 2, passes through the semi-reflecting mirror 3 again, and reaches the optical sensor 9. Furthermore, one side passes through the semi-reflecting mirror 3 as it is, passes through the total reflecting mirror 4, and reaches the total reflecting mirror 5 directly attached to the device under test 6. This light is reflected by the total reflection mirror 5, passes through the total reflection mirror 4, is reflected by the half reflection mirror 3, and reaches the optical sensor 9. Therefore,
Two lights with different optical paths are applied to the optical sensor 9, but since the vibration of the device under test 6 excited by the hammer 7 modulates one of the lights, interference between the two lights occurs at the optical sensor 9. It is observed as being stronger or weaker. The signal obtained by the optical sensor 9 is amplified by an amplifier 10, and a waveform analyzer 11
vibration information is analyzed. The results are stored in storage device 12. By reading this information from the outside, it is possible to detect the presence or absence of unsoldered material.
る。Ru.
以上説明した様に本発明は、端子の固有振動を非接触に
より検出することが可能である為、直接目視で確認出来
ない内部の端子の未半田状態を確認することが可能とな
る。As described above, the present invention allows the natural vibration of the terminal to be detected in a non-contact manner, so it is possible to confirm the unsoldered state of the internal terminal, which cannot be confirmed directly with the naked eye.
第１図は本発明の構成示す図である。
１・・・・・・レーザー発振器、２・・・・・・全反射
鏡、３・・・・・・半反射鏡、４・・・・・・全反射鏡
、訃・・・・・全反射鏡、６・・・・・・被試験素子、
７・・・・・・ハンマ、８・・・・・・ＰＷＢ。
代理人 弁理士 内 原 晋FIG. 1 is a diagram showing the configuration of the present invention. 1... Laser oscillator, 2... Totally reflecting mirror, 3... Half reflecting mirror, 4... Totally reflecting mirror, Death... Totally reflecting mirror. Reflector, 6... Element under test,
7...Hammer, 8...PWB. Agent Patent Attorney Susumu Uchihara
Claims (1)
と被試験物に直接取り付けられた全反射鏡と、レーザー
光を被試験物に導くと同時にその反射光を光センサに導
く為の光学系としての全反射鏡と半反射鏡と光の強弱を
電気信号に変える光センサと、光センサより得られた信
号の増幅する為の増幅器と、増幅器より得られた信号の
波形を分析する波形分析装置と、分析により得られた情
報を蓄積する記憶装置と、被試験素子に衝撃を得えるハ
ンマを有する端子未半田検出装置。A laser oscillator as a stable and phase-aligned light source, a total reflection mirror attached directly to the test object, and an optical system that guides the laser beam to the test object and at the same time guides the reflected light to the optical sensor. A total reflection mirror, a semi-reflection mirror, an optical sensor that converts the intensity of light into an electrical signal, an amplifier for amplifying the signal obtained from the optical sensor, and a waveform analyzer that analyzes the waveform of the signal obtained from the amplifier. , an unsoldered terminal detection device that has a storage device that stores information obtained through analysis, and a hammer that can apply an impact to the device under test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28992287A JPH01131438A (en) | 1987-11-16 | 1987-11-16 | Inspection instrument for terminal nonsoldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28992287A JPH01131438A (en) | 1987-11-16 | 1987-11-16 | Inspection instrument for terminal nonsoldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01131438A true JPH01131438A (en) | 1989-05-24 |
Family
ID=17749503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28992287A Pending JPH01131438A (en) | 1987-11-16 | 1987-11-16 | Inspection instrument for terminal nonsoldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01131438A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179705A (en) * | 2004-12-22 | 2006-07-06 | Kokusai Electric Semiconductor Service Inc | Method and apparatus for determining element shape of substrate, and determination system for substrate element shape during semiconductor manufacturing process |
-
1987
- 1987-11-16 JP JP28992287A patent/JPH01131438A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179705A (en) * | 2004-12-22 | 2006-07-06 | Kokusai Electric Semiconductor Service Inc | Method and apparatus for determining element shape of substrate, and determination system for substrate element shape during semiconductor manufacturing process |
| JP4482441B2 (en) * | 2004-12-22 | 2010-06-16 | 株式会社国際電気セミコンダクターサービス | Element shape determining apparatus and substrate element shape determining method |
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