JPH01130556U - - Google Patents

Info

Publication number
JPH01130556U
JPH01130556U JP2779688U JP2779688U JPH01130556U JP H01130556 U JPH01130556 U JP H01130556U JP 2779688 U JP2779688 U JP 2779688U JP 2779688 U JP2779688 U JP 2779688U JP H01130556 U JPH01130556 U JP H01130556U
Authority
JP
Japan
Prior art keywords
lead frame
bonded
metal lead
hybrid integrated
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2779688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2779688U priority Critical patent/JPH01130556U/ja
Publication of JPH01130556U publication Critical patent/JPH01130556U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2779688U 1988-03-01 1988-03-01 Pending JPH01130556U (US20020193084A1-20021219-M00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2779688U JPH01130556U (US20020193084A1-20021219-M00002.png) 1988-03-01 1988-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2779688U JPH01130556U (US20020193084A1-20021219-M00002.png) 1988-03-01 1988-03-01

Publications (1)

Publication Number Publication Date
JPH01130556U true JPH01130556U (US20020193084A1-20021219-M00002.png) 1989-09-05

Family

ID=31250604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2779688U Pending JPH01130556U (US20020193084A1-20021219-M00002.png) 1988-03-01 1988-03-01

Country Status (1)

Country Link
JP (1) JPH01130556U (US20020193084A1-20021219-M00002.png)

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