JPH01129876U - - Google Patents
Info
- Publication number
- JPH01129876U JPH01129876U JP2456488U JP2456488U JPH01129876U JP H01129876 U JPH01129876 U JP H01129876U JP 2456488 U JP2456488 U JP 2456488U JP 2456488 U JP2456488 U JP 2456488U JP H01129876 U JPH01129876 U JP H01129876U
- Authority
- JP
- Japan
- Prior art keywords
- component pads
- printed circuit
- circuit board
- copper foil
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456488U JPH0611533Y2 (ja) | 1988-02-26 | 1988-02-26 | プリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2456488U JPH0611533Y2 (ja) | 1988-02-26 | 1988-02-26 | プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129876U true JPH01129876U (pt) | 1989-09-04 |
| JPH0611533Y2 JPH0611533Y2 (ja) | 1994-03-23 |
Family
ID=31244517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2456488U Expired - Lifetime JPH0611533Y2 (ja) | 1988-02-26 | 1988-02-26 | プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611533Y2 (pt) |
-
1988
- 1988-02-26 JP JP2456488U patent/JPH0611533Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611533Y2 (ja) | 1994-03-23 |