JPH01129870U - - Google Patents
Info
- Publication number
- JPH01129870U JPH01129870U JP2405688U JP2405688U JPH01129870U JP H01129870 U JPH01129870 U JP H01129870U JP 2405688 U JP2405688 U JP 2405688U JP 2405688 U JP2405688 U JP 2405688U JP H01129870 U JPH01129870 U JP H01129870U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- repair
- mounting structure
- view
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2405688U JPH01129870U (cs) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2405688U JPH01129870U (cs) | 1988-02-25 | 1988-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129870U true JPH01129870U (cs) | 1989-09-04 |
Family
ID=31243575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2405688U Pending JPH01129870U (cs) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129870U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025154475A1 (ja) * | 2024-01-18 | 2025-07-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
1988
- 1988-02-25 JP JP2405688U patent/JPH01129870U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025154475A1 (ja) * | 2024-01-18 | 2025-07-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |