JPH01129849U - - Google Patents
Info
- Publication number
- JPH01129849U JPH01129849U JP2416988U JP2416988U JPH01129849U JP H01129849 U JPH01129849 U JP H01129849U JP 2416988 U JP2416988 U JP 2416988U JP 2416988 U JP2416988 U JP 2416988U JP H01129849 U JPH01129849 U JP H01129849U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead frame
- lead
- support bar
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2416988U JPH01129849U (US20030157376A1-20030821-M00001.png) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2416988U JPH01129849U (US20030157376A1-20030821-M00001.png) | 1988-02-25 | 1988-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129849U true JPH01129849U (US20030157376A1-20030821-M00001.png) | 1989-09-04 |
Family
ID=31243787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2416988U Pending JPH01129849U (US20030157376A1-20030821-M00001.png) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129849U (US20030157376A1-20030821-M00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093983A (ja) * | 2000-09-13 | 2002-03-29 | Murata Mfg Co Ltd | 電子部品の切離し構造 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62254457A (ja) * | 1986-04-28 | 1987-11-06 | Nec Corp | Ｉｃ用リ−ドフレ−ム |
-
1988
- 1988-02-25 JP JP2416988U patent/JPH01129849U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62254457A (ja) * | 1986-04-28 | 1987-11-06 | Nec Corp | Ｉｃ用リ−ドフレ−ム |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093983A (ja) * | 2000-09-13 | 2002-03-29 | Murata Mfg Co Ltd | 電子部品の切離し構造 |
| JP4505967B2 (ja) * | 2000-09-13 | 2010-07-21 | 株式会社村田製作所 | 電子部品の切離し構造 |
