JPH01129846U - - Google Patents
Info
- Publication number
- JPH01129846U JPH01129846U JP2416888U JP2416888U JPH01129846U JP H01129846 U JPH01129846 U JP H01129846U JP 2416888 U JP2416888 U JP 2416888U JP 2416888 U JP2416888 U JP 2416888U JP H01129846 U JPH01129846 U JP H01129846U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- adjacent unit
- outer leads
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2416888U JPH0650989Y2 (ja) | 1988-02-25 | 1988-02-25 | リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2416888U JPH0650989Y2 (ja) | 1988-02-25 | 1988-02-25 | リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129846U true JPH01129846U (fi) | 1989-09-04 |
| JPH0650989Y2 JPH0650989Y2 (ja) | 1994-12-21 |
Family
ID=31243785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2416888U Expired - Lifetime JPH0650989Y2 (ja) | 1988-02-25 | 1988-02-25 | リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650989Y2 (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010098156A1 (ja) * | 2009-02-25 | 2010-09-02 | 三洋電機株式会社 | フレームパッケージ型発光装置およびその製造方法 |
-
1988
- 1988-02-25 JP JP2416888U patent/JPH0650989Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010098156A1 (ja) * | 2009-02-25 | 2010-09-02 | 三洋電機株式会社 | フレームパッケージ型発光装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0650989Y2 (ja) | 1994-12-21 |