JPH01129845U - - Google Patents
Info
- Publication number
- JPH01129845U JPH01129845U JP2530888U JP2530888U JPH01129845U JP H01129845 U JPH01129845 U JP H01129845U JP 2530888 U JP2530888 U JP 2530888U JP 2530888 U JP2530888 U JP 2530888U JP H01129845 U JPH01129845 U JP H01129845U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- length
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2530888U JPH01129845U (bs) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2530888U JPH01129845U (bs) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129845U true JPH01129845U (bs) | 1989-09-04 |
Family
ID=31245932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2530888U Pending JPH01129845U (bs) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129845U (bs) |
-
1988
- 1988-02-26 JP JP2530888U patent/JPH01129845U/ja active Pending