JPH01129820U - - Google Patents
Info
- Publication number
- JPH01129820U JPH01129820U JP1988025602U JP2560288U JPH01129820U JP H01129820 U JPH01129820 U JP H01129820U JP 1988025602 U JP1988025602 U JP 1988025602U JP 2560288 U JP2560288 U JP 2560288U JP H01129820 U JPH01129820 U JP H01129820U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- block
- forming
- holding block
- forming device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025602U JPH01129820U (enExample) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025602U JPH01129820U (enExample) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129820U true JPH01129820U (enExample) | 1989-09-04 |
Family
ID=31246479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988025602U Pending JPH01129820U (enExample) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129820U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319798A (ja) * | 2001-04-23 | 2002-10-31 | Nec Corp | 電子部品リード切断装置および切断刃摩耗検出方法 |
-
1988
- 1988-02-26 JP JP1988025602U patent/JPH01129820U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002319798A (ja) * | 2001-04-23 | 2002-10-31 | Nec Corp | 電子部品リード切断装置および切断刃摩耗検出方法 |