JPH01129490A - Formation of resist layer for printed board - Google Patents
Formation of resist layer for printed boardInfo
- Publication number
- JPH01129490A JPH01129490A JP28822287A JP28822287A JPH01129490A JP H01129490 A JPH01129490 A JP H01129490A JP 28822287 A JP28822287 A JP 28822287A JP 28822287 A JP28822287 A JP 28822287A JP H01129490 A JPH01129490 A JP H01129490A
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- resist
- onto
- light
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000007639 printing Methods 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- KOWWOODYPWDWOJ-LVBPXUMQSA-N elatine Chemical compound C([C@]12CN(C3[C@@]45OCO[C@]44[C@H]6[C@@H](OC)[C@@H]([C@H](C4)OC)C[C@H]6[C@@]3([C@@H]1[C@@H]5OC)[C@@H](OC)CC2)CC)OC(=O)C1=CC=CC=C1N1C(=O)CC(C)C1=O KOWWOODYPWDWOJ-LVBPXUMQSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板上にエツチングにより回路パタ
ーンを形成するためのエツチングレジスト層や、回路パ
ターン形成後に素子の固定用に回路パターンにハンダを
選択的に付着させるためのソルダレジスト層を成形する
プリント基板用レジスト層成形方法に関する。Detailed Description of the Invention [Industrial Application Field] The present invention relates to an etching resist layer for forming a circuit pattern on a printed circuit board by etching, and a method for applying solder to a circuit pattern for fixing an element after the circuit pattern is formed. The present invention relates to a method for forming a resist layer for a printed circuit board for forming a solder resist layer for selective attachment.
なお、本明細書において、プリント基板なる語を、絶縁
基板の片面ないし両面に銅箔を全面に付設してその上に
前記エラチンブレジスｌ−５が成形される胴貼基板、お
よび、絶縁基板の片面ないし両面に回路パターンを付設
してその上に前記ソルダレジスト層が成形されるプリン
ト配線板の両者を包含する語として定義する。In this specification, the term "printed board" refers to a body-attached board on which copper foil is attached to one or both sides of an insulating board and on which the Elatin brace 1-5 is molded, and one side of an insulating board. It is defined as a term that includes both printed wiring boards on which circuit patterns are attached on both sides and the solder resist layer is formed thereon.
上述したエツチングレジスト層やソルダレジスト層を成
形する方法としては、従来、下記のものが知られている
。Conventionally, the following methods are known as methods for forming the above-mentioned etching resist layer and solder resist layer.
［１コ液状のレジスト剤を所定パターンのステンシルに
通過させるスクリーン印刷によって、プリント基板上に
所定パターンのレジスト層を成形する方法（スクリーン
印刷法と呼ばれる）。[1] A method of forming a resist layer in a predetermined pattern on a printed circuit board by screen printing in which a liquid resist agent is passed through a stencil in a predetermined pattern (referred to as screen printing method).
［２］プリント基板上の全面に所定厚さのレジスト層を
形成し、そのレジスト層の上に、所定パターンが写し込
まれたフィルムを接触状態或いは非接触状態で位置させ
、そのフィルムの上方から露光した後現像してレジスト
ｉを所定パターンに成形する方法（写真現像法と呼ばれ
る）。[2] A resist layer of a predetermined thickness is formed on the entire surface of the printed circuit board, a film with a predetermined pattern imprinted on the resist layer is placed in contact or non-contact, and the film is exposed from above. A method of forming the resist i into a predetermined pattern by exposing and developing it (referred to as a photographic development method).
しかし、上述した従来の方法には次のような問題があっ
た。However, the conventional method described above has the following problems.
まず、［１］のスクリーン印刷法では、レジスト層とし
ての機能を充分に果たすためにはその厚みをかなり厚い
ものにする必要があることから、プリント基板状に厚く
盛り上げられたレジスト剤の足元の部分でレジスト剤の
まわり込みや溶は出しが生じ易く、それに起因したレジ
スト層の厚み不足や不要なレジスト剤の付着によって、
所定のパターンの縁の部分にニジミやカスレ等が生じが
ちである。その結果、この方法でエツチングレジスト層
を成形する場合には回路パターンが正確に形成されなく
なる虞があり、一方、この方法でソルダレジスト層を成
形する場合にはハンダの不安定化を招来する虞がある。First, in the screen printing method [1], in order to fully perform its function as a resist layer, it is necessary to make the resist layer quite thick. The resist agent tends to wrap around or bleed out in some areas, resulting in insufficient thickness of the resist layer or adhesion of unnecessary resist agent.
Bleeding, fading, etc. tend to occur at the edges of a predetermined pattern. As a result, when forming an etching resist layer using this method, there is a risk that a circuit pattern may not be formed accurately, and on the other hand, when forming a solder resist layer using this method, there is a risk that the solder may become unstable. There is.
また、この方法でソルダレジスト層を成形する場合にあ
っては、プリント基板上に所定厚さの銅箔による回路パ
ターンが既に形成されているから、その回路パターンの
縁の部分に出来る入隅部分に気泡が生じたりレジスト層
の厚さ不足等が生じたりしがちでハンダの不安定化が発
生し易くなる。In addition, when forming the solder resist layer using this method, since a circuit pattern made of copper foil of a predetermined thickness has already been formed on the printed circuit board, the corner formed at the edge of the circuit pattern is This tends to cause bubbles to form or the resist layer to be insufficiently thick, making the solder more likely to become unstable.
特に近年のプリント配線板における回路の高密度化に伴
って回路パターンどうしが極めて近接配置される場合に
は、上述の問題の解決が一層肝要である。In particular, when circuit patterns are arranged extremely close to each other due to the recent increase in the density of circuits on printed wiring boards, it is even more important to solve the above-mentioned problems.
次に［２］の写真現像法による場合には、レジスト層の
所定パターンのエツジの形成が露光という直進性のある
光を照射する手段で行われるから、ニジミやカスレ等の
発生が少なく、しかも、プリント基板上への所定厚さの
レジスト層の形成は塗布等の手段によって大隅部に充分
充填される状態で行われるから、気泡等の発生は少ない
ものの、プリント基板上の全面に形成されたレジスト層
の上にフィルムを重ねて露光しその後そのフィルムを取
り外すという一連の工程が時間を要するものであり、作
業性が良くない問題があった。Next, in the case of the photographic development method in [2], the formation of edges in a predetermined pattern on the resist layer is carried out by exposure, which is a means of irradiating linear light, so that there are fewer occurrences of bleeding, fading, etc. Since the formation of a resist layer of a predetermined thickness on a printed circuit board is carried out by means such as coating so that the large corners are sufficiently filled, the formation of bubbles is small, but the resist layer is formed on the entire surface of the printed circuit board. The series of steps of stacking a film on the resist layer, exposing it to light, and then removing the film is time consuming and has the problem of poor workability.
本発明の目的は、上記実情に鑑み、所望のパターンのレ
ジスト層を正確に、かつ、作業性よく成形することので
きる方法を提供することにある。SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a method capable of forming a resist layer having a desired pattern accurately and with good workability.
本発明によるプリント基板用レジスト層成形方法の特徴
は、プリント基板上の全面に所定厚さのレジスト層を形
成し、そのレジスト層の表面に遮光性インクを用いたス
クリーン印刷によって所定パターンを印刷した後、露光
・現像して前記レジスト層を前記所定パターンに成形す
ることにある。The feature of the method for forming a resist layer for a printed circuit board according to the present invention is that a resist layer of a predetermined thickness is formed on the entire surface of a printed circuit board, and a predetermined pattern is printed on the surface of the resist layer by screen printing using a light-shielding ink. Thereafter, the resist layer is formed into the predetermined pattern by exposure and development.
つまり、プリント基板の全面に形成されるレジスト層は
、塗布等の手段によって、たとえプリン）！板上に既に
回路パターンが形成されてエツジ部分での入隅が多くあ
っても、その入隅の奥にまで充分入り込む状態に形成さ
れるから、気泡等の発生が少なく、かつ所望の厚さのも
のが得られる。In other words, the resist layer formed on the entire surface of the printed circuit board can be formed by coating or other means, even if the resist layer is formed on the entire surface of the printed circuit board. Even if the circuit pattern has already been formed on the board and there are many corners at the edges, the circuit pattern is formed in a state that goes deep into the corners, so there are fewer bubbles and the desired thickness can be achieved. You can get the following.
しかも、プリント基板上の全面レジスト層の表面に遮光
性インクで印刷される所定パターンは、単に光を遮るだ
けの働きをすればよいからその厚みを小にでき、スクリ
ーン印刷において印刷厚さが大きいときに生じ易い回り
込みや溶は出しを少なくでき、全面レジスト層の表面が
平滑でスキージの移動時の抵抗が少ないことと相俟って
、所定パターンを精度高く印刷できる。Moreover, since the predetermined pattern printed with light-shielding ink on the surface of the entire surface of the resist layer on the printed circuit board only has to function to block light, the thickness can be reduced, whereas the printing thickness is large in screen printing. It is possible to reduce wraparound and melting that sometimes occur, and combined with the fact that the surface of the entire resist layer is smooth and there is little resistance when moving the squeegee, it is possible to print a predetermined pattern with high precision.
さらに、レジスト層のエツジは、プリント基板上の全面
レジスト層の表面に印刷されたその所定パターンをフォ
トマスクとして直進性のある光が透過する部分と透過し
ない部分との境界に対応してその一方の部分のレジスト
層が現像により除去されることで形成されるから、ニジ
ミやカスレのない鋭利なものとなる。Furthermore, the edges of the resist layer are set by using a predetermined pattern printed on the entire surface of the resist layer on the printed circuit board as a photomask, and one side of the resist layer corresponds to the boundary between the area where straight light passes through and the area where it does not pass through. It is formed by removing the resist layer in the area by development, so it becomes sharp without bleeds or scratches.
そして、レジスト層を所定パターンに成形するためのフ
ォトマスクが、設置や取り外しに時間が掛かるフィルム
ではなく、短時間での作業が可能なスクリーン印刷で形
成されるから、作業時間を短縮できる。Furthermore, since the photomask for forming the resist layer into a predetermined pattern is formed by screen printing, which can be completed in a short time, rather than using a film, which takes time to install and remove, the work time can be reduced.
その結果、レジスト層を高い精度で所定パターンに成形
できることで、エツチングレジスト層を成形する場合に
あっては回路パターンを精度よく形成でき、また、ソル
ダレジスト層を成形する場合にあってはハンダの安定化
を図ることができ、しかも、フォトマスクの形成作業等
の短縮化を図ることができるから、全体として、性能面
において優れたプリント配線板を作業性よく製作するこ
とを可能にするレジスト成形方法を提供できるようにな
った。As a result, the resist layer can be formed into a predetermined pattern with high precision, making it possible to form a circuit pattern with high accuracy when forming an etching resist layer, and to form a solder resist layer with high precision when forming a solder resist layer. Resist molding makes it possible to produce printed wiring boards with excellent overall performance with good workability, as it can stabilize the process and also shorten the process of forming photomasks, etc. Now we can provide a method.
以下、図面に基づいて、本発明の詳細な説明する。なお
、以下の実施例ではソルダレジスト層の成形方法を例に
取って説明するが、本発明はエツチングレジスト層を成
形する場合にも同様に適用することができる。Hereinafter, the present invention will be described in detail based on the drawings. In the following embodiments, a method for forming a solder resist layer will be described as an example, but the present invention can be similarly applied to the case of forming an etching resist layer.
第１図に示すように、プリント基板（１）を用意する。As shown in FIG. 1, a printed circuit board (1) is prepared.
このプリント基板（１）は、予め銅箔をあるパターンに
成形した回路（１ａ）が付設されたものである。This printed circuit board (1) is attached with a circuit (1a) made of copper foil formed in a certain pattern in advance.
次に、第２図に示すように、このプリント基板（１）上
の全面に光硬化型樹脂からなる液状のレジスト剤を一様
に塗布し、所定厚さのレジスト層（３）を形成する。Next, as shown in FIG. 2, a liquid resist agent made of a photocurable resin is uniformly applied to the entire surface of the printed circuit board (1) to form a resist layer (3) of a predetermined thickness. .
前記レジスＩ−層（３）が指触感燥状態になった後、第
３図に示すように、そのレジスト層（３）の表面に、遮
光性インクを用いたスクリーン印刷によって、所定パタ
ーン（４）を印刷する。After the resist I-layer (3) becomes dry to the touch, as shown in FIG. 3, a predetermined pattern (4 ) to print.
その後、第４図に示すように、その遮光性インクによる
所定パターン（４）の上方から露光し、光が透過した部
分のレジスト層（３ａ）を硬化させる。Thereafter, as shown in FIG. 4, the predetermined pattern (4) of the light-shielding ink is exposed to light from above, and the portions of the resist layer (3a) through which the light passes are cured.
そして、このプリント基板（１）に現像液を作用させる
ことで、レジスト層（３）上の遮光性インクと光があた
らな（て硬化しなかった部分のレジスｌ−Ｊ？Ｊ （３
１１）とを除去し、第５図に示すように、所定パターン
に成形されたソルダレジスト層を得る。なお、この実施
例におけるレジスト剤は光硬化型樹脂からなるので、上
述のスクリーン印刷によって印刷される所定パターンは
ネガ像となっている。Then, by applying a developer to this printed circuit board (1), the light-shielding ink on the resist layer (3) is exposed to light (and the resist l-J?J (3
11) is removed to obtain a solder resist layer formed into a predetermined pattern as shown in FIG. Note that since the resist agent in this example is made of a photocurable resin, the predetermined pattern printed by the above-mentioned screen printing is a negative image.
以上の工程によってソルダレジスト層を成形することに
より、プリント基板（１）上に既に回路（１，１＞が付
設されていることで凹凸がありながらその入隅の奥にま
でレジスト剤を入り込ませて気泡の発生を少なくする５
二とができ、しかも、レジスト層（３）の表面が平滑で
スキージの移動時の抵抗が少ないことと、そのし・ジス
１〜層（３）の表面に印刷される所定パターンが遮光機
能を備えるだけでよいのでその厚さを小さくてきて縁の
部分でのインクの回り込みや溶は出しを少なくできるこ
ととで、所定パターンの印刷を精度高く行うことができ
、さらに、そのことと露光・現像で所定のパターンのレ
ジスＩ・Ｎ （３ａ）のエツジが形成されることとによ
って、そのエツジを鋭利なものにできる。そして、この
ようにして高い精度で所定パターンのレジスＩ−層（３
ａ）を形成することができながら、露光時にフォトマス
クとなる所定パターンをスクリーン印刷で行うことによ
って所定パターンが写し込まれたフィルムを用いる場合
に比して作業時間を短縮することができる。By forming the solder resist layer through the above steps, the resist agent can penetrate deep into the corners of the printed circuit board (1), even though the circuit (1, 1> is already attached to it) and has irregularities. to reduce the generation of bubbles 5
Moreover, the surface of the resist layer (3) is smooth and there is little resistance when moving the squeegee, and the predetermined pattern printed on the surface of the resist layer (3) has a light shielding function. By reducing the thickness of the ink and reducing the amount of ink that wraps around and bleeds out at the edges, it is possible to print a predetermined pattern with high precision. By forming the edges of the resist I·N (3a) in a predetermined pattern, the edges can be made sharp. In this way, a predetermined pattern of the resist I-layer (3
By screen printing a predetermined pattern that will become a photomask during exposure, the working time can be shortened compared to the case where a film on which a predetermined pattern is imprinted is used.
次の本発明の別の実施例を説明する。 Another embodiment of the present invention will be described below.
〈ｌ〉先の実施例中でも述べたが、本発明をエツチング
レジストａの成形に適用することか可能である。この場
合、レジスＩ−Ｎ （３）は、プリント基板（１）とし
て銅箔をその全面に付設したものの上に形成すればよい
。<l> As mentioned in the previous embodiment, the present invention can be applied to the molding of the etching resist a. In this case, the resist I-N (3) may be formed on a printed circuit board (1) with copper foil attached to its entire surface.
（２〉 レジスト剤としては、先の実施例で説明した光
硬化型樹脂に替えて、光硬化型樹脂を用いてもよい。こ
の場合、レジスト層（３）の表面に印刷される所定パタ
ーンはポジ像にする必要がある。(2> As the resist agent, a photocurable resin may be used instead of the photocurable resin explained in the previous example. In this case, the predetermined pattern printed on the surface of the resist layer (3) is It needs to be a positive image.
く３〉露光・現像の具体的方法、および、それに用いる
装置は、公知の技術から適宜選択することが可能である
。3> Specific methods of exposure and development and devices used therein can be appropriately selected from known techniques.
尚、特許請求の範囲の項に図面との対照を便利にする為
に符号を記すが、該記入により本発明は添付図面の構造
に限定されるものではない。Incidentally, although reference numerals are written in the claims section for convenient comparison with the drawings, the present invention is not limited to the structure shown in the accompanying drawings.
第１図ないし第５図は本発明に係るプリント基板用レジ
スト層成形方法の実施例を示す工程図である。
（１）・・・・・・プリント基板、（３）・・・・・・
レジスト層。1 to 5 are process diagrams showing an embodiment of the method for forming a resist layer for a printed circuit board according to the present invention. (1)...Printed circuit board, (3)...
resist layer.
Claims (3)
層（３）を形成し、そのレジスト層（３）の表面に遮光
性インクを用いたスクリーン印刷によって所定パターン
を印刷した後、露光・現像して前記レジスト層（３）を
前記所定パターンに成形するプリント基板用レジスト層
成形方法。1. A resist layer (3) of a predetermined thickness is formed on the entire surface of the printed circuit board (1), and a predetermined pattern is printed on the surface of the resist layer (3) by screen printing using light-shielding ink, and then exposed and developed. and forming the resist layer (3) into the predetermined pattern.
る特許請求の範囲第１項に記載のプリント基板用レジス
ト層成形方法。2. The method for forming a resist layer for a printed circuit board according to claim 1, wherein the resist layer (3) is an etching resist layer.
許請求の範囲第１項に記載のプリント基板用レジスト層
成形方法。3. The method for forming a resist layer for a printed circuit board according to claim 1, wherein the resist layer (3) is a solder resist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822287A JPH01129490A (en) | 1987-11-14 | 1987-11-14 | Formation of resist layer for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822287A JPH01129490A (en) | 1987-11-14 | 1987-11-14 | Formation of resist layer for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129490A true JPH01129490A (en) | 1989-05-22 |
Family
ID=17727404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28822287A Pending JPH01129490A (en) | 1987-11-14 | 1987-11-14 | Formation of resist layer for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129490A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0433721A2 (en) * | 1989-12-22 | 1991-06-26 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
| EP0488581A2 (en) * | 1990-11-27 | 1992-06-03 | Alexander Manufacturing Company | Flexible welding board for battery pack |
-
1987
- 1987-11-14 JP JP28822287A patent/JPH01129490A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0433721A2 (en) * | 1989-12-22 | 1991-06-26 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
| EP0433721A3 (en) * | 1989-12-22 | 1992-07-08 | Siemens Aktiengesellschaft | Method of applying a solder stop coating on printed circuit boards |
| EP0488581A2 (en) * | 1990-11-27 | 1992-06-03 | Alexander Manufacturing Company | Flexible welding board for battery pack |
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