JPH01127690U - - Google Patents

Info

Publication number
JPH01127690U
JPH01127690U JP1988020347U JP2034788U JPH01127690U JP H01127690 U JPH01127690 U JP H01127690U JP 1988020347 U JP1988020347 U JP 1988020347U JP 2034788 U JP2034788 U JP 2034788U JP H01127690 U JPH01127690 U JP H01127690U
Authority
JP
Japan
Prior art keywords
workpiece
laser beam
laser
processing
processing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020347U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020347U priority Critical patent/JPH01127690U/ja
Publication of JPH01127690U publication Critical patent/JPH01127690U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例によるレーザ加工
装置の加工ヘツドを示す断面図、第2図は従来の
レーザ加工装置を示す構成図、第3図は従来のレ
ーザ加工装置の加工ヘツドを示す断面図である。 図において、2はレーザ光、6は被加工物、4
dはノズル、40は調節手段である。なお、図中
同一符号は同一または相当部分を示す。
FIG. 1 is a sectional view showing a processing head of a laser processing device according to an embodiment of the present invention, FIG. 2 is a configuration diagram showing a conventional laser processing device, and FIG. 3 is a cross-sectional view showing a processing head of a conventional laser processing device. FIG. In the figure, 2 is a laser beam, 6 is a workpiece, and 4 is a laser beam.
d is a nozzle, and 40 is an adjustment means. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] レーザ光の光路に被加工物の加工面と対向して
設けられ、上記レーザ光を集光して上記被加工物
に照射するノズルを備えたレーザ加工装置におい
て、加工中において上記ヘツドノズルの中心軸と
上記レーザ光の光軸を所定寸法ずらす調節手段を
備えたことを特徴とするレーザ加工装置。
In a laser processing device including a nozzle that is provided in the optical path of a laser beam to face the processing surface of the workpiece and that focuses the laser light and irradiates the workpiece, the central axis of the head nozzle during processing. and adjusting means for shifting the optical axis of the laser beam by a predetermined dimension.
JP1988020347U 1988-02-18 1988-02-18 Pending JPH01127690U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020347U JPH01127690U (en) 1988-02-18 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020347U JPH01127690U (en) 1988-02-18 1988-02-18

Publications (1)

Publication Number Publication Date
JPH01127690U true JPH01127690U (en) 1989-08-31

Family

ID=31236640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020347U Pending JPH01127690U (en) 1988-02-18 1988-02-18

Country Status (1)

Country Link
JP (1) JPH01127690U (en)

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