JPH01127667U - - Google Patents

Info

Publication number

JPH01127667U

JPH01127667U JP1678988U JP1678988U JPH01127667U JP H01127667 U JPH01127667 U JP H01127667U JP 1678988 U JP1678988 U JP 1678988U JP 1678988 U JP1678988 U JP 1678988U JP H01127667 U JPH01127667 U JP H01127667U

Authority

JP

Japan

Prior art keywords

flat package

soldering iron

soldering

solder

pins

Prior art date

1988-02-10

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 11
• 238000005476 soldering Methods 0.000 claims description 7
• 229910052742 iron Inorganic materials 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims 2
• 230000008018 melting Effects 0.000 claims 1
• 238000002844 melting Methods 0.000 claims 1
• 238000004806 packaging method and process Methods 0.000 claims 1

Cited By (1)