JPH01125538U - - Google Patents
Info
- Publication number
- JPH01125538U JPH01125538U JP2102188U JP2102188U JPH01125538U JP H01125538 U JPH01125538 U JP H01125538U JP 2102188 U JP2102188 U JP 2102188U JP 2102188 U JP2102188 U JP 2102188U JP H01125538 U JPH01125538 U JP H01125538U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- bake
- epoxy
- cure
- mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2102188U JPH01125538U (enrdf_load_stackoverflow) | 1988-02-19 | 1988-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2102188U JPH01125538U (enrdf_load_stackoverflow) | 1988-02-19 | 1988-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01125538U true JPH01125538U (enrdf_load_stackoverflow) | 1989-08-28 |
Family
ID=31237884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2102188U Pending JPH01125538U (enrdf_load_stackoverflow) | 1988-02-19 | 1988-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01125538U (enrdf_load_stackoverflow) |
-
1988
- 1988-02-19 JP JP2102188U patent/JPH01125538U/ja active Pending