JPH01123394U - - Google Patents
Info
- Publication number
- JPH01123394U JPH01123394U JP1939688U JP1939688U JPH01123394U JP H01123394 U JPH01123394 U JP H01123394U JP 1939688 U JP1939688 U JP 1939688U JP 1939688 U JP1939688 U JP 1939688U JP H01123394 U JPH01123394 U JP H01123394U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- chassis
- wiring board
- printed wiring
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1939688U JPH01123394U (OSRAM) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1939688U JPH01123394U (OSRAM) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123394U true JPH01123394U (OSRAM) | 1989-08-22 |
Family
ID=31234868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1939688U Pending JPH01123394U (OSRAM) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123394U (OSRAM) |
-
1988
- 1988-02-17 JP JP1939688U patent/JPH01123394U/ja active Pending