JPH01123378U - - Google Patents
Info
- Publication number
- JPH01123378U JPH01123378U JP1819888U JP1819888U JPH01123378U JP H01123378 U JPH01123378 U JP H01123378U JP 1819888 U JP1819888 U JP 1819888U JP 1819888 U JP1819888 U JP 1819888U JP H01123378 U JPH01123378 U JP H01123378U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil pattern
- circuit board
- printed circuit
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1819888U JPH01123378U (hr) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1819888U JPH01123378U (hr) | 1988-02-16 | 1988-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01123378U true JPH01123378U (hr) | 1989-08-22 |
Family
ID=31232626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1819888U Pending JPH01123378U (hr) | 1988-02-16 | 1988-02-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01123378U (hr) |
-
1988
- 1988-02-16 JP JP1819888U patent/JPH01123378U/ja active Pending