JPH01123377U - - Google Patents
Info
- Publication number
- JPH01123377U JPH01123377U JP2013188U JP2013188U JPH01123377U JP H01123377 U JPH01123377 U JP H01123377U JP 2013188 U JP2013188 U JP 2013188U JP 2013188 U JP2013188 U JP 2013188U JP H01123377 U JPH01123377 U JP H01123377U
- Authority
- JP
- Japan
- Prior art keywords
- board
- sub
- main board
- hole
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
第１図はこの考案の一実施例を示す分解斜視図
、第２図は従来の副基板の取付構造を示す分解斜
視図である。
１……主基板、２……副基板、３……電気部品
、４，８……導体の接続部、７，１０……透孔、
６……副基板の挿入脚部。なお、各図中、同一符
号は同一、または相当部分を示す。
FIG. 1 is an exploded perspective view showing an embodiment of this invention, and FIG. 2 is an exploded perspective view showing a conventional sub-board mounting structure. DESCRIPTION OF SYMBOLS 1...Main board, 2...Subboard, 3...Electric component, 4, 8...Conductor connection part, 7, 10...Through hole,
6... Insertion leg of sub-board. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
当該副基板挿入用の透孔に垂直に挿通し、かつ副
基板上に実装された少なくとも１つの電気部品が
主基板に形成した当該部品挿入用の透孔に挿通さ
れた状態でもつて当該主基板の導体と副基板の導
体とを半田付け接続して一体に固着する構成とし
た副基板の取付構造。 A sub-board with electrical components mounted thereon is inserted vertically into a through hole for inserting the sub-board formed on the main board, and at least one electrical component mounted on the sub-board is inserted into the main board for inserting the part. A mounting structure for a sub-board in which the conductor of the main board and the conductor of the sub-board are connected by soldering and fixed together even when the main board is inserted through the through-hole of the main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013188U JPH01123377U (en) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013188U JPH01123377U (en) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123377U true JPH01123377U (en) | 1989-08-22 |
Family
ID=31236242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013188U Pending JPH01123377U (en) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123377U (en) |
-
1988
- 1988-02-17 JP JP2013188U patent/JPH01123377U/ja active Pending
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