JPH01123357U - - Google Patents
Info
- Publication number
- JPH01123357U JPH01123357U JP1908288U JP1908288U JPH01123357U JP H01123357 U JPH01123357 U JP H01123357U JP 1908288 U JP1908288 U JP 1908288U JP 1908288 U JP1908288 U JP 1908288U JP H01123357 U JPH01123357 U JP H01123357U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead
- semiconductor device
- semiconductor pellet
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908288U JPH01123357U (no) | 1988-02-16 | 1988-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908288U JPH01123357U (no) | 1988-02-16 | 1988-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123357U true JPH01123357U (no) | 1989-08-22 |
Family
ID=31234279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1908288U Pending JPH01123357U (no) | 1988-02-16 | 1988-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123357U (no) |
-
1988
- 1988-02-16 JP JP1908288U patent/JPH01123357U/ja active Pending