JPH01123085U - - Google Patents
Info
- Publication number
- JPH01123085U JPH01123085U JP1988020519U JP2051988U JPH01123085U JP H01123085 U JPH01123085 U JP H01123085U JP 1988020519 U JP1988020519 U JP 1988020519U JP 2051988 U JP2051988 U JP 2051988U JP H01123085 U JPH01123085 U JP H01123085U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- metal plate
- metal
- gap
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000704 physical effect Effects 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図は本考案の第１の実施例の側面図、第２
図は本考案の第２の実施例の断面図、第３図は本
考案の第３の実施例の断面図である。
１……樹脂、２，２ａ，２ｂ，３，３ａ，３ｂ
……金属板、４，４ａ……物体、５，５ａ……プ
レート、６……ばね。
Figure 1 is a side view of the first embodiment of the present invention;
The figure is a cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a third embodiment of the present invention. 1... Resin, 2, 2a, 2b, 3, 3a, 3b
...metal plate, 4,4a...object, 5,5a...plate, 6...spring.
Claims (1)
加熱及び冷却される物体との間に介在し表面が前
記プレート面に接触する柔軟性を有する熱伝導度
の高い第１の金属板と、前記プレートと物体との
間に前記第１の金属板に対向して前記第１の金属
板との間に間隙部を有して配置され表面が前記物
体面に接触する前記第１の金属板と物理的性質が
等しい第２の金続板と、前記間隙部に充填される
熱伝導度の高い流動状の樹脂とを含むことを特徴
とする熱伝導媒体。 A first metal plate with high thermal conductivity that is flexible and has a surface that is in contact with the plate surface and is interposed between a heating and cooling plate and an object to be heated and cooled by the plate, and the plate and the object. and physical properties of the first metal plate, which is arranged opposite to the first metal plate with a gap between the first metal plate and whose surface is in contact with the object surface. 1. A heat conductive medium comprising: a second metal connecting plate having the same values; and a fluid resin with high thermal conductivity filled in the gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020519U JPH01123085U (en) | 1988-02-17 | 1988-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988020519U JPH01123085U (en) | 1988-02-17 | 1988-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123085U true JPH01123085U (en) | 1989-08-22 |
Family
ID=31236954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988020519U Pending JPH01123085U (en) | 1988-02-17 | 1988-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123085U (en) |
-
1988
- 1988-02-17 JP JP1988020519U patent/JPH01123085U/ja active Pending
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