JPH01122050U - - Google Patents
Info
- Publication number
- JPH01122050U JPH01122050U JP1913988U JP1913988U JPH01122050U JP H01122050 U JPH01122050 U JP H01122050U JP 1913988 U JP1913988 U JP 1913988U JP 1913988 U JP1913988 U JP 1913988U JP H01122050 U JPH01122050 U JP H01122050U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- release
- adhesive
- adhesive layer
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000007423 decrease Effects 0.000 claims 1
- 238000013008 moisture curing Methods 0.000 claims 1
Description
第１図Ａはこの考案の一実施例に係る改ざん防
止テープの縦断面図、同図Ｂは同使用説明図、第
２図Ａ，Ｂは従来技術説明図である。
１……改ざん防止テープ、２……テープ基材、
３……剥離処理層、４……粘着剤層、５……印刷
層、６……剥離紙。
FIG. 1A is a longitudinal cross-sectional view of a tamper-proof tape according to an embodiment of this invention, FIG. 1... Tamper-proof tape, 2... Tape base material,
3... Release treatment layer, 4... Adhesive layer, 5... Printing layer, 6... Release paper.
Claims (1)
分的に形成され、この剥離処理層を覆う状態で前
記テープ基材の片面に粘着剤層が形成され、この
粘着剤層は吸湿硬化により前記剥離処理層に対す
る接着力が低下する吸湿硬化型感圧性接着剤から
なり、この粘着剤層表面に剥離紙が装着されてな
る改ざん防止テープ。 (2) テープ基材表面と剥離処理層表面とを跨い
で粘着剤層内に印刷層が形成されてなる請求項１
記載の改ざん防止テープ。[Claims for Utility Model Registration] (1) A release layer is partially formed on one side of a transparent tape base, and an adhesive layer is formed on one side of the tape base covering the release layer. , a tamper-proof tape in which the adhesive layer is made of a moisture-curable pressure-sensitive adhesive whose adhesive strength to the release layer decreases due to moisture-curing, and a release paper is attached to the surface of the adhesive layer. (2) Claim 1, wherein a printed layer is formed within the adhesive layer spanning the surface of the tape base material and the surface of the release treatment layer.
Tamper-proof tape as stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1913988U JPH01122050U (en) | 1988-02-15 | 1988-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1913988U JPH01122050U (en) | 1988-02-15 | 1988-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01122050U true JPH01122050U (en) | 1989-08-18 |
Family
ID=31234384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1913988U Pending JPH01122050U (en) | 1988-02-15 | 1988-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01122050U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53149230A (en) * | 1977-05-31 | 1978-12-26 | Nitto Electric Ind Co Ltd | Prevention of reapplication |
-
1988
- 1988-02-15 JP JP1913988U patent/JPH01122050U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53149230A (en) * | 1977-05-31 | 1978-12-26 | Nitto Electric Ind Co Ltd | Prevention of reapplication |