JPH01121969U - - Google Patents
Info
- Publication number
- JPH01121969U JPH01121969U JP1988017201U JP1720188U JPH01121969U JP H01121969 U JPH01121969 U JP H01121969U JP 1988017201 U JP1988017201 U JP 1988017201U JP 1720188 U JP1720188 U JP 1720188U JP H01121969 U JPH01121969 U JP H01121969U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- metal substrate
- conductive circuit
- circuit
- aluminum nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Details Of Resistors (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017201U JPH01121969U (US07847105-20101207-C00016.png) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017201U JPH01121969U (US07847105-20101207-C00016.png) | 1988-02-10 | 1988-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01121969U true JPH01121969U (US07847105-20101207-C00016.png) | 1989-08-18 |
Family
ID=31230771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988017201U Pending JPH01121969U (US07847105-20101207-C00016.png) | 1988-02-10 | 1988-02-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01121969U (US07847105-20101207-C00016.png) |
-
1988
- 1988-02-10 JP JP1988017201U patent/JPH01121969U/ja active Pending