JPH01120335U - - Google Patents
Info
- Publication number
- JPH01120335U JPH01120335U JP1499688U JP1499688U JPH01120335U JP H01120335 U JPH01120335 U JP H01120335U JP 1499688 U JP1499688 U JP 1499688U JP 1499688 U JP1499688 U JP 1499688U JP H01120335 U JPH01120335 U JP H01120335U
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- output terminals
- photoelectric
- wiring board
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1499688U JPH0530360Y2 (US20030204162A1-20031030-M00001.png) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1499688U JPH0530360Y2 (US20030204162A1-20031030-M00001.png) | 1988-02-05 | 1988-02-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01120335U true JPH01120335U (US20030204162A1-20031030-M00001.png) | 1989-08-15 |
| JPH0530360Y2 JPH0530360Y2 (US20030204162A1-20031030-M00001.png) | 1993-08-03 |
Family
ID=31226664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1499688U Expired - Lifetime JPH0530360Y2 (US20030204162A1-20031030-M00001.png) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530360Y2 (US20030204162A1-20031030-M00001.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028284A (ja) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 半導体実装構造 |
| WO2009041212A1 (ja) * | 2007-09-28 | 2009-04-02 | Sharp Kabushiki Kaisha | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール |
| JP2011009659A (ja) * | 2009-05-22 | 2011-01-13 | Sharp Corp | 半導体パッケージ及び半導体パッケージの製造方法 |
| JP2013175743A (ja) * | 2013-04-01 | 2013-09-05 | Sharp Corp | 太陽電池モジュール |
| JP2014160865A (ja) * | 2014-05-09 | 2014-09-04 | Sharp Corp | 太陽電池モジュール |
-
1988
- 1988-02-05 JP JP1499688U patent/JPH0530360Y2/ja not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028284A (ja) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 半導体実装構造 |
| WO2009041212A1 (ja) * | 2007-09-28 | 2009-04-02 | Sharp Kabushiki Kaisha | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール |
| JP2009088145A (ja) * | 2007-09-28 | 2009-04-23 | Sharp Corp | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール |
| JP2011009659A (ja) * | 2009-05-22 | 2011-01-13 | Sharp Corp | 半導体パッケージ及び半導体パッケージの製造方法 |
| JP2013175743A (ja) * | 2013-04-01 | 2013-09-05 | Sharp Corp | 太陽電池モジュール |
| JP2014160865A (ja) * | 2014-05-09 | 2014-09-04 | Sharp Corp | 太陽電池モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530360Y2 (US20030204162A1-20031030-M00001.png) | 1993-08-03 |
