JPH01118440U - - Google Patents

Info

Publication number
JPH01118440U
JPH01118440U JP1317288U JP1317288U JPH01118440U JP H01118440 U JPH01118440 U JP H01118440U JP 1317288 U JP1317288 U JP 1317288U JP 1317288 U JP1317288 U JP 1317288U JP H01118440 U JPH01118440 U JP H01118440U
Authority
JP
Japan
Prior art keywords
bump
ceramic substrate
punched hole
brazed
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1317288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1317288U priority Critical patent/JPH01118440U/ja
Publication of JPH01118440U publication Critical patent/JPH01118440U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/113Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)
JP1317288U 1988-02-02 1988-02-02 Pending JPH01118440U (nl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1317288U JPH01118440U (nl) 1988-02-02 1988-02-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1317288U JPH01118440U (nl) 1988-02-02 1988-02-02

Publications (1)

Publication Number Publication Date
JPH01118440U true JPH01118440U (nl) 1989-08-10

Family

ID=31223267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1317288U Pending JPH01118440U (nl) 1988-02-02 1988-02-02

Country Status (1)

Country Link
JP (1) JPH01118440U (nl)

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