JPH01118440U - - Google Patents
Info
- Publication number
- JPH01118440U JPH01118440U JP1988013172U JP1317288U JPH01118440U JP H01118440 U JPH01118440 U JP H01118440U JP 1988013172 U JP1988013172 U JP 1988013172U JP 1317288 U JP1317288 U JP 1317288U JP H01118440 U JPH01118440 U JP H01118440U
- Authority
- JP
- Japan
- Prior art keywords
- bump
- ceramic substrate
- punched hole
- brazed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/01225—
Landscapes
- Multi-Conductor Connections (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988013172U JPH01118440U (enExample) | 1988-02-02 | 1988-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988013172U JPH01118440U (enExample) | 1988-02-02 | 1988-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118440U true JPH01118440U (enExample) | 1989-08-10 |
Family
ID=31223267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988013172U Pending JPH01118440U (enExample) | 1988-02-02 | 1988-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118440U (enExample) |
-
1988
- 1988-02-02 JP JP1988013172U patent/JPH01118440U/ja active Pending