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Priority to JP1988013172UpriorityCriticalpatent/JPH01118440U/ja
Publication of JPH01118440UpublicationCriticalpatent/JPH01118440U/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W72/00—Interconnections or connectors in packages
H10W72/01—Manufacture or treatment
H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping