JPH01117899U - - Google Patents
Info
- Publication number
- JPH01117899U JPH01117899U JP1130888U JP1130888U JPH01117899U JP H01117899 U JPH01117899 U JP H01117899U JP 1130888 U JP1130888 U JP 1130888U JP 1130888 U JP1130888 U JP 1130888U JP H01117899 U JPH01117899 U JP H01117899U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- groove
- depth
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 4
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1130888U JPH01117899U (es) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1130888U JPH01117899U (es) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117899U true JPH01117899U (es) | 1989-08-09 |
Family
ID=31219747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1130888U Pending JPH01117899U (es) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117899U (es) |
-
1988
- 1988-01-29 JP JP1130888U patent/JPH01117899U/ja active Pending