JPH01117068U - - Google Patents
Info
- Publication number
- JPH01117068U JPH01117068U JP1211188U JP1211188U JPH01117068U JP H01117068 U JPH01117068 U JP H01117068U JP 1211188 U JP1211188 U JP 1211188U JP 1211188 U JP1211188 U JP 1211188U JP H01117068 U JPH01117068 U JP H01117068U
- Authority
- JP
- Japan
- Prior art keywords
- inner circumferential
- aluminum pipe
- circumferential surface
- tapered
- connection ends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
図は本考案のアルミパイプ母線の接続部の一実
施例を示す縦断面図である。 １０，１１……アルミパイプ母線、１０ａ，１
１ａ……接続端部の内周面、１２……アルミ接続
体。
施例を示す縦断面図である。 １０，１１……アルミパイプ母線、１０ａ，１
１ａ……接続端部の内周面、１２……アルミ接続
体。
Claims (1)
- 対向する一対のアルミパイプ母線の各接続端部
の内周面が先細の傾斜状あるいは円弧状とされ、
かつこの奥部がねじ面とされ、前記各接続端部の
内周面および前記ねじ面に、これらの面に対応す
る形状のアルミ接続体が挿入されて前記各接続端
部の外周上を圧縮してなることを特徴とするアル
ミパイプ母線の接続部。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1211188U JPH01117068U (ja) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1211188U JPH01117068U (ja) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01117068U true JPH01117068U (ja) | 1989-08-08 |
Family
ID=31221264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1211188U Pending JPH01117068U (ja) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01117068U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9230826B2 (en) | 2010-08-26 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Etching method using mixed gas and method for manufacturing semiconductor device |
| US9257561B2 (en) | 2010-08-26 | 2016-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
-
1988
- 1988-01-29 JP JP1211188U patent/JPH01117068U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9230826B2 (en) | 2010-08-26 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Etching method using mixed gas and method for manufacturing semiconductor device |
| US9257561B2 (en) | 2010-08-26 | 2016-02-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |