JPH01117017U - - Google Patents
Info
- Publication number
- JPH01117017U JPH01117017U JP1126888U JP1126888U JPH01117017U JP H01117017 U JPH01117017 U JP H01117017U JP 1126888 U JP1126888 U JP 1126888U JP 1126888 U JP1126888 U JP 1126888U JP H01117017 U JPH01117017 U JP H01117017U
- Authority
- JP
- Japan
- Prior art keywords
- plastic film
- conductive paint
- shielded
- parts
- insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Communication Cables (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1126888U JPH057701Y2 (enrdf_load_stackoverflow) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1126888U JPH057701Y2 (enrdf_load_stackoverflow) | 1988-01-30 | 1988-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01117017U true JPH01117017U (enrdf_load_stackoverflow) | 1989-08-08 |
JPH057701Y2 JPH057701Y2 (enrdf_load_stackoverflow) | 1993-02-26 |
Family
ID=31219671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1126888U Expired - Lifetime JPH057701Y2 (enrdf_load_stackoverflow) | 1988-01-30 | 1988-01-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH057701Y2 (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US7033922B2 (en) | 2000-06-28 | 2006-04-25 | Applied Materials. Inc. | Method and system for controlling the presence of fluorine in refractory metal layers |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US7494908B2 (en) | 2001-09-26 | 2009-02-24 | Applied Materials, Inc. | Apparatus for integration of barrier layer and seed layer |
US7501343B2 (en) | 2000-06-27 | 2009-03-10 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
-
1988
- 1988-01-30 JP JP1126888U patent/JPH057701Y2/ja not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7501343B2 (en) | 2000-06-27 | 2009-03-10 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7033922B2 (en) | 2000-06-28 | 2006-04-25 | Applied Materials. Inc. | Method and system for controlling the presence of fluorine in refractory metal layers |
US7115494B2 (en) | 2000-06-28 | 2006-10-03 | Applied Materials, Inc. | Method and system for controlling the presence of fluorine in refractory metal layers |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US7494908B2 (en) | 2001-09-26 | 2009-02-24 | Applied Materials, Inc. | Apparatus for integration of barrier layer and seed layer |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
Also Published As
Publication number | Publication date |
---|---|
JPH057701Y2 (enrdf_load_stackoverflow) | 1993-02-26 |