JPH01117017U - - Google Patents

Info

Publication number
JPH01117017U
JPH01117017U JP1126888U JP1126888U JPH01117017U JP H01117017 U JPH01117017 U JP H01117017U JP 1126888 U JP1126888 U JP 1126888U JP 1126888 U JP1126888 U JP 1126888U JP H01117017 U JPH01117017 U JP H01117017U
Authority
JP
Japan
Prior art keywords
plastic film
conductive paint
shielded
parts
insulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1126888U
Other languages
English (en)
Japanese (ja)
Other versions
JPH057701Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1126888U priority Critical patent/JPH057701Y2/ja
Publication of JPH01117017U publication Critical patent/JPH01117017U/ja
Application granted granted Critical
Publication of JPH057701Y2 publication Critical patent/JPH057701Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Communication Cables (AREA)
JP1126888U 1988-01-30 1988-01-30 Expired - Lifetime JPH057701Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1126888U JPH057701Y2 (enrdf_load_stackoverflow) 1988-01-30 1988-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1126888U JPH057701Y2 (enrdf_load_stackoverflow) 1988-01-30 1988-01-30

Publications (2)

Publication Number Publication Date
JPH01117017U true JPH01117017U (enrdf_load_stackoverflow) 1989-08-08
JPH057701Y2 JPH057701Y2 (enrdf_load_stackoverflow) 1993-02-26

Family

ID=31219671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1126888U Expired - Lifetime JPH057701Y2 (enrdf_load_stackoverflow) 1988-01-30 1988-01-30

Country Status (1)

Country Link
JP (1) JPH057701Y2 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US7033922B2 (en) 2000-06-28 2006-04-25 Applied Materials. Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7033922B2 (en) 2000-06-28 2006-04-25 Applied Materials. Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7115494B2 (en) 2000-06-28 2006-10-03 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers

Also Published As

Publication number Publication date
JPH057701Y2 (enrdf_load_stackoverflow) 1993-02-26

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