JPH01116476U - - Google Patents
Info
- Publication number
- JPH01116476U JPH01116476U JP1161288U JP1161288U JPH01116476U JP H01116476 U JPH01116476 U JP H01116476U JP 1161288 U JP1161288 U JP 1161288U JP 1161288 U JP1161288 U JP 1161288U JP H01116476 U JPH01116476 U JP H01116476U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- periphery
- mounting
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1161288U JPH01116476U (lv) | 1988-01-30 | 1988-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1161288U JPH01116476U (lv) | 1988-01-30 | 1988-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01116476U true JPH01116476U (lv) | 1989-08-07 |
Family
ID=31220319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1161288U Pending JPH01116476U (lv) | 1988-01-30 | 1988-01-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01116476U (lv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03283699A (ja) * | 1990-03-30 | 1991-12-13 | Toppan Printing Co Ltd | プリント配線基板のソルダーコーティング方法 |
-
1988
- 1988-01-30 JP JP1161288U patent/JPH01116476U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03283699A (ja) * | 1990-03-30 | 1991-12-13 | Toppan Printing Co Ltd | プリント配線基板のソルダーコーティング方法 |