JPH01116472U - - Google Patents

Info

Publication number

JPH01116472U

JPH01116472U JP1232188U JP1232188U JPH01116472U JP H01116472 U JPH01116472 U JP H01116472U JP 1232188 U JP1232188 U JP 1232188U JP 1232188 U JP1232188 U JP 1232188U JP H01116472 U JPH01116472 U JP H01116472U

Authority

JP

Japan

Prior art keywords

hole

insulating substrate

bonding land

back surfaces

wiring board

Prior art date

1988-02-01

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims 6
• 230000000149 penetrating effect Effects 0.000 claims 1
• 230000002093 peripheral effect Effects 0.000 claims 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1