JPH01116467U - - Google Patents
Info
- Publication number
- JPH01116467U JPH01116467U JP1988011205U JP1120588U JPH01116467U JP H01116467 U JPH01116467 U JP H01116467U JP 1988011205 U JP1988011205 U JP 1988011205U JP 1120588 U JP1120588 U JP 1120588U JP H01116467 U JPH01116467 U JP H01116467U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- diode chip
- light emitting
- transmitting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988011205U JPH01116467U (US20100268047A1-20101021-C00003.png) | 1988-02-01 | 1988-02-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988011205U JPH01116467U (US20100268047A1-20101021-C00003.png) | 1988-02-01 | 1988-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01116467U true JPH01116467U (US20100268047A1-20101021-C00003.png) | 1989-08-07 |
Family
ID=31219552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988011205U Pending JPH01116467U (US20100268047A1-20101021-C00003.png) | 1988-02-01 | 1988-02-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01116467U (US20100268047A1-20101021-C00003.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100367182B1 (ko) * | 2001-01-04 | 2003-01-09 | 이성재 | 발광다이오드 램프 |
JP2009211327A (ja) * | 2008-03-03 | 2009-09-17 | Fenwall Controls Of Japan Ltd | 点灯装置及び煙感知器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508884B1 (US20100268047A1-20101021-C00003.png) * | 1970-07-13 | 1975-04-08 | ||
JPS5270783A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor luminescent unit |
-
1988
- 1988-02-01 JP JP1988011205U patent/JPH01116467U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508884B1 (US20100268047A1-20101021-C00003.png) * | 1970-07-13 | 1975-04-08 | ||
JPS5270783A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor luminescent unit |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100367182B1 (ko) * | 2001-01-04 | 2003-01-09 | 이성재 | 발광다이오드 램프 |
JP2009211327A (ja) * | 2008-03-03 | 2009-09-17 | Fenwall Controls Of Japan Ltd | 点灯装置及び煙感知器 |