JPH01116455U - - Google Patents
Info
- Publication number
- JPH01116455U JPH01116455U JP1149588U JP1149588U JPH01116455U JP H01116455 U JPH01116455 U JP H01116455U JP 1149588 U JP1149588 U JP 1149588U JP 1149588 U JP1149588 U JP 1149588U JP H01116455 U JPH01116455 U JP H01116455U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- slug
- jig
- array device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図及び第２図は、本考案に係るリード配列
装置の一実施例を示すもので、第１図は磁石の配
置を示す平面図、第２図は、リード配列装置の正
断面図である。第３図は本考案に係るリード配列
装置の他の実施例を示す正断面図である。第４図
はＤＨＤ型半導体装置の正断面図、第５図は、従
来のリード配列装置の正断面図である。
１……リード、２……スラグ、３……電子部品
素子、４……ガラススリーブ、５……下部治具、
６……リード挿通孔、７……上部治具、８……リ
ード挿通孔、２０……磁石。
1 and 2 show an embodiment of the lead array device according to the present invention, FIG. 1 is a plan view showing the arrangement of magnets, and FIG. 2 is a front sectional view of the lead array device. be. FIG. 3 is a front sectional view showing another embodiment of the lead arrangement device according to the present invention. FIG. 4 is a front sectional view of a DHD type semiconductor device, and FIG. 5 is a front sectional view of a conventional lead array device. 1...Lead, 2...Slag, 3...Electronic component element, 4...Glass sleeve, 5...Lower jig,
6... Lead insertion hole, 7... Upper jig, 8... Lead insertion hole, 20... Magnet.
Claims (1)
下一対の治具の下部治具に、一端にスラグを有す
る第１のスラグリードを挿通支持し治具上に突出
したスラグにガラススリーブを挿通すると共にス
ラグ端面に電子部品素子を載置し、第２のスラグ
リードを挿通した上部治具をスラグを下方にして
下部治具上に配置し、第２のスラグリードをガラ
ススリーブ内に収容し第１・第２のスラグリード
の各スラグ端面にて電子部品素子を挾持させるよ
うにしたリード配列装置において、上記上部治具
に挿入されたスラグリードを保持する磁石をリー
ド他端側の各リード間に配置したことを特徴とす
るリード配列装置。 A first slug lead having a slug at one end is inserted and supported through a lower jig of a pair of upper and lower jigs in which a large number of lead insertion holes are formed in a predetermined arrangement, and a glass sleeve is inserted through the slug protruding above the jig. At the same time, an electronic component element is placed on the end face of the slug, the upper jig with the second slug lead inserted is placed on the lower jig with the slug facing downward, and the second slug lead is housed in the glass sleeve. 1. In a lead array device in which an electronic component element is held between each slug end face of a second slug lead, a magnet that holds the slug lead inserted into the upper jig is inserted between each lead on the other end of the lead. A lead array device characterized in that the lead array device is arranged in a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1149588U JPH01116455U (en) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1149588U JPH01116455U (en) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116455U true JPH01116455U (en) | 1989-08-07 |
Family
ID=31220099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1149588U Pending JPH01116455U (en) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116455U (en) |
-
1988
- 1988-01-29 JP JP1149588U patent/JPH01116455U/ja active Pending
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