JPH01116178U - - Google Patents
Info
- Publication number
- JPH01116178U JPH01116178U JP1035788U JP1035788U JPH01116178U JP H01116178 U JPH01116178 U JP H01116178U JP 1035788 U JP1035788 U JP 1035788U JP 1035788 U JP1035788 U JP 1035788U JP H01116178 U JPH01116178 U JP H01116178U
- Authority
- JP
- Japan
- Prior art keywords
- packaging structure
- moisture permeable
- permeable material
- packaging
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Landscapes
- Packages (AREA)
Description
第１図は、本考案にかかる非透湿性材料による
梱包構造の外観図、第２図は、第１図のＰ矢視断
面図、第３図は、従来の梱包構造の断面図である
。
１……非透湿性材料（アルミ蒸着袋）、３……
プラスチツクケース、４……半導体部品、５……
乾燥剤（シリカゲル）、１１……透湿性材料（ビ
ニール袋等）。
FIG. 1 is an external view of a packaging structure made of a moisture-impermeable material according to the present invention, FIG. 2 is a sectional view taken along arrow P in FIG. 1, and FIG. 3 is a sectional view of a conventional packaging structure. 1... Moisture-impermeable material (aluminum vapor deposited bag), 3...
Plastic case, 4... Semiconductor parts, 5...
Desiccant (silica gel), 11... Moisture permeable material (plastic bag, etc.).
Claims (1)
して非透湿性材料を使用したことを特徴とする非
透湿性材料による梱包構造。 A packaging structure made of a non-moisture permeable material, characterized in that a non-moisture permeable material is used as a packaging material in a packaging structure for semiconductor parts, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1035788U JPH01116178U (en) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1035788U JPH01116178U (en) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116178U true JPH01116178U (en) | 1989-08-04 |
Family
ID=31217947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1035788U Pending JPH01116178U (en) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116178U (en) |
-
1988
- 1988-01-28 JP JP1035788U patent/JPH01116178U/ja active Pending