JPH01115934A - Crosslinking of molded resin article - Google Patents
Crosslinking of molded resin articleInfo
- Publication number
- JPH01115934A JPH01115934A JP27446387A JP27446387A JPH01115934A JP H01115934 A JPH01115934 A JP H01115934A JP 27446387 A JP27446387 A JP 27446387A JP 27446387 A JP27446387 A JP 27446387A JP H01115934 A JPH01115934 A JP H01115934A
- Authority
- JP
- Japan
- Prior art keywords
- crosslinking
- resin
- irradiation
- article
- molded resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 31
- 239000011347 resin Substances 0.000 title claims abstract description 31
- 238000004132 cross linking Methods 0.000 title claims abstract description 15
- 230000009477 glass transition Effects 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 238000010894 electron beam technology Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 abstract description 10
- 239000004677 Nylon Substances 0.000 abstract description 4
- 229920001778 nylon Polymers 0.000 abstract description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 4
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 4
- 239000003431 cross linking reagent Substances 0.000 description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical group C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101100452672 Solanum lycopersicum TIV1 gene Proteins 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005498 phthalate group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、例えば電子部品であるコンデンサ、ＩＣ１
抵抗などの電気要素や押ボタン、スライドスイッチ、端
子、コネクターなどの構成要素からなる部品本体あるい
は各部品部分を、熱可塑性樹脂をもって成形してなる樹
脂成形品の架橋方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a capacitor which is an electronic component, an IC1
This invention relates to a method for crosslinking resin molded products made by molding thermoplastic resin into component bodies or component parts including electrical elements such as resistors, push buttons, slide switches, terminals, connectors, and other components.
（従来の技術）
この種樹脂成形品の耐熱性を向上するために、例えば特
開昭６１−２４３６０４号公報には、電子線を照射する
ことによって樹脂の分子どうしを結合して三次元網目構
造を形成する放射線架橋方法が提案されており、これに
よれば無処理のものに比べ、その架橋度が増し、耐熱性
が向上しているっ（発明が解決しようとする問題点）
ところで、最近に至り、この種技術分骨において、樹脂
成形品のより耐熱性の向上が強く望まれている。(Prior art) In order to improve the heat resistance of this type of resin molded product, for example, Japanese Patent Application Laid-Open No. 61-243604 discloses that resin molecules are bonded together by irradiation with electron beams to form a three-dimensional network structure. A radiation crosslinking method has been proposed to form , and this method increases the degree of crosslinking and improves heat resistance compared to untreated products (the problem that the invention aims to solve). Therefore, in this type of technology, there is a strong desire to improve the heat resistance of resin molded products.
（問題点を解決するための手段）
この発明は、樹脂成形品に電子線を照射直後に、ガラス
転移点以上で融点以下の温度に保持することを特徴とす
る。(Means for Solving the Problems) The present invention is characterized in that immediately after irradiating a resin molded article with an electron beam, the resin molded article is maintained at a temperature above the glass transition point and below the melting point.
（作用）
電子線を照射直後に、ガラス転移点以上で融点以下の温
度に保持しているので、樹脂はゴム状になっており、電
子線照射によって生じたラジカルが動き易く、架橋効率
が向上すると推察される。(Function) Immediately after electron beam irradiation, the resin is kept at a temperature above the glass transition point and below the melting point, so the resin becomes rubber-like, allowing the radicals generated by electron beam irradiation to move easily, improving crosslinking efficiency. Then it is inferred.
なお、ガラス転移点より低い温度では、樹脂そのものが
ガラス状であり、電子線照射によって生じたラジカルが
動き難く、又融点を超える温度では、成形品の形状が変
形してしまい、所望の樹脂成形品が得られなくなる。Note that at temperatures lower than the glass transition point, the resin itself is glassy and radicals generated by electron beam irradiation are difficult to move, and at temperatures above the melting point, the shape of the molded product will deform, making it impossible to achieve the desired resin molding. products become unavailable.
（樹脂について）
熱可塑性樹脂としては、ポリエチレンテレフタレート樹
脂、ポリブチレンテレフタレート樹脂などの飽和ポリエ
ステル樹脂や、ナイロンなどのポリアミド樹脂や、ポリ
エチレン、ポリプロピレンなどのポリオレフィン樹脂な
どが利用できる。又、その用途に応じてガラス繊維から
なる補強助材やカーボンブラックなどからなる顔料など
の充填物を適当量混入してもよいのは勿論である。(Resin) As the thermoplastic resin, saturated polyester resins such as polyethylene terephthalate resin and polybutylene terephthalate resin, polyamide resins such as nylon, and polyolefin resins such as polyethylene and polypropylene can be used. It goes without saying that an appropriate amount of filler such as a reinforcing aid made of glass fiber or a pigment made of carbon black or the like may be mixed in depending on the intended use.
又、樹脂に１〜１０％（ｗｔ ）の架橋剤を添加するの
が好ましく、この架橋剤としては、放射線官能性の不飽
和結合を有する化合物を用いることができ、これを例示
すれば、ジアリルフタレート、トリアリルイソシアヌレ
ートなどのアリル基を２個以上含む化合物や、エチレン
グリコールジアクリレート、テトラエチレングリコール
ジアクリレートなどのアクリロイルを２個以上含む化合
物や、ポリエチレングリコールジメタクリレートなどの
メタクリロイル基を２個以上含む化合物がある。In addition, it is preferable to add 1 to 10% (wt) of a crosslinking agent to the resin, and as this crosslinking agent, a compound having a radiation-functional unsaturated bond can be used, such as diallyl. Compounds containing two or more allyl groups such as phthalate and triallyl isocyanurate, compounds containing two or more acryloyl groups such as ethylene glycol diacrylate and tetraethylene glycol diacrylate, and two methacryloyl groups such as polyethylene glycol dimethacrylate. There are compounds containing the above.
前記電子線照射線量は、被照射体の形状、太きさ、厚さ
、更には架橋剤の有無やその種類、添加量などによって
異なるが、通常６〜１００Ｍｒａｄが適当である。これ
が３Ｍｒａｄ未満では線量が少なすぎるし、１００Ｍｒ
ａｄをこえて照射しても、それ以上の効果は期待出来ず
、逆に電子線照射装置の容量増大を招いたり、照射時間
を長くする必要があり、不経済である。The electron beam irradiation dose varies depending on the shape, size, and thickness of the object to be irradiated, as well as the presence or absence of a crosslinking agent, its type, amount added, etc., but is normally 6 to 100 Mrad. If this is less than 3 Mrad, the dose is too small, and 100 Mrad
Even if the electron beam is irradiated beyond ad, no further effect can be expected; on the contrary, the capacity of the electron beam irradiation device will be increased, or the irradiation time will have to be lengthened, which is uneconomical.
なお、この明細書において架橋度とは、次のように定義
したものをいう。すなわち、試料をオルソクロロフェノ
ール（１２０°Ｃ）に６時間浸漬し、そのあと不溶解分
をろ紙によりろ過してからろ紙量上の残渣に含まれる溶
剤（オルソクロロフェノール）が、１００’ｃｘ０．０
１ｍＨ，９で恒量になるまで乾燥し、その後不溶解物の
重量を測定する。そして、浸漬前の初期型ｉＷ１と不溶
解物の重量Ｗ２とから（Ｗ２／ＴＩＶ１） ｘ １００
（％）によってゲル分率を求め、このゲル分率をもって
架橋度とした。In this specification, the degree of crosslinking is defined as follows. That is, the sample is immersed in orthochlorophenol (120°C) for 6 hours, and then the insoluble matter is filtered through filter paper, and the solvent (orthochlorophenol) contained in the residue on the filter paper is 100'c 0
Dry at 1 mH, 9°C until constant weight is reached, and then measure the weight of the undissolved matter. Then, from the initial type iW1 before immersion and the weight W2 of the undissolved material, (W2/TIV1) x 100
(%) to determine the gel fraction, and this gel fraction was defined as the degree of crosslinking.
（実施例） 以下この発明の一実施例を第１図に基すいて説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.
１は樹脂成形品である被照射物で、搬送装置２をもって
照射室６内に搬入され、電子照射装置４により電子線が
照射される。そして、被照射物１は、照射直後ガラス転
移点以上で融点以下の温度に保持されたシリコーン油な
どの油５が充填された油槽６内に所望時間浸漬され、搬
出用の搬送袋！！！７により照射室６外に搬出されて架
橋処理を終える。Reference numeral 1 denotes an object to be irradiated, which is a resin molded product, which is carried into an irradiation chamber 6 with a transport device 2, and is irradiated with an electron beam by an electron irradiation device 4. Immediately after irradiation, the object 1 to be irradiated is immersed in an oil tank 6 filled with oil 5 such as silicone oil maintained at a temperature above the glass transition point and below the melting point for a desired period of time, and is then placed in a transport bag for transport. ! ! 7, it is carried out of the irradiation chamber 6 and the crosslinking process is completed.
（実験例１）
ポリエチレンテレフタレート樹脂に架橋剤としてトリア
リルイソシアヌレートを３９６ （ｗｔ ）添加し、射
出成形により第２図に示すスライドスイッチのスライド
片（供試品Ａ、Ｂ）を作った。(Experimental Example 1) 396 (wt) triallylisocyanurate was added as a crosslinking agent to polyethylene terephthalate resin, and slide pieces of a slide switch (specimens A and B) shown in FIG. 2 were made by injection molding.
これら供試品Ａ、 Ｂに、７５０ＫＶ、 ３０ｍＡ Ｏ
）’ｉｔ子線照射装置を用いて電子線を４０ Ｍｒ ａ
ｄ照射し、供試品Ａは照射直後に１００°Ｃのシリコー
ン油中に５分間浸漬した。又供試品Ｂは、照射後室温中
に放置した。750KV, 30mA O to these test products A and B
)' It uses an electron beam irradiation device to emit an electron beam of 40 Mr a
Immediately after the irradiation, the sample A was immersed in silicone oil at 100°C for 5 minutes. Further, sample B was left at room temperature after irradiation.
これら供試品Ａ、 Ｈの架橋度を測定した結果、供試品
Ａは７５（％）、供試品Ｂは４０９６であった。As a result of measuring the degree of crosslinking of these samples A and H, the degree of crosslinking was 75 (%) for sample A and 4096 for sample B.
なお、ポリエチレンテレフタレート樹脂のガラス転位点
は８２℃、融点は２２０℃である。Note that the glass transition point of polyethylene terephthalate resin is 82°C, and the melting point is 220°C.
（実験例２）
６−ナイロン樹脂に架橋剤としてトリアリルイソシアヌ
レートを１％（ｗｔ）添加し、射出成形により第２図に
示すスライドスイッチのスライド片（供試品Ｃ，Ｄ）を
作った。(Experiment Example 2) 1% (wt) triallylisocyanurate was added as a crosslinking agent to 6-nylon resin, and slide pieces of the slide switch shown in Figure 2 (specimens C and D) were made by injection molding. .
これら供試品Ｃ２Ｄニ、７５０ＫＶ、 ３０ｍＡノ１を
子線照射装置を用いて電子線をＩＭｒａｄ照射し、供試
品Ｃは照射直後に１００°Ｃのシリコーン油中に５分間
浸漬した。又供試品りは、照射後室温中に放置した。These specimens C2D were irradiated with IMrad electron beams at 750 KV and 30 mA using an irradiation device, and immediately after the irradiation, specimen C was immersed in silicone oil at 100° C. for 5 minutes. The test sample was left at room temperature after irradiation.
これら供試品Ｃ，Ｄの架橋度を測定した結果、供試品Ｃ
は９２ （％） 、供試品りは５６％であった。As a result of measuring the degree of crosslinking of these specimens C and D, it was found that specimen C
was 92 (%), and the test sample was 56%.
なお、６−ナイロンのガラス転位点は７０ ’Ｃ、融点
は２１５°Ｃである。Note that the glass transition point of 6-nylon is 70'C, and the melting point is 215C.
（実験例６）
ポリブチレンテレフタレート樹脂に架橋剤としてトリア
リルイソシアヌレートを６％（ｗｔ）添加し、射出成形
により第２図に示すスライドスイッチのスライド片（供
試品Ｅ、Ｆ）を作った。(Experimental Example 6) 6% (wt) triallylisocyanurate was added as a crosslinking agent to polybutylene terephthalate resin, and slide pieces of the slide switch shown in Figure 2 (specimens E and F) were made by injection molding. .
これら供試品Ｅ、Ｆに、７５０ＫＶ、３０ｍＡの電子線
照射装置を用いて電子線を４０Ｍｒａｄ照射し、供試品
Ｅは照射直後に１００℃のシリコーン油中に１０分間浸
漬した。又供試品Ｆは、照射後室温中に放置した。These specimens E and F were irradiated with an electron beam of 40 Mrad using a 750 KV, 30 mA electron beam irradiation device, and immediately after the irradiation, specimen E was immersed in silicone oil at 100° C. for 10 minutes. Further, sample F was left at room temperature after irradiation.
これら供試品Ｅ、Ｆの架橋度を測定した結果、供試品Ｅ
は７５（％）、供試品Ｆは４０％であった。As a result of measuring the degree of crosslinking of these specimens E and F, it was found that specimen E
was 75 (%), and Sample F was 40%.
なお、ポリブチレンテレフタレート樹脂のガラス転位点
は７６°Ｃ，ｌｌｌｌ点は２０５°Ｃである。Note that the glass transition point of polybutylene terephthalate resin is 76°C, and the lllll point is 205°C.
（発明の効果）
以上詳述したようにこの発明によれば、きわめて簡単に
樹脂成形品の架橋度を向上することができ、その耐熱性
を十分高めることができる、(Effects of the Invention) As detailed above, according to the present invention, the degree of crosslinking of a resin molded product can be improved very easily, and its heat resistance can be sufficiently increased.
第１図はこの発明の一実施例を説明するための概略構成
図である。第２図は実験例１〜６に使用した供試品Ａ〜
Ｆを示す図で、（イ）は正面図、（ロ）は側面図である
。
１：樹脂成形品（被照射物）、４：電子線照射装置。FIG. 1 is a schematic configuration diagram for explaining an embodiment of the present invention. Figure 2 shows sample A~ used in Experimental Examples 1~6.
FIG. 5 is a diagram showing F, in which (a) is a front view and (b) is a side view. 1: Resin molded product (irradiated object), 4: Electron beam irradiation device.
Claims (1)
融点以下の温度に保持することを特徴とする樹脂成形品
の架橋方法。1. A method for crosslinking a resin molded article, which comprises maintaining the resin molded article at a temperature above the glass transition point and below the melting point immediately after irradiating the resin molded article with an electron beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27446387A JPH01115934A (en) | 1987-10-29 | 1987-10-29 | Crosslinking of molded resin article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27446387A JPH01115934A (en) | 1987-10-29 | 1987-10-29 | Crosslinking of molded resin article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115934A true JPH01115934A (en) | 1989-05-09 |
Family
ID=17542034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27446387A Pending JPH01115934A (en) | 1987-10-29 | 1987-10-29 | Crosslinking of molded resin article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115934A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350503A (en) * | 2004-06-08 | 2005-12-22 | Japan Atom Energy Res Inst | Highly efficient crosslinking method for biodegradable polyester |
| WO2009041335A1 (en) * | 2007-09-27 | 2009-04-02 | Toray Industries, Inc. | Polymer alloy and process for producing the same |
| JP2009221413A (en) * | 2008-03-18 | 2009-10-01 | Japan Atomic Energy Agency | Process of manufacturing heat-resistant biodegradable polyester |
| US20110130484A1 (en) * | 2008-05-29 | 2011-06-02 | Sekisui Chemical Co., Ltd. | Process for producing polymer alloy and polymer alloy |
| WO2016027810A1 (en) * | 2014-08-18 | 2016-02-25 | 大日本印刷株式会社 | Composite manufacturing method, electron beam irradiation rack, electron beam irradiation package, electron beam irradiation method, and method for manufacturing multiple mounted component of lead frame with resin |
| JP2019527644A (en) * | 2016-06-10 | 2019-10-03 | イー−ビーム・サービシーズ・インコーポレイテッド | Heat treatment of irradiated material solid using heat transfer liquid |
-
1987
- 1987-10-29 JP JP27446387A patent/JPH01115934A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005350503A (en) * | 2004-06-08 | 2005-12-22 | Japan Atom Energy Res Inst | Highly efficient crosslinking method for biodegradable polyester |
| KR101278404B1 (en) * | 2007-09-27 | 2013-06-24 | 도레이 카부시키가이샤 | Polymer alloy and process for producing the same |
| EP2194100A1 (en) * | 2007-09-27 | 2010-06-09 | Toray Industries, Inc. | Polymer alloy and process for producing the same |
| JPWO2009041335A1 (en) * | 2007-09-27 | 2011-01-27 | 東レ株式会社 | Polymer alloy and production method thereof |
| EP2194100A4 (en) * | 2007-09-27 | 2011-05-18 | Toray Industries | Polymer alloy and process for producing the same |
| JP5029613B2 (en) * | 2007-09-27 | 2012-09-19 | 東レ株式会社 | Method for producing polymer alloy |
| US8338547B2 (en) | 2007-09-27 | 2012-12-25 | Toray Industries, Inc. | Polymer alloy and production method thereof |
| WO2009041335A1 (en) * | 2007-09-27 | 2009-04-02 | Toray Industries, Inc. | Polymer alloy and process for producing the same |
| JP2009221413A (en) * | 2008-03-18 | 2009-10-01 | Japan Atomic Energy Agency | Process of manufacturing heat-resistant biodegradable polyester |
| US20110130484A1 (en) * | 2008-05-29 | 2011-06-02 | Sekisui Chemical Co., Ltd. | Process for producing polymer alloy and polymer alloy |
| WO2016027810A1 (en) * | 2014-08-18 | 2016-02-25 | 大日本印刷株式会社 | Composite manufacturing method, electron beam irradiation rack, electron beam irradiation package, electron beam irradiation method, and method for manufacturing multiple mounted component of lead frame with resin |
| JP2019527644A (en) * | 2016-06-10 | 2019-10-03 | イー−ビーム・サービシーズ・インコーポレイテッド | Heat treatment of irradiated material solid using heat transfer liquid |
| US10703867B2 (en) | 2016-06-10 | 2020-07-07 | E-Beam Services, Inc. | Thermal treatment of irradiated material solids using a heat transfer liquid |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4344981A (en) | Method for modifying surface properties of a shaped article of a silicone | |
| US4317788A (en) | Method for modifying surface properties of a shaped article of an acrylic resin | |
| US3264202A (en) | Ionizing radiation of water solution of polyalkylene oxide and product thereof | |
| JPH01115934A (en) | Crosslinking of molded resin article | |
| DE3019391C2 (en) | Process for modifying the surface properties of prefabricated parts made of vinyl chloride resins | |
| DE2930030A1 (en) | METHOD FOR SUPPRESSING SOFTENER EXHAUST ON PVC MOLDED PARTS | |
| JPS5912936A (en) | Crosslinked polyamide resin composition | |
| US4272464A (en) | Method for preventing plasticizer bleeding on polyvinyl chloride shaped articles | |
| KR20060032575A (en) | Molded resin for electrical part and process for producing the same | |
| Traitler et al. | Application of silane-coupling agents for medium-polarity capillary columns | |
| JPS5912935A (en) | Crosslinked polyamide resin formed product | |
| US3215671A (en) | Crosslinked polyoxymethylenes and their preparation | |
| GB1566552A (en) | Swellable polymers | |
| US3464952A (en) | Polyethylene stabilized by treatment with sulfur dioxide in the presence of free radicals | |
| DE3722602A1 (en) | METHOD FOR PRODUCING SHAPED PARTS BASED ON SILICON OXYCARBIDE | |
| US4638019A (en) | Method for radical cross-linking of organic polymers | |
| US5492761A (en) | Heat-resistant coated electrically conductive wire | |
| DE2353495B2 (en) | METHOD FOR GENERATING A HYDROPHILIC SURFACE ON POLYSILOXANE ELASTOMERS | |
| DE2930434C2 (en) | Method of making records | |
| JPS61243604A (en) | Electronic component | |
| DE2611349C2 (en) | Process for crosslinking plastics | |
| JPS6030339B2 (en) | Method for modifying 4↓-methyl↓-1↓-pentene polymer | |
| JP2917391B2 (en) | Manufacturing method of resin molded products with reduced residual stress | |
| Rao | Radiation processing of polymers | |
| JPS638582B2 (en) |