JPH01115829A - Forming mold for glass molded article - Google Patents
Forming mold for glass molded articleInfo
- Publication number
- JPH01115829A JPH01115829A JP27091387A JP27091387A JPH01115829A JP H01115829 A JPH01115829 A JP H01115829A JP 27091387 A JP27091387 A JP 27091387A JP 27091387 A JP27091387 A JP 27091387A JP H01115829 A JPH01115829 A JP H01115829A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- surface layer
- glass
- nitride
- dispersing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 34
- 239000002344 surface layer Substances 0.000 claims abstract description 34
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 13
- 150000004767 nitrides Chemical class 0.000 claims abstract description 12
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 24
- 239000010931 gold Substances 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 238000007496 glass forming Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000000306 component Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000005304 optical glass Substances 0.000 description 4
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910004542 HfN Inorganic materials 0.000 description 1
- 229910000575 Ir alloy Inorganic materials 0.000 description 1
- 229910019794 NbN Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910008322 ZrN Inorganic materials 0.000 description 1
- JAZCEXBNIYKZDI-UHFFFAOYSA-N [Ir+] Chemical compound [Ir+] JAZCEXBNIYKZDI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/26—Mixtures of materials covered by more than one of the groups C03B2215/16 - C03B2215/24, e.g. C-SiC, Cr-Cr2O3, SIALON
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/30—Intermediate layers, e.g. graded zone of base/top material
- C03B2215/32—Intermediate layers, e.g. graded zone of base/top material of metallic or silicon material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、ガラスをプレス成形するための成形型に関し
、特に、プレス成形後に研摩を必要としない高精度のガ
ラス成形体に成形するだめの成形型に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a mold for press-molding glass, and in particular to a mold for forming a high-precision glass molded body that does not require polishing after press-forming. Regarding molds.
(従来の技術)
一般に、プレス成形によるガラスの成形では、所定の表
面形状(例えば球面または非球面)に仕上げた表面層を
存する成形型内に、予め軟化させた被成形ガラスを入れ
(または被成形ガラスを成彫型に入れてから加熱・軟化
させ)、この成形型に所定の圧力を加えることによって
、成形型の表面層が被成形ガラスに転写される。したが
って、成形型は、その表面層の形状がガラス成形体の表
面形状としてそのまま転写されることから、その表面層
に気孔等の欠陥がなく、緻密で鏡面状に精密加工するこ
とができ、かつ高温において十分な硬度および強度を保
てる等の要件を満たすことが求められる。(Prior art) In general, when forming glass by press molding, pre-softened glass to be formed is placed (or The surface layer of the mold is transferred to the glass to be molded by placing the molded glass in a mold and then heating and softening it, and applying a predetermined pressure to the mold. Therefore, since the shape of the surface layer of the mold is directly transferred as the surface shape of the glass molded object, the surface layer of the mold has no defects such as pores, and can be precisely processed into a dense and mirror-like surface. It is required to meet requirements such as maintaining sufficient hardness and strength at high temperatures.
このような成形型の材料としては、従来、シリコンカー
バイド(S i C)やシリコンナイトライド(St3
NJ)(特開昭52−45613号公報)、タングステ
ンカーバイド(特開昭56−59641号公報)、ジル
コニウムオキサイド(ZrOz)を基盤材料とし、その
上に白金−ロジウム(Pt−Rh)合金または白金−イ
リジウム(P t −I r)合金のコーテイング膜を
形成したもの(特開昭60−176930号公報)が提
案されている。Conventionally, materials for such molds include silicon carbide (S i C) and silicon nitride (St3).
NJ) (Japanese Unexamined Patent Publication No. 52-45613), tungsten carbide (Japanese Unexamined Patent Application No. 56-59641), zirconium oxide (ZrOz) as a base material, and platinum-rhodium (Pt-Rh) alloy or platinum - A method in which a coating film of an iridium (Pt-Ir) alloy is formed has been proposed (Japanese Patent Application Laid-open No. 176930/1983).
(発明が解決しようとする問題点)
しかし、シリコンカーバイドやシリコンナイトライドを
表面層とする成形型は、緻密で、かつ硬度および強度の
点ですぐれているものの、被成形ガラスに鉛を多量に含
有する重フリント系光学ガラスを使用した場合、鉛との
化学反応性が高く、高精度のガラス成形体に成形するこ
とが困難となる。(Problem to be solved by the invention) However, although molds with a surface layer of silicon carbide or silicon nitride are dense and have excellent hardness and strength, they contain a large amount of lead in the glass to be molded. When a heavy flint-based optical glass containing lead is used, it has high chemical reactivity with lead, making it difficult to mold into a high-precision glass molded body.
次に、タングステンカーバイドの成形型は、加工性にす
ぐれるが、高温下で酸化しやすく、型表面が肌荒れを起
こし、光学表面を保持することができない。また、被成
形ガラスと反応しやすい問題もあった。Next, although tungsten carbide molds have excellent workability, they are susceptible to oxidation at high temperatures, causing roughness on the mold surface and making it impossible to maintain an optical surface. There was also the problem that it easily reacted with the glass to be formed.
また、白金−ロジウムまたは白金−イリジウムの合金の
コーテイング膜を形成したものは、被成形ガラスとの化
学作用を起こさないことが利点として挙げられているが
、本発明者らの実験によれば、ガラス成形体との離型性
がプレス成形開始当初から悪いという問題があった。In addition, it is said that the advantage of coatings formed with platinum-rhodium or platinum-iridium alloys is that they do not cause chemical reactions with the glass to be formed, but according to experiments conducted by the present inventors, There has been a problem in that mold releasability from the glass molded product has been poor since the beginning of press molding.
(問題点を解決するための手段)
本発明によるガラス成形体の成形型は、成形型の表面層
を白金(Pt)と金(Au)の少なくとも2成分からな
る物質に窒化物が分散されて形成されているものである
。(Means for Solving the Problems) A mold for a glass molded article according to the present invention has a surface layer of the mold in which nitride is dispersed in a substance consisting of at least two components, platinum (Pt) and gold (Au). It is being formed.
なお、好ましくは白金(Pt)と金(Au)の少なくと
も2成分からなる前記物質が金(Au)を5〜45wt
%含み、前記窒化物がT i N、 T a N。Preferably, the substance consisting of at least two components of platinum (Pt) and gold (Au) contains 5 to 45 wt of gold (Au).
%, and the nitride is T i N, T a N.
AI!N、BN、S i、N4、HfN、NbN。AI! N, BN, Si, N4, HfN, NbN.
ZrNから選ばれた少なくとも一つからなり、その分散
量が0.02〜30vo 1%であり、さらに前記表面
層と下地の基盤との間に、ニッケル(Ni)、チタン(
Ti)、クロム(Cr)、モリブデン(Mo)、コバル
ト (Co)、チタンナイトライド(TiN)、チタン
カーバイド(TiC)、シリコンカーバイド(SiC)
およびこれらの混合物のうちから選択された少なくとも
一つを含む中間層を介在させたものである。It is made of at least one selected from ZrN, and has a dispersion amount of 0.02 to 30vo 1%, and further contains nickel (Ni), titanium (
Ti), chromium (Cr), molybdenum (Mo), cobalt (Co), titanium nitride (TiN), titanium carbide (TiC), silicon carbide (SiC)
and an intermediate layer containing at least one selected from a mixture thereof.
これらの表面層や中間層は、所定形状に加工された基盤
上にスパッタリング法、イオンブレーティング法などに
より形成される。膜厚は0.05〜lOμm程度が好ま
しい。薄すぎると均一な膜が得にり<、厚すぎると成膜
時間を長(するのみならず、膜の表面状態が荒れてくる
。These surface layers and intermediate layers are formed on a substrate processed into a predetermined shape by a sputtering method, an ion blasting method, or the like. The film thickness is preferably about 0.05 to 10 μm. If it is too thin, a uniform film will not be obtained; if it is too thick, not only will it take longer to form the film, but the surface of the film will become rough.
なお、表面層材料として、金の他に、イリジウム(I
r) 、ロジづム(Rh)、およびオスミウム(O3)
、ルテニウム(Ru)パラジウム(Pd)などを加えた
白金合金に窒化物を分散させれば、−層高温のプレスで
の使用に耐えるようになる。In addition to gold, iridium (I) is used as the surface layer material.
r), rhodium (Rh), and osmium (O3)
If nitride is dispersed in a platinum alloy containing ruthenium (Ru), palladium (Pd), etc., the layer can withstand use in high-temperature presses.
成形型の基盤材料については、基盤として一般に要求さ
れる硬度、強度および耐熱性等を満足するものであれば
特に限定されず、ステンレス鋼、タングステンカーバイ
ド(WC)、ジルコニウムオキサイド(ZrOz)、サ
ーメット、シリコンカーバイド(S i C)およびシ
リコンナイトライド(SisN4)などが使用可能であ
る。また、プレス成形時の圧力が基盤の変形に問題にな
らない程度であれば、この基盤材料は、上述した表面層
や中間層の各物質と同一の合金等を用いてもよい。The base material of the mold is not particularly limited as long as it satisfies the hardness, strength, heat resistance, etc. generally required for a base, and examples include stainless steel, tungsten carbide (WC), zirconium oxide (ZrOz), cermet, Silicon carbide (S i C) and silicon nitride (SisN4) can be used. Further, as long as the pressure during press molding does not cause a problem in deformation of the base, the base material may be the same alloy as the materials of the above-mentioned surface layer and intermediate layer.
(作用)
本発明の成形型の表面層は、緻密性、硬度、強度、加工
性および耐化学反応性のそれぞれにおいて良好であるば
かりでなく、プレス成形されたガラス成形体との離型性
も良好になり、さらに結晶成長を抑え膜の荒れを抑える
。すなわち、白金−金合金(白金50wt%以上、金5
〜45wt%)中に窒化物、具体的にはTiN5 Ta
N、AlNx BN。(Function) The surface layer of the mold of the present invention not only has good density, hardness, strength, workability, and chemical reaction resistance, but also has good releasability from a press-molded glass molded body. In addition, crystal growth is suppressed and film roughness is suppressed. That is, platinum-gold alloy (platinum 50 wt% or more, gold 5
~45wt%), specifically TiN5Ta
N, AlNx BN.
Si、N、、HfN、NbN、ZrNなどを分散させる
ことにより、特にガラス成形体との離型性を向上させる
とともに、面精度を保持することができる。その分散を
0.02〜30vo 1%としたのは、窒化物が0.0
2vol%未満では硬度が低くなり傷が発生しやすく、
また分散効果により結晶成長を抑え、膜の荒れを抑える
効果が十分に得られに<(、−方、30vol%を越え
ると、ガラス成形体との離型性が悪くなるためである。By dispersing Si, N, HfN, NbN, ZrN, etc., it is possible to particularly improve mold releasability from the glass molded body and maintain surface accuracy. The reason why the dispersion was set to 0.02 to 30vo 1% is that the nitride is 0.0
If it is less than 2 vol%, the hardness will be low and scratches will easily occur.
In addition, if the dispersion effect suppresses crystal growth and prevents film roughness, if the amount exceeds 30 vol%, the releasability from the glass molded body will deteriorate.
また、中間層は基盤と表面層との親和性を高め、型寿命
を長くする作用を有する。Further, the intermediate layer has the effect of increasing the affinity between the base and the surface layer and extending the life of the mold.
(実施例)
第1図は本発明の一実施例を示す成形型の断面図である
。成形型は、上型1と下型2とから構成される。上型l
と下型2とは、それぞれその外周面が案内型3の内周面
上を滑動するように、案内型3の内部に配置されている
。これらの上型1および下型2は、それぞれ基盤1aと
表面層1bおよび基盤2aと表面層2bからなり、表面
層1b。(Example) FIG. 1 is a sectional view of a mold showing an example of the present invention. The mold is composed of an upper mold 1 and a lower mold 2. Upper mold l
and the lower mold 2 are arranged inside the guide mold 3 so that their outer peripheral surfaces slide on the inner peripheral surface of the guide mold 3. These upper mold 1 and lower mold 2 each consist of a base 1a and a surface layer 1b, and a base 2a and a surface layer 2b.
2bを相互に対向させて配置しである。2b are arranged facing each other.
基盤1a、2aは、焼結時にHI P処理を施して緻密
にしたタングステンカーバイドを用い、これを円柱状(
直径18 m、高さ28mm)に加工し、その一端面を
凹球面状に研削し、最終仕上げとしてダイヤモンド砥石
により高精度の光学鏡面に研磨し、それぞれ所定の曲率
半径(32mm)の凹球面に加工した。この凹球面の面
粗さは100Å以下であった。The bases 1a and 2a are made of tungsten carbide that has been made dense by HIP treatment during sintering, and is made into a cylindrical shape (
18 m in diameter and 28 mm in height), one end surface of which was ground into a concave spherical shape, and as a final finish, polished to a high-precision optical mirror surface using a diamond grindstone, each having a predetermined radius of curvature (32 mm). processed. The surface roughness of this concave spherical surface was 100 Å or less.
この基!1a、2aの凹球面に対し、スパッタリング装
置を用い、表に示した実施例1〜21の物質組成のター
ゲットを使用し、所定の成膜条件で所定の厚さの表面層
1b、2bを形成した。なお、その際、基盤1a、2a
と表面層1b、2bとの密着性を一層強固にするために
、表面11b、2bの成膜に先立って、逆スパツタリン
グにより基盤1a、2aの各表面を清浄化することは有
効である。This base! Form surface layers 1b and 2b of a predetermined thickness on the concave spherical surfaces 1a and 2a under predetermined film forming conditions using a sputtering device and using targets having the material compositions of Examples 1 to 21 shown in the table. did. In addition, in that case, the bases 1a, 2a
In order to further strengthen the adhesion between the substrates 1a and 2b, it is effective to clean each surface of the substrates 1a and 2a by reverse sputtering prior to forming the surfaces 11b and 2b.
例えば、実施例1ではアルゴンガス圧1×107’o
r rs白合−金5wt%、DCIKW、500人/m
1nsチタンナイトライド、RF 400W、 5人/
m1n(分散1 vol%)、電極間距離100mm、
回転数2゜rpmで行い、膜厚は0.5μmであった。For example, in Example 1, the argon gas pressure is 1 x 107'o
r rs white alloy 5wt%, DCIKW, 500 people/m
1ns titanium nitride, RF 400W, 5 people/
m1n (dispersion 1 vol%), distance between electrodes 100 mm,
The rotation speed was 2° rpm, and the film thickness was 0.5 μm.
また、本実施例では白金−金、チタンナイトライド別々
のターゲットを同時にスパッタを行う二元スパッタリン
グについて述べたが2種のターゲットをモザイク状に配
置してその面積比で分散を調整する複合ターゲットを使
用しても良いものである。またターゲットそのものが分
散型になっているものでもかまわない。いずれにしても
各々のスパッタ率を考慮して組合わせる。In addition, in this example, binary sputtering was described in which separate targets for platinum, gold, and titanium nitride are sputtered simultaneously, but a composite target in which two types of targets are arranged in a mosaic pattern and the dispersion is adjusted by the area ratio is also available. It is good to use. Furthermore, the target itself may be decentralized. In any case, the sputtering rates of each are considered and combined.
なお、案内型3は本実施例では上型・下型の基盤1a、
2aと同様のタングステンカーバイドで構成されている
。In addition, in this embodiment, the guide mold 3 is the base plate 1a of the upper mold and the lower mold,
It is made of tungsten carbide similar to 2a.
第2図は、本発明の他の実施例を示す成形型の断面図で
ある。本実施例の上型1′および下型2′は、それぞれ
基盤1aと表面層1bとの間および基盤2aと表面層2
bとの間に、第1中間層ICと第2中間FiIidおよ
び第1中間層2Cと第2中間Jlff12dが介在させ
である点で、第1図の上型1および下型2と相違するが
、その他は構造上同一である。中間層は、2層図示した
が、1層のみまたは3層以上にしてもよい。表に、中間
層を1層のみとした例を実施例11〜13.16〜19
および21として示し、中間層を2層とした例を実施例
14.15および20として示した。FIG. 2 is a sectional view of a mold showing another embodiment of the present invention. The upper mold 1' and the lower mold 2' of this embodiment are arranged between the base 1a and the surface layer 1b and between the base 2a and the surface layer 2, respectively.
This is different from the upper mold 1 and the lower mold 2 in FIG. 1 in that the first intermediate layer IC and the second intermediate FiIid and the first intermediate layer 2C and the second intermediate Jlff 12d are interposed between the upper mold 1 and the lower mold 2 shown in FIG. , otherwise the structure is the same. Although two intermediate layers are illustrated, the intermediate layer may include only one layer or three or more layers. Examples 11 to 13 and 16 to 19 with only one intermediate layer are shown in the table.
and 21, and Examples 14, 15 and 20 are examples in which the intermediate layer is two layers.
これらの中間層および表面層は、例えば実施例11では
、基盤1a、2aをイオンエツチングした後、イオンブ
レーティング法により、所定の成膜条件(真空度5 x
to−”r o r r 、成膜速度300人/win
−,基盤電圧−300V )でチタンからなる第1中間
層1c、2c(膜厚0.05μm)を成膜した後、その
上にスパッタリング法により白金(95ht%)−金5
wt%とチタンナイトライド(T i N)をターゲッ
トとし、所定の成膜条件(前記)で表面層lb、2b(
膜厚3.0μm)を成膜することにより形成した。For example, in Example 11, these intermediate layers and surface layers are formed by ion etching the substrates 1a and 2a, and then using the ion blating method under predetermined film forming conditions (degree of vacuum 5 x
to-”r o r r, film-forming rate 300 people/win
After forming the first intermediate layers 1c and 2c (thickness: 0.05 μm) made of titanium at a voltage of −300 V and a substrate voltage of −300 V, platinum (95 ht%)-gold 5
wt% and titanium nitride (T i N) as targets, surface layers lb, 2b (
It was formed by forming a film with a film thickness of 3.0 μm).
また、実施例20においては、基盤1a、2aをイオン
エツチングした後、その凹球面上にイオンブレーティン
グ法により、所定の成膜条件(チッ素ガス圧5 xlO
−’T o r r 、成膜速度300人/lll1n
s基盤電圧−300V )でチタンナイトライドからな
る第2中間[1d、2d (膜厚0.3.crm)を成
膜した。次いで、スパッタリング法により所定の成膜条
件(アルゴンガス圧1 xto−”r o r r 、
成膜速度400人/m1n)でニッケルからなる第1中
間層lc、2c(膜厚0.05μm)を成膜し、引続き
同様の方法により、白金(80wt%)−金(10wt
%)−イリジウム(10wt%)合金とチタンナイトラ
イド(T i N)をターゲットとし、所定の成膜条件
(前記)で表面層1b、2b(膜厚1.0μm)を成膜
した。In Example 20, after the substrates 1a and 2a were ion-etched, a film was formed on the concave spherical surface by the ion-blating method under predetermined film-forming conditions (nitrogen gas pressure of 5 x lO
-'T o r r, film formation rate 300 people/lll1n
A second intermediate layer [1d, 2d (film thickness: 0.3 crm) made of titanium nitride was formed at a substrate voltage of −300 V). Next, a sputtering method was applied under predetermined film-forming conditions (argon gas pressure 1 x to "r o r r,
First intermediate layers lc and 2c (thickness: 0.05 μm) made of nickel were formed at a deposition rate of 400 people/m1n), and then platinum (80 wt%)-gold (10 wt%) was formed using the same method.
%)-iridium (10 wt%) alloy and titanium nitride (T i N) as targets, surface layers 1b and 2b (film thickness 1.0 μm) were formed under the predetermined film forming conditions (described above).
その他の実施例もこれらとほぼ同様の方法により中間層
および表面層を形成した。−
(以下余白)
次にこのような成形型の使用方法を、第1図の成形型を
例に説明する。In other Examples, the intermediate layer and surface layer were formed by substantially the same method as these. - (The following is a blank space) Next, how to use such a mold will be explained using the mold shown in FIG. 1 as an example.
第3図は、プレス成形機の主要部を示す断面図である。FIG. 3 is a sectional view showing the main parts of the press molding machine.
このプレス成形機は上述した上型1.下型2および案内
型3を備え、下型2の上に被成形ガラス4が置かれる。This press molding machine uses the above-mentioned upper mold 1. A lower mold 2 and a guide mold 3 are provided, and a glass to be formed 4 is placed on the lower mold 2.
これらの型1,2.3は、断面H字状のステンレス鋼か
らなる保持具5を介して、同じくステンレス鋼からなる
支持台6で支持されている。7はステンレス鋼からなる
押し棒で、これらを石英管8の内部に収容し、外周に配
置した誘導加熱コイル9により型1.2.3および被成
形ガラス4を加熱し、押し棒7を上型1の頭部に下降さ
せて、被成形ガラス4をプレス成形する。温度抑制は、
下型2の内部に配設した熱電対10により型温度を測定
して行なう。次に、その具体例を説明する。These molds 1, 2.3 are supported by a support base 6 also made of stainless steel via a holder 5 made of stainless steel and having an H-shaped cross section. Reference numeral 7 denotes a push rod made of stainless steel, which is housed inside a quartz tube 8. The mold 1.2.3 and the glass to be formed 4 are heated by an induction heating coil 9 placed on the outer periphery, and the push rod 7 is pushed upward. It is lowered to the head of the mold 1, and the glass to be formed 4 is press-molded. Temperature suppression is
The mold temperature is measured by a thermocouple 10 disposed inside the lower mold 2. Next, a specific example will be explained.
被成形ガラス4として、ガラス組成力<wt%でS i
Oz:27.8. A 1 zoz:2.O+ N
a zo:1.8. KtO:1.2. P b O:
65.2. T i O□:2.0である重フリント系
光学ガラス(転移温度435℃)を直径Ion−の球状
のガラス塊に加工したものを使用し、N2ガス雰囲気中
、型温度500℃で圧力40 kg / cJを30秒
間加えた。その後、圧力を解き、プレス成形されたガラ
ス成形体を、上型lおよび下型2と接触させた状態のま
ま上記転移温度まで徐冷し、次いで室温まで急冷して、
両凸球面レンズに成形されたガラス成形体を成形型から
取出す。As the glass to be formed 4, Si with glass composition strength <wt%
Oz: 27.8. A 1 zoz:2. O+N
azo:1.8. KtO:1.2. PbO:
65.2. Heavy flint optical glass (transition temperature 435°C) with T i O□: 2.0 was processed into a spherical glass lump with a diameter Ion-, and the mold temperature was 500°C and the pressure was 40°C in an N2 gas atmosphere. kg/cJ was added for 30 seconds. After that, the pressure is released, and the press-molded glass molded body is slowly cooled to the above transition temperature while in contact with the upper mold 1 and the lower mold 2, and then rapidly cooled to room temperature.
The glass molded body formed into a biconvex spherical lens is taken out from the mold.
以上のプレス成形法は、第2図に示した成形型でも同様
に行なわれる。そして、第3図のプレス成形機において
、実施例1〜21の表面層ないし中間層を有する上・下
型を用いて、上述したと同様の条件で上記重フリント系
ガラスの成形をそれぞれ1000回ずつ繰り返して行な
った。その結果、いずれの実施例の型についても、ガラ
ス成形体は型との離型性が良好で、型との接触面におい
て化学反応した様子が認められず、ガラス成形体と上・
下型表面層の面積度および鏡面は当初の状態が維持され
、ガラス成形体の面精度は100Å以下であり、透明度
も良好であった。The above press molding method is similarly performed using the mold shown in FIG. Then, in the press molding machine shown in FIG. 3, the heavy flint glass was molded 1000 times each under the same conditions as described above using the upper and lower molds having the surface layer or intermediate layer of Examples 1 to 21. I did it repeatedly. As a result, for all molds of Examples, the glass molded product had good releasability from the mold, and no chemical reaction was observed on the contact surface with the mold.
The surface area and mirror surface of the lower mold surface layer were maintained in their original state, and the surface precision of the glass molded product was 100 Å or less, and the transparency was also good.
比較のため、表面層として白金−ロジウムおよび白金−
イリジウムの各合金のコーテイング膜をそれぞれ形成し
た成形型を使用し、上述した実施例と同様にプレス成形
を行なったところ、最初のプレス成形時からガラス成形
体と成形型との離型性が悪く、相互の接触面において化
学反応した様子が認められた。For comparison, platinum-rhodium and platinum-
When press forming was performed in the same manner as in the above-mentioned example using forming molds each coated with a coating film of each iridium alloy, the releasability between the glass molded body and the forming mold was poor from the first press forming. A chemical reaction was observed at the mutual contact surfaces.
以上、成形型の表面層形状が凹球面のものについて示し
たが、本発明はこのような形状に制限を加えるものでは
なく、凸球面、非球面、平面等、何でもよい。Although the shape of the surface layer of the mold has been described above as a concave spherical surface, the present invention is not limited to such a shape, and any shape such as a convex spherical surface, an aspherical surface, a flat surface, etc. may be used.
また、中間層は、上述した各実施例において用いた物質
を主成分とするものであれば、その効果を奏し、他の物
質として例えば白金、イリジウム、ロジウム、金、モリ
ブデンもしくは金等を含有したものであってもよい。In addition, the intermediate layer has the same effect as long as it contains the substance used in each of the above-mentioned examples as a main component. It may be something.
さらに、被成形ガラスとしては、比較的化学反応を起こ
しやすい重フリント系光学ガラスを使用して良好な結果
が得られたことから、他の光学ガラスについても、本発
明の型を用いた成形が行なえることはいうまでもない。Furthermore, since good results were obtained using heavy flint optical glass, which is relatively easy to cause chemical reactions, other optical glasses can also be molded using the mold of the present invention. It goes without saying that it can be done.
また、表面層上にさらに何らかの被覆層を形成し、表面
層と被成形ガラスとの間に被覆層を介在させるようにし
てもよい。Moreover, some kind of coating layer may be further formed on the surface layer, and the coating layer may be interposed between the surface layer and the glass to be formed.
(発明の効果)
本発明によれば、成形型の表面層を、白金と金の少なく
とも2成分からなる物質に窒化物が分散されて形成され
ていることにより、緻密性、硬度および強度、耐化学反
応性ならびに、結晶成長を抑える事による面精度の保持
性のそれぞれにおいて良好な結果が得られるとともに、
ガラス成形体との離型性も向上する。(Effects of the Invention) According to the present invention, the surface layer of the mold is formed by dispersing nitride in a substance consisting of at least two components, platinum and gold, which improves density, hardness, strength, and resistance. In addition to achieving good results in terms of chemical reactivity and retention of surface precision by suppressing crystal growth,
The releasability from the glass molded body is also improved.
第1図は本発明の一実施例を示す成形型の断面図、第2
図は本発明の他の実施例を示す断面図、第3図はプレス
成形機の構成例を示す断面図である。
1.1’−一上型、1a、2a−基盤、1b、2b・・
・表面層、lc、ld、2c、2d−中間層、2.2′
−・−下型。
出願人 田中貴金属工業株式会社Fig. 1 is a sectional view of a mold showing one embodiment of the present invention;
The figure is a sectional view showing another embodiment of the present invention, and FIG. 3 is a sectional view showing an example of the configuration of a press molding machine. 1.1'-upper mold, 1a, 2a-base, 1b, 2b...
・Surface layer, lc, ld, 2c, 2d-intermediate layer, 2.2'
−・−Lower mold. Applicant Tanaka Kikinzoku Kogyo Co., Ltd.
Claims (4)
成形により被成形ガラスに転写されてガラス成形体を成
形する成形型において、表面層が、白金(Pt)と金(
Au)の少なくとも2成分からなる物質に窒化物が分散
されて形成されていることを特徴とするガラス成形体の
成形型。(1) A mold comprising a base and a surface layer, in which the shape of the surface layer is transferred to the glass to be molded by press molding to form a glass molded object, in which the surface layer is composed of platinum (Pt) and gold (
A mold for a glass molded article, characterized in that it is formed by dispersing nitride in a substance consisting of at least two components of Au).
を5〜45wt%含有する少なくとも2成分からなる物
質に窒化物が分散されて形成されていることを特徴とす
る特許請求の範囲第1項に記載の成形型。(2) The surface layer is mainly composed of platinum (Pt) and gold (Au).
The mold according to claim 1, wherein the mold is formed by dispersing nitride in a substance consisting of at least two components containing 5 to 45 wt% of nitride.
3N_4、HfN、NbN、ZrNより選ばれた少なく
とも一つからなるもので、0.02〜30vol%分散
されて形成されていることを特徴とする特許請求の範囲
第1項または第2項に記載の成形型。(3) Nitride is TiN, TaN, AlN, BN, Si_
3N_4, HfN, NbN, and ZrN, and is formed by dispersing 0.02 to 30 vol%, according to claim 1 or 2. mold.
が、ニッケル(Ni)、チタン(Ti)、クロム(Cr
)、モリブデン(Mo)、コバルト(Co)、チタンナ
イトライド(TiN)、チタンカーバイド(TiC)、
シリコンカーバイド(SiC)およびこれらの混合物か
ら選ばれた少なくとも一つを含む物質で形成されている
ことを特徴とする特許請求の範囲第1項〜第3項に記載
の成形型。(4) An intermediate layer is provided between the base and the surface layer, and the intermediate layer is composed of nickel (Ni), titanium (Ti), and chromium (Cr).
), molybdenum (Mo), cobalt (Co), titanium nitride (TiN), titanium carbide (TiC),
4. The mold according to claim 1, wherein the mold is made of a material containing at least one selected from silicon carbide (SiC) and a mixture thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27091387A JPH01115829A (en) | 1987-10-27 | 1987-10-27 | Forming mold for glass molded article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27091387A JPH01115829A (en) | 1987-10-27 | 1987-10-27 | Forming mold for glass molded article |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01115829A true JPH01115829A (en) | 1989-05-09 |
Family
ID=17492733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27091387A Pending JPH01115829A (en) | 1987-10-27 | 1987-10-27 | Forming mold for glass molded article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01115829A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011092794A1 (en) * | 2010-01-28 | 2011-08-04 | 独立行政法人産業技術総合研究所 | Release film for mold for forming fine structure, and mold equipped with same |
-
1987
- 1987-10-27 JP JP27091387A patent/JPH01115829A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011092794A1 (en) * | 2010-01-28 | 2011-08-04 | 独立行政法人産業技術総合研究所 | Release film for mold for forming fine structure, and mold equipped with same |
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