JPH01115294U - - Google Patents
Info
- Publication number
- JPH01115294U JPH01115294U JP980188U JP980188U JPH01115294U JP H01115294 U JPH01115294 U JP H01115294U JP 980188 U JP980188 U JP 980188U JP 980188 U JP980188 U JP 980188U JP H01115294 U JPH01115294 U JP H01115294U
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- cooling fluid
- heat conductor
- heat
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 claims 4
Description
第１図は、本考案に係る電子機器の冷却構造を
概念的に示した要部断面図、第２図は、本考案に
係る電子機器の冷却構造の作用を概念的に示した
要部断面図、第３図は、本考案に係る電子機器の
冷却構造の他の実施態様を概念的に示した要部断
面図、第４図および第５図は、従来の電子機器の
冷却構造を概念的に示した要部側面図および要部
断面図である。
２０……配線板、２１，２１′……熱伝導体、
２１ａ……外端部、４０……管路。
FIG. 1 is a cross-sectional view of a main part conceptually showing the cooling structure for an electronic device according to the present invention, and FIG. 2 is a cross-sectional view of a main part conceptually showing the operation of the cooling structure for an electronic device according to the present invention. 3 are cross-sectional views of main parts conceptually showing other embodiments of the cooling structure for electronic devices according to the present invention, and FIGS. 4 and 5 are conceptual views of conventional cooling structures for electronic devices. FIG. 2 is a side view and a cross-sectional view of the main part shown in FIG. 20... Wiring board, 21, 21'... Heat conductor,
21a...Outer end portion, 40...Pipeline.
Claims (1)
部へ導く熱伝導体を設けるとともに、該熱伝導体
の外端部に管路を巻装し、さらに前記管路に冷却
流体を流通させ、前記電子部品の熱を前記冷却流
体に吸収させることによつて機器筐体内部の温度
上昇を抑えるようにした電子機器の冷却構造にお
いて、前記管路をその半径方向に伸縮可能に設け
、該管路に前記冷却流体を流通した際に、該冷却
流体の圧力によつて前記管路を膨張させ、該管路
と前記熱伝導体とを密着させるようにしたことを
特徴とする電子機器の冷却構造。 A heat conductor is provided on the wiring board to guide the heat generated by the electronic components to the outside of the wiring board, a pipe is wrapped around the outer end of the heat conductor, and a cooling fluid is allowed to flow through the pipe. , in a cooling structure for an electronic device that suppresses a temperature rise inside a device casing by absorbing heat of the electronic component into the cooling fluid, the conduit is provided so as to be expandable and contractable in a radial direction; An electronic device characterized in that when the cooling fluid flows through the pipe, the pipe is expanded by the pressure of the cooling fluid, and the pipe and the heat conductor are brought into close contact. Cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP980188U JPH01115294U (en) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP980188U JPH01115294U (en) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115294U true JPH01115294U (en) | 1989-08-03 |
Family
ID=31216864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP980188U Pending JPH01115294U (en) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115294U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116055A (en) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | Electronic device and cooling module |
-
1988
- 1988-01-28 JP JP980188U patent/JPH01115294U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116055A (en) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | Electronic device and cooling module |
| JP4593438B2 (en) * | 2005-10-24 | 2010-12-08 | 富士通株式会社 | Electronics and cooling modules |
| US7934539B2 (en) | 2005-10-24 | 2011-05-03 | Fujitsu Limited | Electronic apparatus and cooling module |
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