JPH01115256U - - Google Patents
Info
- Publication number
- JPH01115256U JPH01115256U JP971788U JP971788U JPH01115256U JP H01115256 U JPH01115256 U JP H01115256U JP 971788 U JP971788 U JP 971788U JP 971788 U JP971788 U JP 971788U JP H01115256 U JPH01115256 U JP H01115256U
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- hole
- rod
- disc spring
- stacking direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Fuel Cell (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP971788U JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP971788U JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01115256U true JPH01115256U (no) | 1989-08-03 |
JPH075643Y2 JPH075643Y2 (ja) | 1995-02-08 |
Family
ID=31216706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP971788U Expired - Lifetime JPH075643Y2 (ja) | 1988-01-29 | 1988-01-29 | 半導体スタック |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075643Y2 (no) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007088007A (ja) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体スタック |
JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
-
1988
- 1988-01-29 JP JP971788U patent/JPH075643Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007088007A (ja) * | 2005-09-20 | 2007-04-05 | Toshiba Mitsubishi-Electric Industrial System Corp | 半導体スタック |
JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
Also Published As
Publication number | Publication date |
---|---|
JPH075643Y2 (ja) | 1995-02-08 |