JPH01114495A - Thin-type semiconductor card - Google Patents

Abstract

PURPOSE: To simplify a structure to improve productivity, and further durability and reliability by forming a circuit substrate, provided separately from plastic package mounting semiconductor device, folded by 180 deg. so as to expose electrodes. CONSTITUTION: A semiconductor module 14 is formed by mounting a semiconductor device 16 within a plastic package 15 and by equipping electrodes 18 on a flexible circuit substrate 17 provided along this package 15. As a result, structure of the semiconductor module 14 can not only be made simpler than before but also dispose the electrodes 18 at a position not overlapping depth-wise with the semiconductor device 16 by making use of the flexible circuit substrate 17. Accordingly, production of the semiconductor module 14 becomes easier to raise its productivity, pushing force exerting on the electrodes 18 does not reach the semiconductor device 16 to make mechanical destruction hardly happen, so that durability and reliability of thin semiconductor card 11 can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a thin semiconductor card such as an IC card.

[Prior Art] Since this type of thin semiconductor card has the advantage of having a larger storage capacity than a magnetic card, various types of cards, such as IC card type cards, have been developed in recent years. FIG. 6 is a plan view of a conventional IC card-type thin semiconductor card, and FIG. 7 is a cross-sectional view taken along the line AA in FIG. It consists of a formed card body 2 and a semiconductor module 3 mounted thereon, and the semiconductor module 3 includes an electrode 4 that exchanges information with an external device. It is attached so that it is exposed to the outside from one side. The semiconductor module 3 has a semiconductor element mounted in a recess formed by laminating a plurality of printed wiring boards, and the electrode 4 is provided on the side where the recess is not opened.

The main function of the thin semiconductor card 1 configured in this way is performed by information stored in the semiconductor element and calculations of the semiconductor element, and is performed by electrically connecting the thin semiconductor card 1 and external devices. By connecting, the semiconductor element operates.

[Problem that the invention seeks to solve]

However, in such conventional thin semiconductor power boards, since the semiconductor element is mounted in a recess formed by stacking a plurality of printed wiring boards as described above, the structure of the semiconductor module is Not only is this complicated and excellent productivity cannot be expected, but also the electrodes 4 and semiconductor elements are arranged so as to overlap in the thickness direction of the card 1, making it difficult to insert the card 1 into an external device. When electrical connection is made, there is a problem in that the pressing force acting on the electrode 4 also acts on the semiconductor element, which may cause cracking of the semiconductor element.

The present invention has been made in view of the above points, and an object of the present invention is to provide a thin semiconductor card that has excellent productivity and is free from cracking of semiconductor elements.

[Means for solving problems]

In order to achieve such an object, in the present invention, in a thin semiconductor card, the circuit board of the semiconductor module including the electrodes is made into a flexible circuit board, and the electrodes of this circuit board are separated from the plastic package on which the semiconductor element is mounted. The circuit board was bent by 180° so that the electrodes were exposed to the outside.

[Function] When this thin semiconductor card is inserted into an external device, the card and the external device are electrically connected via the electrodes.
When a semiconductor element operates, information is exchanged and calculations are performed between it and an external device. The electrodes are provided via the flexible circuit board and do not overlap with the semiconductor element in the thickness direction, and the semiconductor module does not require multiple printed wiring boards.

〔Example〕

1 to 3 show an embodiment of a thin semiconductor card according to the present invention, in which FIG. 1 is a plan view thereof, FIG. 2 is a sectional view taken along BB of FIG. 1, and FIG. 3 is an exploded perspective view. In figure 0,
A thin semiconductor card (hereinafter referred to as a semiconductor card), which is generally designated by the reference numeral 11, is made up of a plurality of rectangular sheets 12a, 12b, 12 made of opaque hard vinyl chloride resin.
The card body 12 is formed by pressing together with an opaque hard vinyl chloride resin overcoat 13 overlaid on both the front and back surfaces of the card body 12.

Rectangular holes are provided in the three sheets 12a, 12b, and 12c and the overcoat 13 on one side, and a semiconductor module, generally designated by the reference numeral 14, is embedded in these holes during molding. . This semiconductor module 14 consists of a thin plastic package 15 fitted into a hole in a center shell 12c, and a semiconductor element 1 mounted inside the thin plastic package 15.
6 and a rectangular plate-shaped flexible circuit board 17 that is electrically connected to the semiconductor element 16 and fitted into the hole of the sheet 12b. It extends along the line and its tip is bent at 180@. This bent portion is fitted into a hole in the overcoat 13 and a hole in the sheet 12a, and a plurality of electrodes 18 are adhered to the surface exposed to the outside. As a result, the electrode 18 is separated from the plastic pan cage 15.

With the above configuration, when the semiconductor card 11 is inserted into an external device (not shown), the semiconductor card 11 and the external device are electrically connected via the electrodes 18, so the semiconductor element 16 does not operate. , information is exchanged and calculations are performed between the semiconductor element 16 and external devices.

In this case, the semiconductor module 14 is constructed by mounting the semiconductor element 16 inside the plastic package 15 and mounting the electrodes 18 on the flexible circuit board 17 protruding along the plastic package 15. Compared to a structure in which a plurality of printed wiring boards are laminated as shown in FIG. They can be placed in positions that do not overlap in the horizontal direction.

4 and 5 show other embodiments of the present invention, and FIG.
The figure is a plan view corresponding to Fig. 1, and Fig. 5 is C of Fig. 4.
In this embodiment, the semiconductor element 26 of the semiconductor module 24 is buried in the plastic package 25 with its plane facing the hole in the sheet 12d on the opposite side from the previous embodiment, and the flexible circuit board 27 is buried in the plastic package 25. was provided in the hole of the sheet 12d, and the electrode 28 was attached to the exposed portion of the sheet 12d with its bent end facing the opposite side of the card 21.

With this configuration, the configuration of the semiconductor module 24 is simplified as in the previous embodiment, and the electrode 28 and the semiconductor element 25 are further apart than in the previous embodiment. The pressing force applied to the electrode 2 by the external device is applied from the opposite side, and the influence on the semiconductor element 25 is reduced, so that further improvement in reliability can be expected.

〔Effect of the invention〕

As is clear from the above description, in the thin semiconductor card according to the present invention, the circuit board of the semiconductor module including the electrodes is a flexible circuit board, and the electrodes of the circuit board are provided separately from the plastic package on which the semiconductor element is mounted. By bending this circuit board 180 degrees so that the electrodes are exposed to the outside, the structure of the semiconductor module can be simplified compared to conventional ones, making manufacturing easier and improving productivity. . Furthermore, since the electrodes can be arranged at positions that do not overlap in the thickness direction of the semiconductor element, when this thin semiconductor card is inserted into an external device, the pressing force acting on the electrodes will not be applied to the semiconductor element. Therefore, mechanical destruction of the semiconductor element such as semiconductor element cracking becomes less likely to occur, and the durability and reliability of the thin semiconductor card are improved.

[Brief explanation of the drawing]

1 to 5 show an embodiment of a thin semiconductor card according to the present invention, FIG. 1 is a plan view thereof, FIG. 2 is a sectional view taken along the line BB of FIG. 1, FIG. 3 is an exploded perspective view, and 4 is a plan view of a thin semiconductor card showing another embodiment of the present invention corresponding to FIG. 1, FIG. 5 is a CC sectional view of FIG. 4, and FIG. 6 is a plan view of a conventional thin semiconductor card. , FIG. 7 is a sectional view taken along line AA in FIG. 6. II, 21... thin semiconductor card, 12... card body, 13... overcoat, 14.24...
...Semiconductor module, 15.25...Plastic package, 16.26...Semiconductor element, 17.
27...Flexible circuit board, 18.28...
·electrode.

Claims (1)

[Claims] In a thin semiconductor card in which a semiconductor module is mounted on a card body, the circuit board of the semiconductor module including electrodes is used as a flexible circuit board, and the electrodes of this circuit board are provided separately from the plastic package on which the semiconductor element is mounted. A thin semiconductor card characterized in that a circuit board is bent 180 degrees so that electrodes are exposed to the outside.