JPH01113926U - - Google Patents

Info

Publication number

JPH01113926U

JPH01113926U JP814188U JP814188U JPH01113926U JP H01113926 U JPH01113926 U JP H01113926U JP 814188 U JP814188 U JP 814188U JP 814188 U JP814188 U JP 814188U JP H01113926 U JPH01113926 U JP H01113926U

Authority

JP

Japan

Prior art keywords

wiring material

copper wiring

spraying

coating

copper

Prior art date

1988-01-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 6
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 229910052802 copper Inorganic materials 0.000 claims description 3
• 239000010949 copper Substances 0.000 claims description 3
• 239000011248 coating agent Substances 0.000 claims 1
• 238000000576 coating method Methods 0.000 claims 1
• 238000009740 moulding (composite fabrication) Methods 0.000 claims 1
• 238000005507 spraying Methods 0.000 claims 1
• 239000000758 substrate Substances 0.000 description 1