JPH01113354U - - Google Patents
Info
- Publication number
- JPH01113354U JPH01113354U JP1988009351U JP935188U JPH01113354U JP H01113354 U JPH01113354 U JP H01113354U JP 1988009351 U JP1988009351 U JP 1988009351U JP 935188 U JP935188 U JP 935188U JP H01113354 U JPH01113354 U JP H01113354U
- Authority
- JP
- Japan
- Prior art keywords
- container
- metal
- center
- metal column
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988009351U JPH01113354U (US07223432-20070529-C00017.png) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988009351U JPH01113354U (US07223432-20070529-C00017.png) | 1988-01-26 | 1988-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01113354U true JPH01113354U (US07223432-20070529-C00017.png) | 1989-07-31 |
Family
ID=31216025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988009351U Pending JPH01113354U (US07223432-20070529-C00017.png) | 1988-01-26 | 1988-01-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01113354U (US07223432-20070529-C00017.png) |
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1988
- 1988-01-26 JP JP1988009351U patent/JPH01113354U/ja active Pending