JPH01112047U - - Google Patents

Info

Publication number
JPH01112047U
JPH01112047U JP1988007257U JP725788U JPH01112047U JP H01112047 U JPH01112047 U JP H01112047U JP 1988007257 U JP1988007257 U JP 1988007257U JP 725788 U JP725788 U JP 725788U JP H01112047 U JPH01112047 U JP H01112047U
Authority
JP
Japan
Prior art keywords
liquid
module
heater
support frame
hot plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988007257U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988007257U priority Critical patent/JPH01112047U/ja
Publication of JPH01112047U publication Critical patent/JPH01112047U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1988007257U 1988-01-22 1988-01-22 Pending JPH01112047U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988007257U JPH01112047U (fr) 1988-01-22 1988-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988007257U JPH01112047U (fr) 1988-01-22 1988-01-22

Publications (1)

Publication Number Publication Date
JPH01112047U true JPH01112047U (fr) 1989-07-27

Family

ID=31212117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988007257U Pending JPH01112047U (fr) 1988-01-22 1988-01-22

Country Status (1)

Country Link
JP (1) JPH01112047U (fr)

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