JPH01110949A - Manufacture of decorative sheet - Google Patents
Manufacture of decorative sheetInfo
- Publication number
- JPH01110949A JPH01110949A JP26982287A JP26982287A JPH01110949A JP H01110949 A JPH01110949 A JP H01110949A JP 26982287 A JP26982287 A JP 26982287A JP 26982287 A JP26982287 A JP 26982287A JP H01110949 A JPH01110949 A JP H01110949A
- Authority
- JP
- Japan
- Prior art keywords
- wood
- adhesive
- particle board
- layer
- adhesive agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 26
- 229920002522 Wood fibre Polymers 0.000 claims abstract description 24
- 239000002025 wood fiber Substances 0.000 claims abstract description 24
- 239000002023 wood Substances 0.000 claims abstract description 18
- 239000002344 surface layer Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 8
- 238000004049 embossing Methods 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 229920001807 Urea-formaldehyde Polymers 0.000 description 3
- 229910000737 Duralumin Inorganic materials 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011094 fiberboard Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本願発明は、建築用材料や家具用材料、とりわけ家具用
環として用いられる化粧板の製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a method for producing decorative laminates used as building materials and furniture materials, particularly as furniture rings.
[従来技術とその欠点]
従来、この種の化粧板の製造方法においては、その化粧
板の基板となっているパーティクルボード等が表内層共
に接着剤の添加ゆ混入された木材チップで構成され、そ
の後、このパーティクルボード表面を研摩して所定の厚
みまで調整しているが、上記研摩時に表層部分の接着剤
の十分添加された木粉ないし木材ファイバー(以下、木
材ファイバー等と称す)が削り取られ、接着剤や木材フ
ァイバーの使用無駄となっていた。[Prior Art and Its Disadvantages] Conventionally, in the manufacturing method of this type of decorative board, the particle board, etc., which is the substrate of the decorative board, is composed of wood chips mixed with an adhesive in both the front and inner layers. The surface of this particle board is then polished to a predetermined thickness, but during the polishing process, the wood powder or wood fibers (hereinafter referred to as wood fibers, etc.) with sufficient adhesive added to the surface layer are scraped off. , the use of glue and wood fibers was wasted.
また、上記のように製造されたパーティクルボード等の
表面に接着剤を介して化粧シートを載置し、任意のエン
ボス形状を有した凹凸のジュラルミン板等で熱圧成型し
た化粧板はあったが、パーティクルボード等の基板の表
層が接着剤で硬化して相当の剛性があり、かつパーティ
クルボード等の表面にある接着剤層自体も薄くエンボス
形状を形成し難いために化粧板の表面のエンボス形状に
ついて凹凸模様の明瞭なものかえられ難い欠点があった
。In addition, there have been decorative boards in which a decorative sheet is placed on the surface of a particle board, etc. manufactured as described above via an adhesive, and then hot-press-molded with uneven duralumin board, etc., having an arbitrary embossed shape. The surface layer of the substrate such as particle board is cured with adhesive and has considerable rigidity, and the adhesive layer itself on the surface of particle board is thin and difficult to form an embossed shape, so the embossed shape on the surface of the decorative board is difficult to form. However, there was a drawback that it had a clear uneven pattern and was difficult to change.
[発明の構#i、]
本願発明は、木材チップに接着剤を塗布・混入した後フ
ォーミングを行ない、熱圧成型してえられたパーティク
ルボード等の表面を研摩し表面平滑にした後、接着剤を
介して化粧シートを載置し、エンボス板で熱圧してエン
ボス加工を施した化粧板の製造方法おいて、上記パーテ
ィクルボード等の表層に接着剤の添加されていない微細
な木材ファイバー等を混入するか、若しくは、微細な木
材ファイバー等の層を最上に別に形成することを特徴と
している。[Structure of the Invention #i,] The present invention involves applying and mixing an adhesive to wood chips, forming the wood chips, polishing the surface of particle board, etc. obtained by heat-pressing molding to make the surface smooth, and then applying the adhesive. In the method for manufacturing a decorative board in which a decorative sheet is placed through an adhesive and embossed by hot pressing with an embossing board, fine wood fibers, etc. to which no adhesive is added are added to the surface layer of the particle board, etc. It is characterized by a layer of fine wood fibers or the like being mixed in or separately formed on top.
本願発明に係る化粧板の基板としてパーティクルボード
が用いられているが、その他、中質m1II板、ファイ
バーボードなどの木質基板が挙げられている。パーティ
クルボードを基板とした場合、このパーティクルボード
の製造方法として、(1)接着剤を塗布した表層用木材
チップと全く接着剤を塗布していない木材ファイバー等
をフォーミング前に混合し、接着剤を塗布した後の表層
用木材チップは早く落下し、全く接着剤を添加していな
い微細な木材ファイバー等は遠方に飛散するように風撰
機で分別してフォーミングする方法、(2)従来の方法
と同様にフォーミングを行ない、その上に接着剤が添加
されていない木材ファイバー等をフォーミングして最表
層を形成する方法が考えられるが、これらの方法によっ
て製造されるパーティクルボードの表層部分が、完全に
接着剤混入チップ層とその上に存在している接着剤の添
加されていない木材ファイバー等の2層に分かれていて
もよい。Particle board is used as the substrate for the decorative board according to the present invention, but other materials include wood substrates such as medium-density m1II board and fiberboard. When particle board is used as a substrate, the method for manufacturing this particle board is as follows: (1) Before forming, mix wood chips for the surface layer coated with adhesive and wood fibers etc. that are not coated with adhesive at all, and then apply the adhesive. (2) A method in which wood chips for the surface layer fall quickly after application, and fine wood fibers to which no adhesive has been added are separated and formed using a blower so that they are scattered far away. (2) Conventional method. It is possible to form the outermost layer by forming in the same way and then forming wood fibers, etc. to which no adhesive is added, but the surface layer of the particle board manufactured by these methods is completely It may be divided into two layers: an adhesive-containing chip layer and an adhesive-free wood fiber layer thereon.
上記接着剤の添加されていない木材ファイバー等は、予
め含水率を多少高めに設定する必要がある。このように
、多少の高含水率の有する木材ファイバー等を用いると
、湿式ファイバーボード製造原理と同じように水分を媒
体として前記木材ファイバー等の絡み合いが容易となり
、表層部分の強度をいくらか向上させて研摩工程で発生
する問題、すなわち、パーティクルボードの表面の毛羽
立ちなど凹凸が発生することを防ぐことができる。For wood fibers to which the above-mentioned adhesive is not added, it is necessary to set the moisture content somewhat high in advance. In this way, when wood fibers etc. with a somewhat high moisture content are used, the wood fibers etc. can be easily intertwined using moisture as a medium, similar to the principle of wet fiberboard manufacturing, and the strength of the surface layer can be improved to some extent. Problems that occur during the polishing process, that is, unevenness such as fuzz on the surface of the particle board can be prevented.
以上のようにして得られたパーティクルボードの表面に
接着剤を介して化粧シートを載置し、任意のエンボス形
状を有したエンボス板等で熱圧成型すると、上記接着剤
は、パーティクルボードの表層部分の、接着剤が添加さ
れていない木材ファイバー等に浸透し、表層部分で剥離
等が生じないとともに、基板であるパーティクルボード
の表面は多少柔軟となり可塑性を帯びているので、凹凸
のあるエンボス形状の明瞭な化粧板かえられる。A decorative sheet is placed on the surface of the particle board obtained in the above manner via an adhesive, and then hot-press molded using an embossed plate having an arbitrary embossed shape. The adhesive penetrates into the wood fibers, etc. to which no adhesive has been added, and peeling does not occur on the surface layer, and the surface of the particle board that is the substrate is somewhat flexible and has a plasticity, so it has an uneven embossed shape. The clear veneer has been changed.
上記接着剤の無添加の木材ファイバー等の含水率は、1
0〜3oz、好ましくは15〜20%の範囲がよい、
10%以下であればパーティクルボードの表面に、研摩
後かなりの凹凸ができる。また、30%を越えると内部
に蒸気がこもりパンク現象の可能性が大きくなる。The moisture content of the additive-free wood fiber, etc. of the above adhesive is 1
The range is 0 to 3 oz, preferably 15 to 20%.
If it is less than 10%, the surface of the particle board will have considerable unevenness after polishing. Moreover, if it exceeds 30%, steam will be trapped inside, increasing the possibility of a puncture.
化粧シートとして用いられるものは、チタン紙、樹脂含
浸紙、合成樹脂シートなどである6なお、接着剤無添加
の木材ファイバー等を白色系の針葉樹材のみから構成さ
れるもの、あるいは白色系の針葉樹材の割合が大きい木
材ファイバー等として用いると、化粧板の表面の隠ぺい
がいっそう向上する。Materials used as decorative sheets include titanium paper, resin-impregnated paper, and synthetic resin sheets. If it is used as wood fiber with a large proportion of wood, the concealment of the surface of the decorative board will be further improved.
[発明の効果]
上述したように、本願発明によって、凹凸のあるエンボ
ス形状が極めて明瞭な化粧板をえることができる。[Effects of the Invention] As described above, according to the present invention, a decorative board having an extremely clear embossed shape with unevenness can be obtained.
[実施例1]
表層用の木材チップおよび木材ファイバー等のうち、2
0〜40重量2の接着剤無添加の木材ファイバー等を用
いるという条件で、前記(1)の方法でフォーミングし
、えられたパーティクルボードに尿素樹脂30重量部、
酢酸ビニル樹脂70重量部、小麦粉10量部、塩安2重
量部入れた接着剤をパーティクルボードに塗布し、ポリ
ウレタン樹脂30g/m2のトップコート済のチタン紙
を載置し、凹凸の梨地模様のエンボス形状の入ったジュ
ラルミン板を用いて30kg/c+s2 、130℃、
20秒の条件で熱圧し、エンボス加工を施して所望の化
粧板をえた。[Example 1] Among wood chips and wood fibers for the surface layer, 2
30 parts by weight of urea resin, 30 parts by weight of urea resin were formed on the particle board obtained by forming by the method (1) above on the condition that wood fibers with no adhesive added were used.
An adhesive containing 70 parts by weight of vinyl acetate resin, 10 parts by weight of wheat flour, and 2 parts by weight of ammonium chloride was applied to a particle board, and a titanium paper top-coated with 30 g/m2 of polyurethane resin was placed on it to create an uneven satin pattern. Using duralumin board with embossed shape, 30kg/c+s2, 130℃,
The desired decorative board was obtained by hot pressing for 20 seconds and embossing.
[実施例2]
実施例1と同様にして化粧板を製造するが、接着剤の添
加されていない木材ファイバー等が針葉樹材からえられ
たものを使用した。[Example 2] A decorative board was manufactured in the same manner as in Example 1, except that wood fibers and the like obtained from softwood materials to which no adhesive was added were used.
[実施例3]
前記(2)の方法でフォーミングし、尿素・メラミン樹
脂100重量部、小麦粉15重量部、塩安2重量部を入
れた接着剤をパーティクルボードの表面に塗布し、アク
リルメラミン樹脂80g/冒2のトップコート済の合成
紙を載置し、凹凸梨地模様のエンボス・ステンレス板を
用いて20kg/c鳳2 、130℃、30秒の熱圧条
件で熱圧し、エンボス加工を施して所望の化粧板をえた
。[Example 3] Forming was performed using the method described in (2) above, and an adhesive containing 100 parts by weight of urea/melamine resin, 15 parts by weight of wheat flour, and 2 parts by weight of ammonium chloride was applied to the surface of particle board, and acrylic melamine resin was applied to the surface of the particle board. A top-coated synthetic paper weighing 80g/2 was placed on it, and an embossed stainless steel plate with an uneven satin pattern was used to heat-press it at 20kg/c, 130°C, and 30 seconds for embossment. The desired decorative board was obtained.
[比較例]
通常の製造方法でえられたパーティクルボードを使用し
、その他実施例1と同様にした。[Comparative Example] A particle board obtained by a normal manufacturing method was used, and the other procedures were the same as in Example 1.
[比較試験]
エンボスのシャープさの程度を外観的に目視で相対比較
すると次の表のとおりとなった。[Comparative Test] A relative visual comparison of the degree of sharpness of the embossing was made as shown in the following table.
特許出願人 永大産業株式会社Patent applicant: Eidai Sangyo Co., Ltd.
Claims (1)
れたパーティクルボード等の表面に化粧シートを貼着し
、エンボス加工を施してなる化粧板の製造方法において
、上記パーティクルボード等の表層に、接着剤を塗布し
た表層用木材チップと接着剤を全く塗布していない木粉
ないし木材ファイバーを混合したものを用いるか、若し
くは、接着剤を塗布した表層用木材チップの層の上に接
着剤を全く塗布していない木粉ないし木材ファイバーの
層を形成したものを用いることを特徴とする化粧板の製
造方法。In a method for producing a decorative board, in which a decorative sheet is attached to the surface of a particle board, etc. obtained by applying and stirring an adhesive to wood chips, molding and hot pressing, and applying embossing, the surface layer of the particle board, etc. Either use a mixture of adhesive-coated surface wood chips and unadhesive wood flour or wood fibers, or glue on top of a layer of adhesive-coated surface wood chips. A method for manufacturing a decorative board, characterized by using a layer of wood powder or wood fibers that is not coated with any agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26982287A JPH01110949A (en) | 1987-10-26 | 1987-10-26 | Manufacture of decorative sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26982287A JPH01110949A (en) | 1987-10-26 | 1987-10-26 | Manufacture of decorative sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01110949A true JPH01110949A (en) | 1989-04-27 |
JPH0460820B2 JPH0460820B2 (en) | 1992-09-29 |
Family
ID=17477655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26982287A Granted JPH01110949A (en) | 1987-10-26 | 1987-10-26 | Manufacture of decorative sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01110949A (en) |
-
1987
- 1987-10-26 JP JP26982287A patent/JPH01110949A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0460820B2 (en) | 1992-09-29 |
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