JPH01109633A - Impregnated type cathode structure - Google Patents

Impregnated type cathode structure

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Publication number
JPH01109633A
JPH01109633A JP62266324A JP26632487A JPH01109633A JP H01109633 A JPH01109633 A JP H01109633A JP 62266324 A JP62266324 A JP 62266324A JP 26632487 A JP26632487 A JP 26632487A JP H01109633 A JPH01109633 A JP H01109633A
Authority
JP
Japan
Prior art keywords
metal
cup
eutectic alloy
cathode
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62266324A
Other languages
Japanese (ja)
Inventor
Ikumitsu Nonaka
野中 育光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62266324A priority Critical patent/JPH01109633A/en
Publication of JPH01109633A publication Critical patent/JPH01109633A/en
Pending legal-status Critical Current

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  • Solid Thermionic Cathode (AREA)

Abstract

PURPOSE:To increase the adhesive strength between the component members and to improve the heat conductivity by closely attaching and fixing the enclosed surface of a metal sleeve, the bottom of a metal cup, and cathode holding wires with a specific high melting point soldering material. CONSTITUTION:Cathode holding wires 5 and a metal cup 2 are melted to the enclosed end surface of a metal sleeve 3, in a reducing ambiance by using a high melting point soldering material such as a eutectic alloy of Ru and Mo,or a eutectic alloy of Ru, Mo, and Ni, and all the members are fixed leaving no clearance. In this case, as the high melting point soldering material, a eutectic alloy of Ru and Mo in the wt. ratio 2:3, or an alloy composed by melting Ni to an Ru-Mo eutectic alloy making the wt. composition ratio 3:4:3 is preferable to be used. In such a composition, the adhesive strength between the component members is increased extensively, the heat conductivity is improved, and a stable electron emitting performance can be obtained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は熱効率の良好な含浸形陰極構体に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an impregnated cathode structure with good thermal efficiency.

〔従来の技術〕[Conventional technology]

含浸形陰極は、使用時の陰極温度を1000〜1100
℃程度にする必要があり、そのため熱効率の向上につい
ては種々の工夫が行われている。
For impregnated cathodes, the cathode temperature during use is 1000 to 1100.
It is necessary to keep the temperature at about ℃, and therefore various efforts have been made to improve thermal efficiency.

例えば、特開昭56−168316号公報には、ヒータ
を内蔵し閉塞端部の外側に含浸形陰極ベレフトを取付け
た金属スリーブの、ヒータ挿入用の開口のある端部側を
金属熱反射スクリーンによって囲むようにした陰極ユニ
ットにおいて、ペレットとスリーブよりなる陰極軸を、
ペレットの底部に固着した熱伝導度の低い金属細条(断
面・が薄く偏平な長方形)又は金属細線(例えば直径0
.05flのW−Re線)によって自立するように、熱
反射スクリーン中につるすことが開示されている。
For example, in Japanese Patent Application Laid-Open No. 56-168316, the end side of a metal sleeve with a built-in heater and an impregnated cathode verleft attached to the outside of the closed end, which has an opening for inserting the heater, is covered with a metal heat reflective screen. In the surrounding cathode unit, the cathode shaft consisting of pellet and sleeve is
Metal strips with low thermal conductivity (thin and flat rectangular cross section) or thin metal wires (for example, diameter 0) fixed to the bottom of the pellet.
.. 05fl W-Re wire) is disclosed to be suspended free-standing in a heat reflective screen.

また、特開昭61−288339号公報には、ヒータを
内蔵し閉塞端壁外面に電子放出エミッタを付設した金属
スリーブの内面に、高融点金属または其の酸化物の粉末
および無機質結合材を混合塗布して焼結させた熱吸収性
膜を形成させることが開示されており、また、その実施
例図には、前記金属スリーブの閉塞端壁外面に付設され
た含浸形陰極ペレフトを収納した金属カップの底部を、
4本の金属細線が支持している状態が示されている。
Furthermore, Japanese Patent Application Laid-Open No. 61-288339 discloses that a powder of a high melting point metal or its oxide and an inorganic binder are mixed on the inner surface of a metal sleeve that has a built-in heater and an electron emission emitter attached to the outer surface of the closed end wall. The patent discloses forming a heat-absorbing membrane by coating and sintering, and also includes a metal sleeve containing an impregnated cathode pellet attached to the outer surface of the closed end wall of the metal sleeve. the bottom of the cup,
It is shown supported by four thin metal wires.

第2図にこのような従来の含浸形陰極構体の一例を示す
、即ち、含浸形陰極(ペレット) 1は、空孔率的20
%の多孔性タングステン基体に、BaO+Cab、 A
t O等よりなる電子放出物質を溶融含浸させてなり、
例えばMo金属等のような高融点金属材よりなる有底金
属カップ2に収納されている。−方、上端を平らな面で
閉塞した金属スリーブ3は加熱用ヒータ4を内蔵してい
る。上記金属カップ2は底面が金属スリーブ3の閉塞端
面の上に背中合わせに同軸に付設されており、これら両
者の中間に、はぼ両者共通の中心軸上で十字に交差させ
た2本の直径30〜50μmの円形断面のタングステン
製陰極支持線5が配設され、この支持線5は金属カップ
2の底面と金属スリーブ3の閉塞端面の双方に、それぞ
れ、抵抗溶接法またはレーザ溶接法などで溶着されてい
る。更に図示されていないセラミックスや結晶ガラス材
料で作られた絶縁基板の貫通孔に、例えば嵌合して固定
された金属製の陰極支持筒の端面部に、前記2本の支持
線5夫々の両端を、90度おきに4個所で固定して、含
浸  、形陰極が陰極支持筒に対し所定の相対位置に保
持された一つの含浸形陰極構体が形成される。
FIG. 2 shows an example of such a conventional impregnated cathode structure.
% porous tungsten substrate, BaO+Cab, A
It is made by melting and impregnating an electron-emitting substance such as tO,
For example, it is housed in a bottomed metal cup 2 made of a high melting point metal material such as Mo metal. - On the other hand, the metal sleeve 3 whose upper end is closed with a flat surface has a built-in heater 4. The metal cup 2 has its bottom surface attached coaxially with the back to back on the closed end surface of the metal sleeve 3, and between these two, there are two diameter 30 mm which are crisscrossed on the central axis common to both. A tungsten cathode support wire 5 with a circular cross section of ~50 μm is provided, and this support wire 5 is welded to both the bottom surface of the metal cup 2 and the closed end surface of the metal sleeve 3 by resistance welding or laser welding, respectively. has been done. Furthermore, both ends of each of the two support wires 5 are attached to the end surface of a metal cathode support cylinder that is fitted and fixed, for example, into a through hole of an insulating substrate made of a ceramic or crystal glass material (not shown). are fixed at four locations at 90 degree intervals to form one impregnated cathode assembly in which the impregnated cathode is held at a predetermined relative position with respect to the cathode support tube.

このような含浸形陰極構体を受像管や撮像管などの陰極
線管に取付けて、電子を放出させるが、そのためには、
含浸形陰極ペレットを1100℃の高温に保持する必要
があり、このようなペレット温度を得るにはヒータ4の
温度を1300〜1400℃にする必要がある。
Such an impregnated cathode structure is attached to a cathode ray tube such as a picture tube or image pickup tube to emit electrons, but in order to do so,
It is necessary to maintain the impregnated cathode pellet at a high temperature of 1100°C, and in order to obtain such a pellet temperature, it is necessary to set the temperature of the heater 4 to 1300 to 1400°C.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来の技術は、伝導による熱損失を抑制しなから含
浸形陰極ペレフトの支持体に対する相対位置を固定する
手段として、特定な方向にたわみ易く応力歪で変形し易
いなどの問題のある金属細条を避け、円形断面の細いタ
ングステン製支持線を使用し、高温度使用中での変形に
対して配慮はしている。しかし、円形断面の線を十字に
交差させ、それを金属カップの底面と金属スリーブの閉
塞端面とで挟持するように積重ねた溶接構造なので、点
溶接による接合強度が低い、このため、上記構造の含浸
形陰極構体に対し長時間の寿命評価試験を行うと金属カ
ップ底面、金属スリーブ閉塞端面および十字に交差させ
た陰極支持線の間で、溶接側がれという致命的な損傷が
生じた。
The above-mentioned conventional technology is a means of fixing the relative position of the impregnated cathode pellet to the support while suppressing heat loss due to conduction. We avoid deformation during high-temperature use by avoiding strips and using thin tungsten support wires with a circular cross section. However, since the welded structure is made by intersecting the lines of the circular cross section and stacking them so that they are sandwiched between the bottom surface of the metal cup and the closed end surface of the metal sleeve, the joint strength by spot welding is low. When a long-term life evaluation test was conducted on the impregnated cathode assembly, fatal damage such as weld side separation occurred between the bottom of the metal cup, the closed end of the metal sleeve, and the criss-crossed cathode support wires.

この問題の対策としてまず金属スリーブの閉塞端面中心
部に、陰極支持線の十字交差点の厚みを逃げる孔を設け
ることが考えられた。しかし、このようにしても陰極支
持線は高融点で硬いタングステン等で作られ、また金属
カップも高融点たとえばモリブデンの例えば25μm厚
の薄い板で作られており、これらを金属スリーブ閉塞端
面の変形を起こさせずに確実に取付は固定することは非
常に困難である。また、いずれにせよ、金属カップ底面
と金属スリーブ閉塞端面とは中間に十字状に交差した直
径30〜50μmの支持線を介在させた状態で重ねられ
ているので、少なくとも支持線の近傍では上記直径程度
の隙間が生じており、金属スリーブと金属カップの間の
熱伝導が著しく悪くなり、かなり熱放射に頼ることにな
る。このため安定した電子放出特性が得られないだけで
なく、ヒータ温度を更に高温にする必要が生じ、陰極構
体各部の溶接強度劣化を引き起こし、信頼性を著しく損
なうという悪循環に陥る。
As a countermeasure to this problem, it was first considered to provide a hole in the center of the closed end surface of the metal sleeve to escape the thickness of the cross intersection of the cathode support wire. However, even with this method, the cathode support wire is made of a hard material such as tungsten with a high melting point, and the metal cup is also made of a thin plate of high melting point, such as molybdenum, with a thickness of, for example, 25 μm. It is extremely difficult to securely install and secure the device without causing damage. In any case, the bottom surface of the metal cup and the closed end surface of the metal sleeve are overlapped with a cross-shaped support line of 30 to 50 μm in diameter interposed between them, so at least in the vicinity of the support line, the above-mentioned diameter This creates a gap of some degree, and the heat conduction between the metal sleeve and the metal cup becomes extremely poor, resulting in a heavy reliance on heat radiation. For this reason, not only are stable electron emission characteristics not obtained, but it is also necessary to raise the heater temperature to a higher temperature, causing deterioration of the welding strength of various parts of the cathode structure, resulting in a vicious cycle in which reliability is significantly impaired.

本発明は、上記のような従来の含浸形陰極構体の問題点
を解決し、構成各部材間の接合強度が高く、また、ヒー
タが陰極ペレットを熱伝導によって効率良く加熱でき、
安定した電子放出特性が得られる含浸形陰極構体を提供
することを目的とする。
The present invention solves the problems of the conventional impregnated cathode structure as described above, has high bonding strength between the constituent members, and allows the heater to efficiently heat the cathode pellet by thermal conduction.
The object of the present invention is to provide an impregnated cathode structure that provides stable electron emission characteristics.

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点を解決するために本発明においては、金属ス
リーブ閉塞面と金属カップ底面と陰極支持線とを、Ru
とMoの共晶合金、または、RuとMoとNiO共晶合
金よりなる高融点ろう材を用い、1600〜2000℃
の還元性雰囲気中で融解させ、前記各部材を隙間なく 
(隙間はろう材が埋めて)固定するようにした。
In order to solve the above problems, in the present invention, the metal sleeve closing surface, the metal cup bottom surface, and the cathode support wire are made of Ru.
Using a high melting point brazing material made of a eutectic alloy of Ru and Mo, or a eutectic alloy of Ru, Mo, and NiO,
Melt in a reducing atmosphere of
(The gap was filled with brazing material) to secure it in place.

〔作用〕[Effect]

上記手段によって、介在する支持線により、金属カップ
底面と金属スリーブ閉塞端面の間に生じた隙間を高融点
ろう材が埋めるため、各構成部品間の接合強度が著しく
向上するだけでなく、金属カップ底面と金属スリーブ閉
塞端面の間の熱伝導も大幅に改善され、安定した電子放
出特性が得られる。
With the above means, the intervening support wire allows the high melting point brazing filler metal to fill the gap created between the bottom surface of the metal cup and the closed end surface of the metal sleeve, which not only significantly improves the bonding strength between each component, but also improves the strength of the metal cup. Heat conduction between the bottom surface and the closed end surface of the metal sleeve is also significantly improved, resulting in stable electron emission characteristics.

〔実施例〕〔Example〕

第1図は本発明の一実施例図である0図中、6は高融点
ろう材で、その他の符号は第2図の場合と同じである。
FIG. 1 is a diagram showing one embodiment of the present invention. In FIG. 0, 6 is a high melting point brazing filler metal, and the other symbols are the same as in FIG. 2.

予め、重量比で2:3になるように用意した水溶Ru添
加Mo粉末を水素還元雰囲気中で900℃、1時間程度
加熱熔解し、室温状態で塊状物となったものを粉末状に
したろう材を準備する。
Water-soluble Ru-added Mo powder prepared in advance at a weight ratio of 2:3 was heated and melted at 900°C for about 1 hour in a hydrogen reducing atmosphere, and the lumps at room temperature were turned into powder. Prepare the materials.

上記粉末をイソブチルメタアクリレートをバインダとし
てトルエンで調合したものを、金属スリーブ3の閉塞部
に、十字に交差した2本の支持線5を覆うようにして上
記閉塞部全面に塗布する。
A mixture of the above powder with toluene and isobutyl methacrylate as a binder is applied to the entire surface of the closed part of the metal sleeve 3 so as to cover the two crisscrossing support lines 5.

2本の支持線5には直径30〜50μmのタングステン
線を用いる。ここで、金属スリーブ3の閉塞端面上に、
スリーブより外径の小さい金属カップ2を、同軸に、且
つカップの底面がスリーブの端面に平行になるように押
しつけ保持する。乾燥、仮固定後、水素雰囲気中で一旦
バインダを除去し、その後、ろう材を2000℃で数分
間加熱融解し、室温に冷却して、金属スリーブ3の閉塞
端面に支持線5と金属カップ2とを高融点ろう材6によ
り固定接合する。このように、カップ2、スリーブ3及
び支持線5が一体に固定された後、従来と同様な構成の
含浸形陰極1をカップ2内に入れ、カップと陰極を(例
えばレーザ)溶接によって固定する。更に図示を省略し
たセラミックス絶縁基板の貫通孔に嵌合させた陰極支持
筒に支持線5の端部を90度おきに溶接固定し、ヒータ
4をスリーブ3の中に挿入して含浸形陰極構体が完成さ
れる。
The two supporting wires 5 are tungsten wires with a diameter of 30 to 50 μm. Here, on the closed end surface of the metal sleeve 3,
A metal cup 2 having an outer diameter smaller than that of the sleeve is pressed and held coaxially so that the bottom surface of the cup is parallel to the end surface of the sleeve. After drying and temporary fixing, the binder is removed in a hydrogen atmosphere, and then the brazing material is heated and melted at 2000°C for several minutes, cooled to room temperature, and the support wire 5 and metal cup 2 are attached to the closed end surface of the metal sleeve 3. and are fixedly joined using a high melting point brazing filler metal 6. After the cup 2, sleeve 3, and support wire 5 are fixed together in this way, the impregnated cathode 1 having the same structure as the conventional one is placed in the cup 2, and the cup and the cathode are fixed by (for example, laser) welding. . Furthermore, the ends of the support wires 5 are welded and fixed at 90-degree intervals to the cathode support cylinder fitted into the through holes of the ceramic insulating substrate (not shown), and the heater 4 is inserted into the sleeve 3 to form an impregnated cathode assembly. is completed.

このようにして、カップ、スリーブ、支持線が高融点ろ
う材を介して広い面積で接合され接合強度が著しく向上
し、また、カップ“底面とスリーブ端面とがろう材によ
り広い面積で接合されているので熱伝導も良くなり安定
した電子放出特性が得られる。
In this way, the cup, sleeve, and support wire are joined over a wide area via the high melting point brazing metal, significantly improving the joint strength, and the bottom of the cup and the sleeve end are joined over a wide area using the brazing metal. This improves heat conduction and provides stable electron emission characteristics.

なお、上記実施例では、ろう材にRu−MO共晶合金を
用いたが、Ru−Mo−Niの重量組成比で3:4:3
の合金ろう材を用いれば、水素還元雰囲気中での加熱融
解温度を1600℃という低い温度にすることができ、
作業性を著しく向上できる。この場合でも、含浸形陰極
構体の動作温度は1000±100℃程度であり、超長
時間使用にあたっても何等接合強度に問題を生じない。
In the above example, a Ru-MO eutectic alloy was used as the brazing material, but the weight composition ratio of Ru-Mo-Ni was 3:4:3.
By using the alloy brazing filler metal, the heating and melting temperature in a hydrogen reducing atmosphere can be reduced to as low as 1600°C.
Work efficiency can be significantly improved. Even in this case, the operating temperature of the impregnated cathode structure is about 1000±100° C., and there is no problem with the bonding strength even when used for an extremely long time.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、各構成部材間の接
合強度が著しく向上し、熱伝導も良くなって安定した電
子放出特性が得られ、高信頼性の含浸形陰極構体が得ら
れる。
As explained above, according to the present invention, the bonding strength between each component is significantly improved, heat conduction is improved, stable electron emission characteristics are obtained, and a highly reliable impregnated cathode structure is obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明−実施例の斜視図、第2図は細い陰極支
持線を用いた従来の含浸形陰極構体の一例の斜視図であ
る。 1・・−含浸形陰極、 2・・−金属カップ、 3・・
・金属スリーブ、  4・−ヒータ、  5・−陰極支
持線、6・・−高融点ろう材。 代理人 弁理士 小川 勝馬1・ ゛・・、−ノ″
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of an example of a conventional impregnated cathode structure using a thin cathode support wire. 1...-impregnated cathode, 2...-metal cup, 3...
・Metal sleeve, 4.--heater, 5.--cathode support wire, 6.--high melting point brazing metal. Agent Patent Attorney Katsuma Ogawa 1・゛・・-ノ″

Claims (1)

【特許請求の範囲】 1、ヒータを内蔵し一端を閉塞した金属スリーブと、こ
の金属スリーブの閉塞端面外側に背中合せに底面を取付
けた金属カップと、この金属カップに収納されカップの
開口側から電子を放出する含浸形陰極と、夫々一端が前
記金属スリーブ閉塞端面と金属カップ底面の間に挟持さ
れ両者に固着された複数本の陰極支持用金属細線を備え
た含浸形陰極構体において、前記金属スリーブ閉塞面と
金属カップ底面と陰極支持用線とを、RuとMoの共晶
合金、又は、RuとMoとNiの共晶合金よりなる高融
点ろう材を用いて密着固定したことを特徴とする含浸形
陰極構体。 2、重量比で2:3となるRuとMoの共晶合金、又は
、重量組成比で3:4:3となるようにRu−Mo共晶
合金にNiを溶解した合金を、高融点ろう材として用い
た特許請求の範囲第1項記載の含浸形陰極構体。
[Scope of Claims] 1. A metal sleeve with a built-in heater and closed at one end, a metal cup with bottoms attached back to back to the outside of the closed end of the metal sleeve, and a metal cup that is housed in the metal cup and receives electronic data from the open side of the cup. An impregnated cathode assembly comprising: an impregnated cathode that emits an impregnated cathode; and a plurality of thin cathode supporting metal wires each having one end sandwiched between the closed end surface of the metal sleeve and the bottom surface of the metal cup and fixed to both; The closed surface, the bottom surface of the metal cup, and the cathode support wire are closely fixed using a high melting point brazing material made of a eutectic alloy of Ru and Mo or a eutectic alloy of Ru, Mo, and Ni. Impregnated cathode structure. 2. A eutectic alloy of Ru and Mo with a weight ratio of 2:3, or an alloy in which Ni is dissolved in a Ru-Mo eutectic alloy with a weight composition ratio of 3:4:3, is used with a high melting point wax. An impregnated cathode structure according to claim 1 used as a material.
JP62266324A 1987-10-23 1987-10-23 Impregnated type cathode structure Pending JPH01109633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62266324A JPH01109633A (en) 1987-10-23 1987-10-23 Impregnated type cathode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62266324A JPH01109633A (en) 1987-10-23 1987-10-23 Impregnated type cathode structure

Publications (1)

Publication Number Publication Date
JPH01109633A true JPH01109633A (en) 1989-04-26

Family

ID=17429340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62266324A Pending JPH01109633A (en) 1987-10-23 1987-10-23 Impregnated type cathode structure

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Country Link
JP (1) JPH01109633A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4143087A1 (en) * 1990-12-29 1992-07-02 Gold Star Co Impregnated cathode
DE102007050487A1 (en) * 2007-10-19 2009-04-30 W.C. Heraeus Gmbh High temperature solder for the production of discharge lamp by a solder connection between a tungsten-based electrode and molybdenum-based supporting bar, comprises molybdenum and ruthenium as main component, and further metals

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4143087A1 (en) * 1990-12-29 1992-07-02 Gold Star Co Impregnated cathode
DE4143087C2 (en) * 1990-12-29 1999-12-02 Gold Star Co Impregnated cathode
DE102007050487A1 (en) * 2007-10-19 2009-04-30 W.C. Heraeus Gmbh High temperature solder for the production of discharge lamp by a solder connection between a tungsten-based electrode and molybdenum-based supporting bar, comprises molybdenum and ruthenium as main component, and further metals

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