JPH01109388U - - Google Patents

Info

Publication number
JPH01109388U
JPH01109388U JP1988005011U JP501188U JPH01109388U JP H01109388 U JPH01109388 U JP H01109388U JP 1988005011 U JP1988005011 U JP 1988005011U JP 501188 U JP501188 U JP 501188U JP H01109388 U JPH01109388 U JP H01109388U
Authority
JP
Japan
Prior art keywords
slider
support rod
welding head
head
slid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988005011U
Other languages
Japanese (ja)
Other versions
JPH0711473Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988005011U priority Critical patent/JPH0711473Y2/en
Publication of JPH01109388U publication Critical patent/JPH01109388U/ja
Application granted granted Critical
Publication of JPH0711473Y2 publication Critical patent/JPH0711473Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による溶接ヘツドの加圧構造の
実施例を示す説明図、第２図は本考案が適用され
たワイヤボンダの要部説明図、第３図は従来例を
示す説明図である。 第１図において、１はヘツド駆動手段、２はス
ライダ、３は溶接ヘツド、４は調整バネ、２０は
支持杆である。 Fig. 1 is an explanatory diagram showing an embodiment of the pressurizing structure of a welding head according to the present invention, Fig. 2 is an explanatory diagram of main parts of a wire bonder to which the present invention is applied, and Fig. 3 is an explanatory diagram showing a conventional example. . In FIG. 1, 1 is a head driving means, 2 is a slider, 3 is a welding head, 4 is an adjustment spring, and 20 is a support rod.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ヘツド駆動手段１によつて上下摺動するスライ
ダ２の下端に支持杆２０を下方に向けて突設し、
この支持杆２０に上下摺動自在に支持される溶接
ヘツド３とスライダ２との間に調整バネ４を装備
してなる溶接ヘツドの加圧構造。 A support rod 20 is provided to protrude downward from the lower end of the slider 2 which is slid up and down by the head drive means 1,
This pressurizing structure for a welding head is equipped with an adjustment spring 4 between a slider 2 and a welding head 3 that is vertically slidably supported by this support rod 20.
JP1988005011U 1988-01-19 1988-01-19 Pressurized structure of welding head Expired - Lifetime JPH0711473Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (en) 1988-01-19 1988-01-19 Pressurized structure of welding head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988005011U JPH0711473Y2 (en) 1988-01-19 1988-01-19 Pressurized structure of welding head

Publications (2)

Publication Number Publication Date
JPH01109388U true JPH01109388U (en) 1989-07-24
JPH0711473Y2 JPH0711473Y2 (en) 1995-03-15

Family

ID=31208015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988005011U Expired - Lifetime JPH0711473Y2 (en) 1988-01-19 1988-01-19 Pressurized structure of welding head

Country Status (1)

Country Link
JP (1) JPH0711473Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151182A (en) * 1980-04-25 1981-11-24 Hitachi Ltd Welding head
JPS60145290A (en) * 1983-12-05 1985-07-31 ウエルド‐エクイツプ　ビー．ブイ Welding head
JPS63145581U (en) * 1987-03-18 1988-09-26

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56151182A (en) * 1980-04-25 1981-11-24 Hitachi Ltd Welding head
JPS60145290A (en) * 1983-12-05 1985-07-31 ウエルド‐エクイツプ　ビー．ブイ Welding head
JPS63145581U (en) * 1987-03-18 1988-09-26

Also Published As

Publication number Publication date
JPH0711473Y2 (en) 1995-03-15

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