JPH01108967U - - Google Patents
Info
- Publication number
- JPH01108967U JPH01108967U JP455288U JP455288U JPH01108967U JP H01108967 U JPH01108967 U JP H01108967U JP 455288 U JP455288 U JP 455288U JP 455288 U JP455288 U JP 455288U JP H01108967 U JPH01108967 U JP H01108967U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- circuit board
- resistive material
- circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
Landscapes
- Details Of Resistors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP455288U JPH01108967U ( ) | 1988-01-18 | 1988-01-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP455288U JPH01108967U ( ) | 1988-01-18 | 1988-01-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01108967U true JPH01108967U ( ) | 1989-07-24 |
Family
ID=31207166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP455288U Pending JPH01108967U ( ) | 1988-01-18 | 1988-01-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01108967U ( ) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006196840A (ja) * | 2005-01-17 | 2006-07-27 | Denso Corp | 配線基板およびその製造方法 |
JP2011014759A (ja) * | 2009-07-03 | 2011-01-20 | Nec Corp | 多層配線基板及び多層配線基板の製造方法 |
-
1988
- 1988-01-18 JP JP455288U patent/JPH01108967U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006196840A (ja) * | 2005-01-17 | 2006-07-27 | Denso Corp | 配線基板およびその製造方法 |
JP2011014759A (ja) * | 2009-07-03 | 2011-01-20 | Nec Corp | 多層配線基板及び多層配線基板の製造方法 |