JPH01108220A - Flame-retarding resin composition - Google Patents
Flame-retarding resin compositionInfo
- Publication number
- JPH01108220A JPH01108220A JP26425387A JP26425387A JPH01108220A JP H01108220 A JPH01108220 A JP H01108220A JP 26425387 A JP26425387 A JP 26425387A JP 26425387 A JP26425387 A JP 26425387A JP H01108220 A JPH01108220 A JP H01108220A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- flame
- resin composition
- tables
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 125000005843 halogen group Chemical group 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000003063 flame retardant Substances 0.000 claims description 22
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- 239000005062 Polybutadiene Substances 0.000 claims description 6
- 229920002857 polybutadiene Polymers 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 20
- 239000011347 resin Substances 0.000 abstract description 20
- 239000005011 phenolic resin Substances 0.000 abstract description 9
- 229920001568 phenolic resin Polymers 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000002904 solvent Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 229910052736 halogen Inorganic materials 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000002253 acid Substances 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 1
- -1 phosphorus compound Chemical class 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000002966 varnish Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000003973 alkyl amines Chemical group 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 238000004811 liquid chromatography Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 2
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 2
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 2
- 150000004714 phosphonium salts Chemical group 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- LJDGJCNHVGGOFW-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2-bromophenoxy)benzene Chemical compound BrC1=CC=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br LJDGJCNHVGGOFW-UHFFFAOYSA-N 0.000 description 1
- XRQKNNNAKHZPSP-UHFFFAOYSA-N 1,3-dibromo-5-[2-(3,5-dibromo-4-methoxyphenyl)propan-2-yl]-2-methoxybenzene Chemical compound C1=C(Br)C(OC)=C(Br)C=C1C(C)(C)C1=CC(Br)=C(OC)C(Br)=C1 XRQKNNNAKHZPSP-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- VALXCIRMSIFPFN-UHFFFAOYSA-N 2,5-dibromobenzene-1,4-diol Chemical compound OC1=CC(Br)=C(O)C=C1Br VALXCIRMSIFPFN-UHFFFAOYSA-N 0.000 description 1
- BDCSAEPSPIEGAV-UHFFFAOYSA-N 2,6-dibromo-4-[2-(3,5-dibromo-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1C(C(F)(F)F)(C(F)(F)F)C1=CC(Br)=C(O)C(Br)=C1 BDCSAEPSPIEGAV-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- NJQHZENQKNIRSY-UHFFFAOYSA-N 5-ethyl-1h-imidazole Chemical compound CCC1=CNC=N1 NJQHZENQKNIRSY-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 241000251730 Chondrichthyes Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 150000001555 benzenes Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- HPYNZHMRTTWQTB-UHFFFAOYSA-N dimethylpyridine Natural products CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- WPZJSWWEEJJSIZ-UHFFFAOYSA-N tetrabromobisphenol-F Natural products C1=C(Br)C(O)=C(Br)C=C1CC1=CC(Br)=C(O)C(Br)=C1 WPZJSWWEEJJSIZ-UHFFFAOYSA-N 0.000 description 1
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 1
- FBOJNMRAZJRCNS-UHFFFAOYSA-M tetraethylphosphanium;chloride Chemical compound [Cl-].CC[P+](CC)(CC)CC FBOJNMRAZJRCNS-UHFFFAOYSA-M 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、難燃性樹脂組成物に関し、より詳しくは、フ
ェノール樹脂等の樹脂の難燃化分野、殊に積層板等の電
気部品樹脂材料等の難燃化分野に好適に用いられる難燃
性樹脂組成物に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a flame-retardant resin composition, and more specifically to the field of flame-retardant resins such as phenolic resins, particularly for electrical component resins such as laminates. The present invention relates to a flame-retardant resin composition suitable for use in the field of flame-retardant materials.
近年、電気部品、建築材料、雑貨などに多量に使用され
ている種々の合成樹脂材に対して、安全性の点から難燃
化の要求がますます強くなってきている。この難燃化の
方法として樹脂に難燃化剤を配合する方法が知られてい
る。熱硬化性樹脂、特にフェノール樹脂の難燃化に関し
ても種々の難燃化剤が検討され、例えば特開昭60−1
92732号等に示されているように、ハロゲン化エポ
キシ樹脂等のハロゲン化合物を用いる方法や、特開昭5
8−8749号公報等に示されているようにハロゲン化
合物とリン化合物を併用する方法などがある。In recent years, there has been an increasing demand for flame retardant properties for various synthetic resin materials used in large quantities in electrical parts, building materials, miscellaneous goods, etc. from the viewpoint of safety. A known method for achieving this flame retardancy is to add a flame retardant to the resin. Various flame retardants have been studied for flame retardant thermosetting resins, especially phenolic resins, for example, Japanese Patent Application Laid-Open No. 60-1
As shown in No. 92732, etc., methods using halogen compounds such as halogenated epoxy resins, and JP-A No. 5
There is a method of using a halogen compound and a phosphorus compound in combination, as shown in Japanese Patent No. 8-8749.
しかしながら、これらのハロゲン化合物、リン化合物の
ようなフェノール樹脂との反応性がない添加型難燃剤を
使用した場合、樹脂の耐熱性、耐溶剤が劣ると言う問題
点があり、一方、フェノール樹脂と反応性のあるハロゲ
ン化エポキシ樹脂を使用した場合には、フェスの保存安
定性に劣り、さらにこのフェスを積層板に使用した場合
には、積層板の打抜加工性、プリプレグの保存安定性に
劣るという問題があった。However, when additive flame retardants such as these halogen compounds and phosphorus compounds are used, which do not react with phenolic resins, there is a problem that the heat resistance and solvent resistance of the resins are inferior. When a reactive halogenated epoxy resin is used, the storage stability of the face is poor, and when this face is used for a laminate, the punching workability of the laminate and the storage stability of the prepreg are affected. The problem was that it was inferior.
本発明は、前記事情に基づいてなされたものであり、そ
の目的は、フェノール樹脂等の樹脂に優れた難燃性を付
与することができ、しかも、耐熱性、耐溶剤、加工性を
保持もしくは向上させることができる実用上著しく優れ
た難燃性樹脂組成物を提供することにある。The present invention has been made based on the above circumstances, and its purpose is to be able to impart excellent flame retardancy to resins such as phenolic resins, while maintaining heat resistance, solvent resistance, and processability. It is an object of the present invention to provide a flame retardant resin composition which is practically excellent and can improve flame retardancy.
本発明者らは、前記問題点を解決すべく鋭意研究を重ね
た結果、特定の構造を有するハロゲン含有芳香族ジグリ
シジルエーテル類と、特定の組成のα、ω−ポリブタジ
ェンジカルボン酸とを、触媒の存在下に加熱反応してえ
られる組成物が、本発明の目的を満足することを見出し
、この知見に基づいて本発明を完成するに至った。As a result of intensive research to solve the above problems, the present inventors have discovered that halogen-containing aromatic diglycidyl ethers having a specific structure and α,ω-polybutadiene dicarboxylic acid having a specific composition have been developed. The present inventors discovered that a composition obtained by a heating reaction in the presence of a catalyst satisfies the object of the present invention, and based on this knowledge, the present invention was completed.
すなわち、本発明は、
〔A〕一般式(I a)
〔ただし、式中、Xは、ハロゲン原子を表し、YCk
H2k+1
は、−C−(ここで、kおよびjは、それぞCjH2j
*1
れO〜4の整数を表し、かつに+j≧1である)、CF
i
CFi O(ただし、Wは
、O〜 10の整数を表す。)を表し、Lおよびmは、
それぞれ0〜4の整数を表し、かつL十m≧1である。That is, the present invention provides [A] general formula (I a) [wherein, X represents a halogen atom, and YCk
H2k+1 is -C- (where k and j are respectively CjH2j
*1 represents an integer from O to 4, and +j≧1), CF
i CFi O (where W represents an integer from O to 10), L and m are
Each represents an integer from 0 to 4, and L0m≧1.
なお、Xは、互いに同一の種類であっても異なった種類
であってもよい。Note that X may be of the same type or different types.
〕
または一般式(Ib)
〔ただし、式中、Xはハロゲン原子を表し、nは、1か
ら4の整数を表す。なお、Xは互いに同一の種類であっ
ても異なった種類であってもよい。〕で表される1種ま
たは2種以上の化合物1モル当り、
(B)一般式(II)
HOOC−4Zh−育Q?rCOOH(II )〔ただ
し、式中、Zは、つぎの繰り返し単位を表−CHl−C
l = CH−CHt−
し、Qは、次の繰り返し単位
= CIl −CI+□−
CH=CI(Z
を表し、tおよびpは、0以上の整数を表し、かつ、t
+p≧1であり、ZとQの配列は、ランダムであって、
交互であっても、ブロックであってもよい。〕
で表されるα、ω−ポリブタジェンジカルボン酸0.1
〜1モルを触媒の存在下、加熱反応させることによって
得られる難燃性樹脂組成物を提供するものである。] Or general formula (Ib) [However, in the formula, X represents a halogen atom, and n represents an integer from 1 to 4. Note that X may be of the same type or of different types. ] per mole of one or more compounds represented by (B) general formula (II) HOOC-4Zh-IkuQ? rCOOH(II) [In the formula, Z represents the following repeating unit -CHl-C
l = CH-CHt-, Q represents the following repeating unit = CIl-CI+□- CH=CI(Z, t and p represent integers of 0 or more, and t
+p≧1, and the arrangement of Z and Q is random,
It may be alternate or block. ] α, ω-polybutadiene dicarboxylic acid represented by 0.1
The present invention provides a flame-retardant resin composition obtained by subjecting ~1 mol of the compound to a heating reaction in the presence of a catalyst.
前記〔A〕成分として用いる一般式(I a)および(
Ib)中のハロゲン原子Xとしては、フッ素原子、塩素
原子、臭素原子またはヨウ素原子を挙げることができる
。これらの中でも、特に臭素原子が好適である。General formula (I a) and (
As the halogen atom X in Ib), mention may be made of a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. Among these, a bromine atom is particularly preferred.
前記一般式(I a)の化合物の中でも、液式中の1お
よびmが、l+m=2〜4、特にl =m=1または、
l=m=2ものが好適に使用できる。Among the compounds of the general formula (I a), 1 and m in the liquid formula are l + m = 2 to 4, especially l = m = 1 or,
One in which l=m=2 can be suitably used.
一般式(I a)で表される化合物の中で通常好適に使
用できる化合物の具体例としては、たとえば、次に例示
するベンゼン核にハロゲン原子が置換したビスフェノー
ル類のそれぞれのフェノール水酸基の水素原子が、CH
z−C1l−Cll□−基に置換した\1
化合物を挙げることができる。すなわち、該ハロゲン置
換ビスフェノール類としては、テトラブロモビスフェノ
ールAなどのテトラハロビスフェノールA1テトラブロ
モビスフエノールAFなどのテトラハロビスフェノール
AF、テトラブロモビスフェノールBなどのテトラハロ
ビスフェノールB1テトラブロモビスフェノールEなど
のテトラハロビスフェノールB1テトラブロモビスフェ
ノールFなどのテトラハロビスフェノールF、テトラブ
ロモビスフェノールSなどのテトラハロビスフェノール
S1ジブロモビスフエノールAなどのジハロビスフェノ
ールA1ジブロモビスフエノールAFなどのジハロビス
フェノールAF、ジブロモビスフェノールBなどのジハ
ロビスフェノールA1ジブロモビスフエノールEなどの
ジハロビスフェノールE、ジブロモビスフェノールFな
どのジハロビスフェノールF1ジブロモビスフエノール
SなどのジハロビスフェノールSなどを挙げることがで
き、これらの中でも、ブロモ置換体が好ましく、特にテ
トラブロモビスフェノールA等が好ましい。Among the compounds represented by the general formula (Ia), specific examples of compounds that can be normally used preferably include, for example, the hydrogen atom of each phenol hydroxyl group of bisphenols in which the benzene nucleus is substituted with a halogen atom. But, CH
Examples include \1 compounds substituted with a z-C1l-Cll□- group. That is, the halogen-substituted bisphenols include tetrahalobisphenol A such as tetrabromobisphenol A, tetrahalobisphenol AF such as tetrabromobisphenol AF, tetrahalobisphenol B such as tetrabromobisphenol B, tetrahalobisphenol B such as tetrabromobisphenol E, etc. Bisphenol B1 Tetrahalobisphenol F such as tetrabromobisphenol F, Tetrahalobisphenol S such as tetrabromobisphenol S1 Dihalobisphenol A such as dibromobisphenol A1 Dihalobisphenol AF such as dibromobisphenol AF, dihalobisphenol AF such as dibromobisphenol B, etc. Examples include dihalobisphenol E such as halobisphenol A1 dibromobisphenol E, dihalobisphenol F such as dibromobisphenol F1, dihalobisphenol S such as dibromobisphenol S, and among these, bromo-substituted products are preferred; In particular, tetrabromobisphenol A and the like are preferred.
前記一般式(I b>で表される化合物の中で、通常好
適に用いられるものの具体例としては、たとえば、次に
例示するハロゲン置換1.4−ジヒドロキシベンゼン類
のそれぞれのフェノール性水酸基の水素原子を、CHz
−CH−CIlz−基に置換した化ゝ。′
金物を挙げることができる。すなわち、該ハロゲン置換
1,4−ジヒドロキシベンゼン類としては、たとえば、
2.5−ジブロモ−1,4−ジヒドロキシベンゼンなど
の2.5−ジハロ−1,4−ジヒドロキシベンゼン、2
.3.5.6−テトラブロモ−1,4−ジヒドロキシベ
ンゼン等の2,3゜5.6−テトラハロー1.4−ジヒ
ドロキシベンゼン等を挙げることができ、これらの中で
も、特にブロモ置換体が、好適である。Among the compounds represented by the general formula (I b>), specific examples of compounds that are usually preferably used include, for example, the hydrogen of each phenolic hydroxyl group of the halogen-substituted 1,4-dihydroxybenzenes listed below. atoms in Hz
A compound substituted with a -CH-CIlz- group. ´ I can list hardware. That is, the halogen-substituted 1,4-dihydroxybenzenes include, for example,
2,5-dihalo-1,4-dihydroxybenzene, such as 2,5-dibromo-1,4-dihydroxybenzene, 2
.. Examples include 2,3゜5.6-tetrahalo-1,4-dihydroxybenzene such as 3.5.6-tetrabromo-1,4-dihydroxybenzene, among which bromo-substituted compounds are particularly preferred. It is.
以上に例示の化合物の中でも、特に好ましいものとして
、たとえば、テトラブロモビスフェノールAのジグリシ
ジルエーテルを挙げることができる。Among the compounds exemplified above, diglycidyl ether of tetrabromobisphenol A is particularly preferred.
なお、前記〔A〕成分としては、一般式(■a)で表さ
れる化合物および一般式(Ib)で表される化合物の中
から選ばれる1種の化合物を単独で用いてもよく、2種
以上の化合物を併用してもよい。In addition, as the component [A], one type of compound selected from the compound represented by the general formula (■a) and the compound represented by the general formula (Ib) may be used alone; More than one type of compound may be used in combination.
前記CB)成分として用いる一般式(II)で、表され
るα、ω−ポリブタジェンジカルボン酸は、数平均分子
量が300〜2000程度のものが好適に使用できる。As the α,ω-polybutadiene dicarboxylic acid represented by the general formula (II) used as the component CB), those having a number average molecular weight of about 300 to 2000 can be suitably used.
この数平均分子量が300未満の場合は、得られた樹脂
を、フェノール樹脂等の樹脂に用いた際にその可とう化
効果が十分に得られない場合があり、一方、2000よ
り大きいと粘度が高くなり、使用が困難になる場合があ
る。If the number average molecular weight is less than 300, the resulting resin may not have a sufficient softening effect when used in resins such as phenolic resins, while if it is greater than 2000, the viscosity will be low. It may become expensive and difficult to use.
また、一般式(II)における繰り返し単位Z、、!:
Qの割合、すなわちtとpの比としては特に限定するも
のではないが、通常、t:p=5〜100:95〜Oの
範囲のものが好適に使用できる。このLの割合が、小さ
すぎると、可とう化効果が十分に得られない場合がある
。一般に、tの割合が大きくなると可とう化効果も大き
くなり、一方、pの割合が大きくなると、側鎖のビニル
基による分子間の反応性が増加する。Moreover, the repeating unit Z in general formula (II),,! :
Although the ratio of Q, that is, the ratio of t and p, is not particularly limited, a ratio of t:p=5 to 100:95 to O can be preferably used. If this ratio of L is too small, a sufficient flexibility effect may not be obtained. Generally, as the proportion of t increases, the flexibility effect increases, while as the proportion of p increases, the intermolecular reactivity due to the vinyl group in the side chain increases.
本発明の難燃性樹脂組成物は、前記〔A〕成分1モル当
り、前記CB)成分0.5〜1モルの割合で、触媒の存
在下に加熱反応することによって得ることができる。The flame-retardant resin composition of the present invention can be obtained by carrying out a heating reaction in the presence of a catalyst at a ratio of 0.5 to 1 mole of the component (CB) per 1 mole of the component [A].
この(B)成分の使用割合が、使用する〔A〕成分1モ
ル当り0.5モル未満であると、得られる組成物の保存
安定性が低下し、一方、〔A〕成分1モル当り1モルを
超えると、未反応のCB)成分が多くなるので好ましく
ない。If the proportion of component (B) used is less than 0.5 mol per mol of component [A] used, the storage stability of the resulting composition will decrease; If the amount exceeds the molar amount, the amount of unreacted CB) component increases, which is not preferable.
前記加熱反応は、通常、溶媒の存在下で行うのが望まし
い。使用する触媒としては、反応生成物を均一に溶解す
るなど溶解性に優れ、触媒活性に支障のないものであれ
ば特に限定するものではない。The heating reaction is usually preferably carried out in the presence of a solvent. The catalyst to be used is not particularly limited as long as it has excellent solubility, such as uniformly dissolving the reaction product, and does not interfere with the catalytic activity.
具体的には、たとえば、ベンゼン、トルエン、キシレン
などの芳香族炭化水素類、クロロベンゼン、ジクロロベ
ンゼンなどのハロゲン化芳香族炭化水素類などを挙げる
ことができる。Specific examples include aromatic hydrocarbons such as benzene, toluene, and xylene, and halogenated aromatic hydrocarbons such as chlorobenzene and dichlorobenzene.
前記触媒しては、たとえば、有機アミン類、イミダゾー
ル類、4級アンモニウム塩、4級ホスホニウム塩などの
4級オニウム塩類、アルカリ金属のアルコラート類など
を挙げることができる。Examples of the catalyst include organic amines, imidazoles, quaternary onium salts such as quaternary ammonium salts and quaternary phosphonium salts, and alkali metal alcoholates.
前記有機アミン類としては、たとえば、トリエチルアミ
ン、トリプロピルアミン、トリブチルアミンなど3級ア
ルキルアミン類;ジエチルアミン、ジブチルアミンなど
の2級アルキルアミン類;エチルアミン、プロピルアミ
ン、ブチルアミン、ペンチルアミン、シクロヘキシルア
ミンなどの1級アルキルアミン類;アニリン、N−メチ
ルアニリン、N、N−ジメチルアミンなどの芳香族アミ
ン類;ピリジン、ルチジン、ピコリンなどのヘテロ環系
アミン類などを挙げることができ、これらの中でも、た
とえば3級アミン類、ヘテロ環アミン類などが好適に使
用できる。Examples of the organic amines include tertiary alkylamines such as triethylamine, tripropylamine, and tributylamine; secondary alkylamines such as diethylamine and dibutylamine; and ethylamine, propylamine, butylamine, pentylamine, and cyclohexylamine. Primary alkylamines; aromatic amines such as aniline, N-methylaniline, and N,N-dimethylamine; heterocyclic amines such as pyridine, lutidine, and picoline; among these, for example, Tertiary amines, heterocyclic amines, etc. can be suitably used.
前記イミダゾール類としては、たとえば、イミダゾール
、2−エチルイミダゾール、2−メチルイミダゾール、
4−エチルイミダゾール、2,4−ジメチルイミダゾー
ル、2−エチル−4−メチルイミダゾールなどのアルキ
ルイミダゾール類を挙げることができ、これらの中でも
、たとえば、2−エチル−4−メチルイミダゾールなど
のアルキルイミダゾールが好適に使用できる。Examples of the imidazole include imidazole, 2-ethylimidazole, 2-methylimidazole,
Alkylimidazoles such as 4-ethylimidazole, 2,4-dimethylimidazole, and 2-ethyl-4-methylimidazole can be mentioned, and among these, for example, alkylimidazoles such as 2-ethyl-4-methylimidazole are preferred. It can be used suitably.
前記4級アンモニウム塩としては、たとえば、テトラメ
チルアンモニウムクロリド、テトラエチルアンモニウム
クロリド、などのテトラアルキルアンモニウムハライド
などが好適に使用できる。As the quaternary ammonium salt, for example, tetraalkylammonium halides such as tetramethylammonium chloride, tetraethylammonium chloride, etc. can be suitably used.
前記4級ホスホニウム塩としては、たとえば、テトラエ
チルホスホニウムクロリドなどのテトラアルキルホスホ
ニウムハライドなどを挙げることができる。前記アルカ
リ金属アルコラートBとしては、たとえば、メタノール
・、エタノール、プロパツール、ブタノール、ペンタノ
ール、ヘキサノール、シクロヘキサノール、オフタノー
ルなどのアルコールあるいはフェノール、クレゾールな
どのフェノールのアルカリ金属塩などを挙げることがで
きる。なお、アルカリ金属としては、リチウム、ナトリ
ウム、カリウムなどを挙げることができ、中でもすl・
リウム、カリウム等が好適である。Examples of the quaternary phosphonium salt include tetraalkylphosphonium halides such as tetraethylphosphonium chloride. Examples of the alkali metal alcoholate B include alcohols such as methanol, ethanol, propatool, butanol, pentanol, hexanol, cyclohexanol, and ofthanol, or alkali metal salts of phenols such as phenol and cresol. . In addition, examples of alkali metals include lithium, sodium, potassium, etc.
Preferred are lium, potassium, and the like.
前記加熱反応の条件としては、用いる触媒の種類、使用
量、前記〔A〕成分や(B)成分の種類や使用割合など
の他の条件によって異なるので一様に規定できないが、
たとえば、反応温度を通常50〜200℃程度、好まし
くは80〜150程度の範囲とし、反応圧力は常圧とし
、反応時間を2〜5時間程度とするのが好適である。The conditions for the heating reaction cannot be uniformly defined because they vary depending on other conditions such as the type of catalyst used, the amount used, and the type and usage ratio of the [A] component and (B) component.
For example, it is preferable that the reaction temperature is usually about 50 to 200°C, preferably about 80 to 150°C, the reaction pressure is normal pressure, and the reaction time is about 2 to 5 hours.
触媒の使用割合としては、使用する触媒の種類、反応条
件、使用する〔A〕成分やCB)成分の種類や割合など
によって異なるので一様に規定できないが、たとえば、
使用する〔A〕成分100重量部当り、通常0.1〜1
重量部程度、好ましくは、0.1〜0.5重量部程度と
するのが好適である。The proportion of the catalyst to be used cannot be uniformly defined as it varies depending on the type of catalyst used, the reaction conditions, the type and proportion of the [A] component and CB) component used, etc., but, for example,
Usually 0.1 to 1 per 100 parts by weight of component [A] used
The amount is preferably about 0.1 to 0.5 parts by weight.
以上のようにして、加熱反応せしめた後、使用溶媒、使
用触媒を必要な程度、留去するなどして本発明の燃焼性
樹脂組成物を得ることができる。After carrying out the heating reaction as described above, the solvent and catalyst used can be distilled off to a necessary extent to obtain the combustible resin composition of the present invention.
このようにして得られた本発明の燃焼性樹脂組成物は、
たとえば、フェノール樹脂、エポキシ樹脂、ポリエステ
ル樹脂、ポリエチレン樹脂、ポリスチレン樹脂、ポリプ
ロピレン樹脂、ABS樹脂、メタクリル樹脂、アクリル
樹脂、ポリアミド樹脂等の様々な可燃性高分子樹脂材料
等の燃焼化剤として好適に使用することができる。The combustible resin composition of the present invention thus obtained is
For example, it is suitably used as a combustion agent for various flammable polymer resin materials such as phenol resin, epoxy resin, polyester resin, polyethylene resin, polystyrene resin, polypropylene resin, ABS resin, methacrylic resin, acrylic resin, polyamide resin, etc. can do.
また、本発明の燃焼性樹脂組成物は、樹脂を燃焼化する
だけでなく、樹脂の加とう化にも効果を示すものであり
、特に燃焼化と同時に可とう化が要求されるフェノール
樹脂に対して好適に利用できる。In addition, the flammable resin composition of the present invention not only combusts the resin, but also has the effect of increasing the stiffness of the resin, and is particularly effective for phenolic resins, which are required to be flammable and flexible at the same time. It can be suitably used for
(実施例1)
査底貫
テトラブロモビスフェノールAジグリシジルエーテルの
60%トルエン溶液550g、α、ω−ポリブタジエン
ジカルボン酸(数平均分子量1300.1,2−ポリブ
タジェン成分85%)390g、2−エチル−4−メチ
ルイミタゾール0.55gを21の4日フラスコに導入
し、110℃で3時間反応させた。反応後冷却し、黄色
透明な粘稠液体を得た。(Example 1) 550 g of a 60% toluene solution of Kasudkan tetrabromobisphenol A diglycidyl ether, 390 g of α,ω-polybutadiene dicarboxylic acid (number average molecular weight 1300.1,2-polybutadiene component 85%), 2-ethyl- 0.55 g of 4-methylimitazole was introduced into a No. 21 4-day flask and reacted at 110° C. for 3 hours. After the reaction was cooled, a yellow transparent viscous liquid was obtained.
反応生成物のHLCチャートを第1図に、脱溶媒後のI
Rチャートを第2図に示す。The HLC chart of the reaction product is shown in Figure 1.
The R chart is shown in FIG.
フェノール樹脂系ベースワニスの製造例メタクレゾール
3000 g、桐油2000 g。Production example of phenolic resin base varnish: 3000 g of metacresol, 2000 g of tung oil.
パラトルエンスルホン酸2gを混合し、100gで1時
間反応させた。次いでこの反応液にフェノール750g
、80%パラホルムアルデヒド1400g、25%アン
モニア水100gを加えた後、80℃で3時間反応させ
た。縮合水を留去し、反応液の160℃の熱板上でのゲ
ルタイムが3分になった点を終点とし、ベースワニスと
した。2 g of para-toluenesulfonic acid was mixed and 100 g was reacted for 1 hour. Next, 750 g of phenol was added to this reaction solution.
, 1400 g of 80% paraformaldehyde, and 100 g of 25% aqueous ammonia were added, and the mixture was reacted at 80° C. for 3 hours. The condensed water was distilled off, and the end point was the point at which the gel time of the reaction solution on a hot plate at 160° C. reached 3 minutes, and a base varnish was obtained.
難燃化樹脂組成物配合ワニスの調製側
上記製造例で得たベースワニス1500gに、上記合成
例で得た反応生成物600gを加え均一に混合溶解させ
、難燃化配合フェスを得た。Preparation of varnish containing flame retardant resin composition To 1500 g of the base varnish obtained in the above production example, 600 g of the reaction product obtained in the above synthesis example was added and uniformly mixed and dissolved to obtain a flame retardant compound face.
問茄改L141口ら綽り戊狡開
上記ベースワニスおよび配合ワニスをそれぞれ、160
℃の熱板上でBステージ状態まで硬化させた。これら樹
脂を粉砕した後、それぞれ1.6 mmのスペーサをは
さんだ、ステンレス板を用いて、100kg/cniの
圧力下、170℃で100分加熱成形し、樹脂板を得た
。得られた樹脂板の特性をJIs−に−6911に準じ
て測定した。結果を第1表に示す。160% of the above base varnish and blended varnish.
It was cured to a B-stage state on a hot plate at .degree. After pulverizing these resins, they were heat-molded at 170° C. for 100 minutes under a pressure of 100 kg/cni using stainless steel plates with 1.6 mm spacers in between to obtain resin plates. The properties of the obtained resin plate were measured according to JIs-6911. The results are shown in Table 1.
(比較例1)
実施例1で製造したベースワニス1500gに、テトラ
ブロモビスフェノールAジグクシジルエーテル300g
加え均一に混合溶解させ配合フェスを得た。(Comparative Example 1) 300 g of tetrabromobisphenol A digucidyl ether was added to 1500 g of the base varnish produced in Example 1.
In addition, the mixture was uniformly mixed and dissolved to obtain a blended face.
この配合フェスを用い実施例1の作製例と同様にして樹
脂板を得て実施例1と同様の試験を実施した。結果を第
1表に示す。Using this blending face, a resin plate was obtained in the same manner as in the production example of Example 1, and the same tests as in Example 1 were conducted. The results are shown in Table 1.
(比較例2)
実施例1で製造したベースワニス1500gにヘキサブ
ロモジフェニルエーテル200g、トリフェニルフォス
フェート100gを加え均一に混合溶解させ、配合ワニ
スを得た。以下、実施例1の作製例と試験例と同様にし
て実施した。結果第1表に示す。(Comparative Example 2) 200 g of hexabromodiphenyl ether and 100 g of triphenyl phosphate were added to 1500 g of the base varnish produced in Example 1 and mixed and dissolved uniformly to obtain a blended varnish. The following was carried out in the same manner as the production example and test example of Example 1. The results are shown in Table 1.
(以下余白)
〔発明の効果〕
第1表の結果から明らかなように、本発明の難燃性樹脂
組成物は、樹脂の緒特性を低下させることなく難燃化す
ることができ、特にフェノール樹脂等の可とう化が要求
される樹脂に対して、難燃性と同様に可とう性を著しく
向上することができるといった実用上著しく有利な難燃
化樹脂組成物を提供することができる。(The following is a blank space) [Effects of the Invention] As is clear from the results in Table 1, the flame-retardant resin composition of the present invention can be made flame-retardant without deteriorating the resin properties, and in particular, phenol For resins that require flexibility, such as resins, it is possible to provide a flame-retardant resin composition that is extremely advantageous in practice and can significantly improve flexibility as well as flame retardancy.
第1図は、実施例1の合成例で合成した難燃性樹脂組成
物(トルエン溶液)のT HF展開溶剤によるHLC(
液体クロマトグラフィー)チャートを示す。
第2図は、実施例1の合成例で合成した難燃性樹脂組成
物(脱溶媒後)のIR(赤外吸収スペクトル)チャート
を示す。
符号の説明
1 トルエン
2 テトラブロモビスフェノールAジグリシジルエーテ
ル(TBBG)
3 α、ω−ポリブタジェンジカルボン酸4 7BBG
とPBの反応物
オトエ鴫簡 (ガウpトt)
第111
返衣(C醒1)
第2図
手続補正書(鮫)Figure 1 shows HLC (
Liquid chromatography) chart is shown. FIG. 2 shows an IR (infrared absorption spectrum) chart of the flame-retardant resin composition (after solvent removal) synthesized in the synthesis example of Example 1. Explanation of symbols 1 Toluene 2 Tetrabromobisphenol A diglycidyl ether (TBBG) 3 α, ω-polybutadiene dicarboxylic acid 4 7BBG
and PB reactant otoe shogi (Gaupt) No. 111 Return of clothing (C-1) Figure 2 Procedure amendment (Shark)
Claims (1)
化学式、表等があります▼(ここで、kおよびjは、 それぞれ0〜4の整数を表し、かつk+j≧1である。 )、▲数式、化学式、表等があります▼、−SO_2、
−S−、−O−、▲数式、化学式、表等があります▼ま
たは■CH_2■_w(ただし、wは、0〜10の整数
を表す。)を表し、lおよびmは、それぞれ0〜4の整
数を表し、かつl+m≧1である。なお、Xは、互いに
同一の種類であっても異なった種類であってもよい。〕 または一般式( I b) ▲数式、化学式、表等があります▼( I b) 〔ただし、式中、Xはハロゲン原子を表し、nは、1か
ら4の整数を表す。なお、Xは互いに同一の種類であっ
ても異なった種類であってもよい。〕 で表される1種または2種以上の化合物1モル当り、 〔B〕一般式(II) HOOC■Z■_t■Q■_p−COOH(II)〔ただ
し、式中、Zは、つぎの繰り返し単位−CH_2−CH
=CH−CH_2− を表し、Qは次の繰り返し単位 ▲数式、化学式、表等があります▼ を表し、tおよびpは、0以上の整数を表し、かつ、t
+p≧1であり、ZとQの配列は、ランダムであって、
交互であっても、ブロックであってもよい。〕 で表されるα,ω−ポリブタジエンジカルボン酸0.1
〜1モルを触媒の存在下、加熱反応させることによって
得られることを特徴とする難燃性樹脂組成物。 2、触媒が、有機アミン類、イミダゾール類、4級オニ
ウム塩類、アルカリ金属アルコラート類である特許請求
の範囲第1項記載の難燃性樹脂組成物。 3、前記(A)成分として用いる化合物が、テトラブロ
モビスフェールAのジグリシジルエーテルである特許請
求の範囲第1項または第2項記載の難燃性樹脂組成物。 4、前記一般式(II)で表される化合物の数平均分子量
が、300〜2000の範囲内であり、かつ繰り返し単
位ZとQの割合が、t:p=5〜100:95〜0であ
る特許請求の範囲第1項、第2項または第3項記載の難
燃性樹脂組成物。[Claims] 1. [A] General formula (Ia) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(Ia) [However, in the formula, X represents a halogen atom, ▲Mathematical formula,
There are chemical formulas, tables, etc.▼ (Here, k and j each represent an integer from 0 to 4, and k+j≧1.), ▲There are mathematical formulas, chemical formulas, tables, etc.▼, -SO_2,
-S-, -O-, ▲Mathematical formulas, chemical formulas, tables, etc.▼ or ■CH_2■_w (however, w represents an integer from 0 to 10), l and m are each 0 to 4 represents an integer, and l+m≧1. Note that X may be of the same type or different types. ] Or general formula (I b) ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (I b) [However, in the formula, X represents a halogen atom, and n represents an integer from 1 to 4. Note that X may be of the same type or of different types. [B] General formula (II) HOOC■Z■_t■Q■_p-COOH (II) [However, in the formula, Z is Repeating unit -CH_2-CH
=CH-CH_2-, Q represents the following repeating unit ▲There are mathematical formulas, chemical formulas, tables, etc.▼, t and p represent integers greater than or equal to 0, and t
+p≧1, and the arrangement of Z and Q is random,
It may be alternate or block. ] α,ω-polybutadiene dicarboxylic acid represented by 0.1
1. A flame-retardant resin composition obtained by subjecting 1 mol of mol of mol of chloride to a heating reaction in the presence of a catalyst. 2. The flame-retardant resin composition according to claim 1, wherein the catalyst is an organic amine, an imidazole, a quaternary onium salt, or an alkali metal alcoholate. 3. The flame-retardant resin composition according to claim 1 or 2, wherein the compound used as the component (A) is diglycidyl ether of tetrabromobisphal A. 4. The number average molecular weight of the compound represented by the general formula (II) is within the range of 300 to 2000, and the ratio of repeating units Z and Q is t:p = 5 to 100:95 to 0. A flame-retardant resin composition according to claim 1, 2, or 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26425387A JPH01108220A (en) | 1987-10-20 | 1987-10-20 | Flame-retarding resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26425387A JPH01108220A (en) | 1987-10-20 | 1987-10-20 | Flame-retarding resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01108220A true JPH01108220A (en) | 1989-04-25 |
Family
ID=17400607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26425387A Pending JPH01108220A (en) | 1987-10-20 | 1987-10-20 | Flame-retarding resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01108220A (en) |
-
1987
- 1987-10-20 JP JP26425387A patent/JPH01108220A/en active Pending
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